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    Compliant spray flux masks, systems, and methods
    6.
    发明授权
    Compliant spray flux masks, systems, and methods 有权
    符合喷雾通量掩模，系统和方法

    公开(公告)号：US08308047B2

    公开(公告)日：2012-11-13

    申请号：US11612652

    申请日：2006-12-19

    申请人： Joel Williams ,  Sonny J. Randall ,  Steven B. Roach ,  Sabina J. Houle

    发明人： Joel Williams ,  Sonny J. Randall ,  Steven B. Roach ,  Sabina J. Houle

    IPC分类号： B23K1/20 ,  B05C5/02 ,  B05C17/06

    CPC分类号： H05K3/3489 ,  B23K1/203 ,  B23K2101/40 ,  H05K2203/0557 ,  H05K2203/1366

    摘要： A flux spray head, a mask, and an integrated circuit substrate are arranged in a flux spray station to reduce flux overspray during a spraying operation. A support element within the spray station is used to align the substrate with the mask and spray head. A portion of the mask contacts the substrate along a boundary between a region to be sprayed and a region to be masked. The flux spray head sprays the substrate while a portion of the mask is in contact with the boundary of the region to be masked. In an embodiment, the mask may comprise one or more replaceable non-stick stencil elements and associated springs to press the stencil elements against the substrate. Each stencil element may have a wall to contact the substrate along a portion of the boundary.

    摘要翻译： 焊剂喷射头，掩模和集成电路基板布置在焊剂喷射站中以在喷涂操作期间减少焊剂过量喷射。 喷雾站内的支撑元件用于将基底与掩模和喷头对准。 掩模的一部分沿着待喷射区域和待掩蔽区域之间的边界接触基板。 助焊剂喷头喷射衬底，同时掩模的一部分与待掩蔽区域的边界接触。 在一个实施例中，掩模可以包括一个或多个可替换的不粘模版元件和相关联的弹簧，以将模版元件压靠在基底上。 每个模板元件可以具有沿着边界的一部分接触基板的壁。

    Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method
    7.
    发明授权
    Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method 有权
    使用集成散热器加强板和根据该方法形成的微电子封装制造微电子封装的方法

    公开(公告)号：US08067256B2

    公开(公告)日：2011-11-29

    申请号：US11864279

    申请日：2007-09-28

    申请人： Sabina J. Houle ,  James P. Mellody

    发明人： Sabina J. Houle ,  James P. Mellody

    IPC分类号： H01L21/00

    CPC分类号： H01L23/36 ,  H01L21/563 ,  H01L23/4334 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2924/00

    摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel; mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel; and singulating the combination to yield a plurality of microelectronic packages, each of the packages including: an IHS component of the IHS panel, one of the plurality IC dies bonded and thermally coupled to said IHS component and one of the plurality of package substrates, said IHS component and said one of the plurality of IC dies being mounted to said one of the plurality of package substrates to form said each of the packages.

    摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生携带芯片的IHS面板; 将带芯片的IHS面板安装到包括多个封装衬底的衬底面板上，以产生包括安装到衬底面板的芯片承载IHS面板的组合; 并且单独组合以产生多个微电子封装，每个封装包括：IHS面板的IHS部件，所述多个IC管芯中的一个结合并热耦合到所述IHS部件和所述多个封装基板中的一个，所述多个封装基板中的一个 IHS组件，并且所述多个IC管芯中的所述一个安装到所述多个封装衬底中的所述一个，以形成所述每个封装。

    Injection molded metal stiffener for packaging applications
    8.
    发明授权
    Injection molded metal stiffener for packaging applications 有权
    注塑金属加强筋用于包装应用

    公开(公告)号：US08013439B2

    公开(公告)日：2011-09-06

    申请号：US12165358

    申请日：2008-06-30

    申请人： Sabina J. Houle

    发明人： Sabina J. Houle

    IPC分类号： H01L23/34

    CPC分类号： H01L23/16 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/19 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00

    摘要： In some embodiments, an injection molded metal stiffener for packaging applications is presented. In this regard, an apparatus is introduced comprising a microelectronic device package substrate, a microelectronic device coupled with a top surface of the package substrate, and an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and at least partially surrounds the microelectronic device. Other embodiments are also disclosed and claimed.

    摘要翻译： 在一些实施例中，提供了用于包装应用的注射成型金属加强件。 在这方面，引入了包括微电子器件封装衬底，与封装衬底的顶表面耦合的微电子器件以及与封装衬底耦合的注射成型的金属加强件的装置，其中加强件包括中心开口和 至少部分地围绕微电子器件。 还公开并要求保护其他实施例。