Metropolitan area type optical telecommunications network comprising a ring type core
    1.
    发明授权
    Metropolitan area type optical telecommunications network comprising a ring type core 有权
    包括环型核心的城域型光通信网络

    公开(公告)号:US07340176B2

    公开(公告)日:2008-03-04

    申请号:US10391641

    申请日:2003-03-20

    IPC分类号: H04J14/02

    摘要: An optical telecommunications network (1000), of metropolitan area type, having a ring type core (10), and secondary rings (41, 42; 43, 44). In each sending access node (11), transmitters (111) for sending information-carrying optical signals use a wavelength belonging to a group of wavelengths dedicated to the secondary ring (41, 42) to which this sending access node (11) is connected. In each destination access node (21), receivers (212) are capable of receiving all the wavelengths used by sending nodes (11) of the network. Communication nodes (1, 2) comprise all-optical devices (100, 101, 10; 201, 20) for inserting, into the core fiber (10), optical signals sent by a sending access node connected to the communication nodes. Optical couplers (31, 32), for taking from the core fiber (10) a so-called representative signal formed of a fraction of the power of each information-carrying signal, are respectively coupled to the receivers of the destination nodes.

    摘要翻译: 一种具有环型芯(10)和二次环(41,42; 43,44)的城域型光通信网(1000)。 在每个发送接入节点(11)中,用于发送信息携带光信号的发射机(111)使用属于专用于该发送接入节点(11)所连接到的次环(41,42)的一组波长的波长 。 在每个目的地接入节点(21)中,接收机(212)能够接收由网络发送节点(11)使用的所有波长。 通信节点(1,2)包括用于将连接到通信节点的发送接入节点发送的光信号插入到核心光纤(10)中的全光学设备(100,101,10,20,20,20)。 用于从核心光纤(10)取出由每个信息携带信号的功率的一部分形成的所谓的代表信号的光耦合器(31,32)分别耦合到目的地节点的接收器。

    Method of assembling an optical module
    3.
    发明授权
    Method of assembling an optical module 失效
    组装光模块的方法

    公开(公告)号:US06233383B1

    公开(公告)日:2001-05-15

    申请号:US09292305

    申请日:1999-04-15

    IPC分类号: G02B626

    CPC分类号: G02B6/42 G02B6/30 G02B6/423

    摘要: A method is disclosed of assembling an optical module comprising at least two optical components whose waveguides are optically coupled to each other. Positioning one waveguide relative to the other one relies on two contact surfaces on the respective optical components cooperating with each other. A first contact surface includes a vertical bearing plane in the same horizontal plane as the optical axis of the waveguide of one of the optical components. A second contact surface includes a vertical bearing plane in the same horizontal plane as the optical axis of the waveguide of the other optical component.

    摘要翻译: 公开了一种组装光学模块的方法,该光学模块包括至少两个光学部件,其波导彼此光学耦合。 相对于另一个定位一个波导依赖于彼此协作的相应光学部件上的两个接触表面。 第一接触表面包括在与其中一个光学部件的波导的光轴相同的水平平面中的垂直轴承平面。 第二接触表面包括在与另一光学部件的波导的光轴相同的水平平面中的垂直轴承平面。

    Method of forming a layer of silica to be eliminated subsequently and
method for mounting an integrated optical component
    4.
    发明授权
    Method of forming a layer of silica to be eliminated subsequently and method for mounting an integrated optical component 失效
    随后形成待消除的二氧化硅层的方法和用于安装集成的光学部件的方法

    公开(公告)号:US5736429A

    公开(公告)日:1998-04-07

    申请号:US566122

    申请日:1995-12-01

    摘要: In a method for mounting an integrated optical component, a starting base structure includes a silica lower confinement layer and the cores of the future optical waveguides. This basic structure includes an alignment abutment so that a component to be mounted can be subsequently aligned with these waveguides. A silicon barrier layer is deposited on the abutment. Flame hydrolysis deposition is then used to deposit an upper silica layer to constitute the upper confinement layer of the waveguides. This silica layer also covers the alignment abutment, however. For this reason the region of the abutment is then etched by reactive ion etching to expose the abutment, which is protected from this etching by the barrier layer. The component to be mounted is then located relative to the abutment.

    摘要翻译: 在一种用于安装集成光学部件的方法中,起始基底结构包括二氧化硅下限制层和未来光波导的芯。 该基本结构包括对准基座,使得待安装的部件可随后与这些波导对准。 硅基阻挡层沉积在基台上。 然后使用火焰水解沉积沉积上部二氧化硅层以构成波导的上部约束层。 然而,该二氧化硅层也覆盖对准基座。 因此,通过反应离子蚀刻蚀刻邻接部分的区域以暴露抵抗物,该邻接物被阻挡层防止该蚀刻。 然后将要安装的部件相对于基台定位。

    Low-stress internal structure for optoelectronic housing
    7.
    发明授权
    Low-stress internal structure for optoelectronic housing 有权
    光电子室内低应力内部结构

    公开(公告)号:US06736554B2

    公开(公告)日:2004-05-18

    申请号:US10130700

    申请日:2002-05-22

    IPC分类号: G02B636

    CPC分类号: G02B6/421 G02B6/4239

    摘要: In an optoelectronic module (1) comprising a plastics material package (2) accommodating a base (8) fixed to the package (2) and supporting an optical component (9) coupled by an optical fiber (5) to an optical connector (4) of the package (2), fiber displacements associated with thermal stresses are avoided by mounting the base so that it floats on the package (2) and possibly the connector (4). The floating mounting of the base (8) is obtained by using for fixing the base one or more adhesives (13, 14) having a greater elasticity than the adhesives used to fix each of the two ends (6, 7) of the fiber (5) to the base (8) and the connector (4), respectively.

