-
公开(公告)号：US20120078570A1
公开(公告)日：2012-03-29
申请号：US13238767
申请日：2011-09-21
IPC分类号： G06F15/00
CPC分类号： G06F1/1694 , G01C19/58 , G01C21/10 , G01P15/18 , G06F1/1626 , G06F2200/1637
摘要： Systems and methods for approximating angular velocity using a plurality of accelerometers are disclosed. In particular, in one embodiment, a method of approximating angular velocity including receiving linear acceleration information from a plurality of accelerometers and calculating a relative acceleration for at least one pair of the plurality of accelerometers is disclosed. The method includes obtaining a distance value for the at least one pair of the plurality of accelerometers and approximating the angular velocity by multiplying the distance value by the relative acceleration to obtain.
摘要翻译： 公开了使用多个加速度计近似角速度的系统和方法。 特别地，在一个实施例中，公开了一种近似角速度的方法，包括从多个加速度计接收线性加速度信息并计算至少一对多个加速度计的相对加速度。 该方法包括获得多个加速度计中的至少一对加速度计的距离值，并通过将距离值乘以相对加速度来获得角速度近似。
-
公开(公告)号：US08515113B2
公开(公告)日：2013-08-20
申请号：US12859711
申请日：2010-08-19
IPC分类号： H04R9/08
CPC分类号： H04R1/02 , H04R31/00 , H04R2499/11 , Y10T29/49005
摘要： A microphone assembly for an electronic device is described. The microphone assembly can include a microphone, a microphone boot and a printed circuit board. The microphone boot can be a composite microphone boot that is formed from multiple materials. A hardness of the each of the materials used in the microphone boot can be selected to improve sealing integrity and reduce shock transmission. In one embodiment, the composite microphone boot can be formed using a double-shot injection molding process.
摘要翻译： 描述了一种用于电子设备的麦克风组件。 麦克风组件可以包括麦克风，麦克风套管和印刷电路板。 麦克风引导可以是由多种材料形成的复合麦克风引导。 可以选择麦克风罩中使用的每种材料的硬度，以改善密封完整性并减少冲击传播。 在一个实施例中，可以使用双注射成型工艺来形成复合麦克风罩。
-
公开(公告)号：US08477492B2
公开(公告)日：2013-07-02
申请号：US12859712
申请日：2010-08-19
CPC分类号： H05K7/1427 , G06F1/1626 , G06F1/1658 , G06F1/181 , H05K1/0281 , H05K1/189 , H05K2201/056 , Y10T29/49155
摘要： Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied.
摘要翻译： 描述了可用于便携式计算设备中的用于形成PCB的方法。 PCB可以以弯曲的配置安装在便携式计算设备中。 在特定实施例中，连续形成的PCB可以被成形为具有连接薄连接器部分的两个大区域。 薄连接器部分可以连接两个大区域中的每一个的组件，并且可以用来代替柔性连接器。 在一个实施例中，PCB可以由包括迹线和衬底层的多个层形成。 可以调整迹线和基底层以影响各个区域中PCB的刚度，例如在施加弯矩之后允许PCB保持弯曲构型。
-
公开(公告)号：US08427379B2
公开(公告)日：2013-04-23
申请号：US12859701
申请日：2010-08-19
IPC分类号： H01Q1/24
CPC分类号： H01Q1/243 , Y10T29/49016
摘要： A modular material antenna assembly is provided that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then mechanically secured to the antenna block. The antenna flex may also be electrically connected to a circuit board. The frame is designed to support a cover glass for the portable electronic device and may be affixed to a housing. The dielectric constant of the antenna block is substantially less than the dielectric constant of the frame.
摘要翻译： 提供了一种模块化材料天线组件，其包括天线块，天线块具有与非导电性框架的相应部分互锁的形状的部分，并将天线块固定到非导电框架。 电非导电框架附接到导电外壳的内部，使得非导电框架和导电壳体形成一体的结构。 然后将天线弯曲机构地固定到天线块。 天线弯曲部也可以电连接到电路板。 框架被设计成支撑用于便携式电子设备的盖玻片并且可以固定到壳体。 天线块的介电常数基本上小于框架的介电常数。
-
公开(公告)号：US20120046780A1
公开(公告)日：2012-02-23
申请号：US12859711
申请日：2010-08-19
CPC分类号： H04R1/02 , H04R31/00 , H04R2499/11 , Y10T29/49005
摘要： A microphone assembly for an electronic device is described. The microphone assembly can include a microphone, a microphone boot and a printed circuit board. The microphone boot can be a composite microphone boot that is formed from multiple materials. A hardness of the each of the materials used in the microphone boot can be selected to improve sealing integrity and reduce shock transmission. In one embodiment, the composite microphone boot can be formed using a double-shot injection molding process.
摘要翻译： 描述了一种用于电子设备的麦克风组件。 麦克风组件可以包括麦克风，麦克风套管和印刷电路板。 麦克风引导可以是由多种材料形成的复合麦克风引导。 可以选择麦克风罩中使用的每种材料的硬度，以改善密封完整性并减少冲击传播。 在一个实施例中，复合麦克风罩可以使用双注射成型工艺形成。
-
公开(公告)号：US20110279961A1
公开(公告)日：2011-11-17
申请号：US12780715
申请日：2010-05-14
CPC分类号： G06F1/1656 , F16F7/1028 , F16F7/104 , F16F7/108 , G06F1/1626 , G06F1/1637 , G06F1/181 , G06F3/0412 , G06F3/044 , G06F2200/1637 , H05K5/0017 , H05K5/03 , H05K5/06 , Y10T29/49002
摘要： Apparatus, systems and methods for shock mounting glass for an electronic device are disclosed. The glass for the electronic device can provide an outer surface for at least a portion of a housing for the electronic device. In one embodiment, the shock mounting can provide a compliant interface between the glass and the electronic device housing. In another embodiment, the shock mounting can provide a mechanically actuated retractable. For example, an outer glass member for an electronic device housing can be referred to as cover glass, which is often provided at a front surface of the electronic device housing.