    摘要翻译: 一种光电子模块(1),包括一个容纳固定到封装(2)上的基座(8)的塑料材料封装(2),并支撑由光纤(5)耦合到光学连接器(4)的光学部件 ),通过安装基座使其浮在包装(2)上以及可能的连接器(4)上来避免与热应力相关的纤维位移。 基底(8)的浮动安装通过用于固定基底一个或多个具有比用于固定纤维的两个端部(6,7)中的每一个的粘合剂的弹性大的粘合剂(13,14)来获得( 5)分别连接到基座(8)和连接器(4)。

    Method of fabricating a component with crystalline silicon substrate
    8.
    发明授权
    Method of fabricating a component with crystalline silicon substrate 失效
    用晶体硅衬底制造组件的方法

    公开(公告)号:US06584807B1

    公开(公告)日:2003-07-01

    申请号:US08822642

    申请日:1997-03-24

    IPC分类号: C03B2000

    摘要: A method of fabricating a component having a crystalline silicon substrate includes the steps of depositing a layer of silica onto a crystalline silicon substrate, this silica layer being doped with dopants, and then treating the substrate. Before the doped silica layer is deposited, a barrier layer is formed on the substrate, consisting of a barrier material opposing diffusion of the dopants. The doped silica layer is deposited onto this barrier layer. The invention finds one particular application in connecting flat bundles of fibers in communication networks.

    摘要翻译: 制造具有晶体硅衬底的部件的方法包括以下步骤:在结晶硅衬底上沉积二氧化硅层,该二氧化硅层掺杂有掺杂剂,然后处理衬底。 在沉积掺杂二氧化硅层之前,在由与掺杂剂扩散相反的阻挡材料组成的衬底上形成阻挡层。 掺杂的二氧化硅层沉积在该阻挡层上。 本发明在通信网络中连接扁平的光纤束方面发现了一个特殊的应用。

    Hybrid optical module including an intermediate element
    9.
    发明授权
    Hybrid optical module including an intermediate element 失效
    混合光学模块包括中间元件

    公开(公告)号:US6093939A

    公开(公告)日:2000-07-25

    申请号:US28816

    申请日:1998-02-24

    CPC分类号: G02B6/42

    摘要: A hybrid optical device includes a passive component coupled optically to an active component, the passive component being formed in layers of silica on a substrate made of silica, the layers and the substrate thus forming a silica-on-silica structure. The hybrid optical device includes an intermediate element having good thermal conductivity and a coefficient of thermal expansion similar to that of the active component, wherein the active component is fixed to the intermediate element prior to insertion into the cavity, and the intermediate element is fixed to the structure so that the active component is located inside the cavity and is coupled optically to the passive component.

    摘要翻译: 混合光学器件包括光学耦合到有源部件的无源部件,被动部件由二氧化硅制成的衬底上的二氧化硅层形成,所述层和衬底由此形成二氧化硅 - 二氧化硅结构。 混合光学装置包括具有良好的导热性和类似于有源部件的热膨胀系数的中间元件,其中有源部件在插入空腔之前固定到中间元件,并且中间元件被固定到 所述结构使得所述有源部件位于所述腔内并且与所述被动部件光学耦合。

    Method of making a mark on a wafer such as a semiconductor wafer
incorporating a buried structure
    10.
    发明授权
    Method of making a mark on a wafer such as a semiconductor wafer incorporating a buried structure 失效
    在诸如包括掩埋结构的半导体晶片的晶片上制造标记的方法

    公开(公告)号:US5616522A

    公开(公告)日:1997-04-01

    申请号:US518274

    申请日:1995-08-23

    IPC分类号: H01L23/544 H01L21/027

    摘要: For end-to-end alignment of two optical waveguides one of which is in the form of a strip buried in a semiconductor wafer, a longitudinal lateral mark is used constituted by the flank of a valley etched in the wafer and self-aligned to the strip formed beforehand. To achieve this self-alignment a protection layer is deposited in the area in which the mark is to be formed, a register layer is deposited on top of the protection layer and a photosensitive resin is deposited on top of these layers and the substrate. First selective etching eliminates the register layer at the location of the valley of the mark. Second and third selective etching respectively etch the lateral channels of the strip and then the valley of the mark.

    摘要翻译: 对于两个光波导的端对准对准,其中一个波导是埋在半导体晶片中的条形,纵向横向标记由在晶片中蚀刻的谷的侧面构成,并与 预先形成条。 为了实现这种自对准,在要形成标记的区域中沉积保护层,在保护层的顶部上沉积对准层,并且在这些层和基底的顶部上沉积光敏树脂。 第一选择性蚀刻消除了标记谷的位置处的寄存层。 第二和第三选择性蚀刻分别蚀刻条带的横向通道,然后蚀刻标记的谷。