摘要翻译： 公开了用于电子设备的用于冲击安装玻璃的装置，系统和方法。 用于电子设备的玻璃可以为电子设备的壳体的至少一部分提供外表面。 在一个实施例中，冲击安装可以在玻璃和电子设备壳体之间提供柔顺的界面。 在另一个实施例中，冲击安装可以提供机械致动的可缩回。 例如，用于电子设备外壳的外玻璃构件可以被称为盖玻璃，其通常设置在电子设备外壳的前表面处。
-
公开(公告)号：US08634204B2
公开(公告)日：2014-01-21
申请号：US12859694
申请日：2010-08-19
IPC分类号： H01R12/16
CPC分类号： H01L23/552 , G06F1/1626 , G06F1/1684 , H01L23/5387 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/81801 , H01L2225/06558 , H01L2225/06572 , H01L2225/06593 , H01L2924/14 , H01L2924/1434 , H01L2924/1438 , H01Q1/243 , H01Q1/526 , H04R3/00 , H04R2499/11 , H05K1/0215 , H05K1/189 , H05K2201/042 , H05K2201/10159 , H05K2201/10371 , Y10T29/49117 , H01L2924/00
摘要： A memory unit for a computing device is described. The memory device can include a number of memory chips, such as flash nand chips, linked together via a flexible circuit connector. During installation of the memory device, portions of the flexible circuit connector can be bent or folded in different locations to allow an orientation of the memory chips to be changed relative to one another. In one embodiment, a memory device with a number of chips can be provided in a flat configuration and then can be folded to allow the chips to be installed in a stacked configuration. In another embodiment, the flexible circuit connector can be grounded to other conductive components to allow the flexible circuit connector to be used as part of a faraday cage surrounding the memory chips.
摘要翻译： 描述了用于计算设备的存储器单元。 存储器件可以包括通过柔性电路连接器连接在一起的多个存储器芯片，例如闪存芯片。 在安装存储器件期间，柔性电路连接器的部分可以在不同的位置被弯曲或折叠，以允许存储器芯片的取向相对于彼此改变。 在一个实施例中，具有多个芯片的存储器件可以以平坦配置提供，然后可以被折叠以允许将芯片安装在堆叠配置中。 在另一个实施例中，柔性电路连接器可以接地到其它导电部件，以允许柔性电路连接器用作围绕存储器芯片的法拉第笼的一部分。
-
公开(公告)号：US08305744B2
公开(公告)日：2012-11-06
申请号：US12780715
申请日：2010-05-14
IPC分类号： G06F1/16
CPC分类号： G06F1/1656 , F16F7/1028 , F16F7/104 , F16F7/108 , G06F1/1626 , G06F1/1637 , G06F1/181 , G06F3/0412 , G06F3/044 , G06F2200/1637 , H05K5/0017 , H05K5/03 , H05K5/06 , Y10T29/49002
摘要： Apparatus, systems and methods for shock mounting glass for an electronic device are disclosed. The glass for the electronic device can provide an outer surface for at least a portion of a housing for the electronic device. In one embodiment, the shock mounting can provide a compliant interface between the glass and the electronic device housing. In another embodiment, the shock mounting can provide a mechanically actuated retractable. For example, an outer glass member for an electronic device housing can be referred to as cover glass, which is often provided at a front surface of the electronic device housing.
摘要翻译： 公开了用于电子设备的用于冲击安装玻璃的装置，系统和方法。 用于电子设备的玻璃可以为电子设备的壳体的至少一部分提供外表面。 在一个实施例中，冲击安装可以在玻璃和电子设备壳体之间提供柔顺的界面。 在另一个实施例中，冲击安装可以提供机械致动的可缩回。 例如，用于电子设备外壳的外玻璃构件可以被称为盖玻璃，其通常设置在电子设备外壳的前表面处。
-
公开(公告)号：US20120044637A1
公开(公告)日：2012-02-23
申请号：US12859712
申请日：2010-08-19
CPC分类号： H05K7/1427 , G06F1/1626 , G06F1/1658 , G06F1/181 , H05K1/0281 , H05K1/189 , H05K2201/056 , Y10T29/49155
摘要： Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied.
摘要翻译： 描述了可用于便携式计算设备中的用于形成PCB的方法。 PCB可以以弯曲的配置安装在便携式计算设备中。 在特定实施例中，连续形成的PCB可以被成形为具有连接薄连接器部分的两个大区域。 薄连接器部分可以连接两个大区域中的每一个的组件，并且可以用来代替柔性连接器。 在一个实施例中，PCB可以由包括迹线和衬底层的多个层形成。 可以调整迹线和基底层以影响各个区域中PCB的刚度，例如在施加弯矩之后允许PCB保持弯曲构型。
-
公开(公告)号：US08391010B2
公开(公告)日：2013-03-05
申请号：US12859702
申请日：2010-08-19
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , G06F1/1626 , G06F1/1658 , G06F1/203 , H04M1/026 , H04M1/0266 , H04M1/0274 , H04M1/185 , H05K7/20445 , Y10T29/49002
摘要： A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.
-
-
-
-
-
-
-
-
-
搜索结果
23 条记录 (耗时 0.029 秒)
