公开(公告)号：US3546493A

公开(公告)日：1970-12-08

申请号：US3546493D

申请日：1968-09-20

Applicant: GEN MOTORS CORP

Inventor： KAUPPILA JAMES E

IPC: G05F3/24 ,  H01L1/14

CPC classification number: G05F3/24

公开(公告)号：US3320651A

公开(公告)日：1967-05-23

申请号：US27028563

申请日：1963-04-03

Applicant: GEN MOTORS CORP

Inventor： KAUPPILA JAMES E ,  BOCKEMUEHL ROBERT R

IPC: H01L21/00 ,  H01L21/34 ,  H01L21/479 ,  H01L29/00 ,  H01L29/227

CPC classification number: H01L29/00 ,  H01L21/00 ,  H01L21/34 ,  H01L21/479 ,  H01L29/227

公开(公告)号：US3629669A

公开(公告)日：1971-12-21

申请号：US3629669D

申请日：1968-11-25

Applicant: GEN MOTORS CORP

Inventor： KAUPPILA JAMES E

IPC: H01L21/607 ,  H01L23/29 ,  H01L23/485 ,  H01L1/14 ,  H01L11/14

CPC classification number: H01L24/85 ,  H01L23/291 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48769 ,  H01L2224/49107 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/05042 ,  H01L2924/12036 ,  H01L2924/1306 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48669 ,  H01L2224/48744

Abstract: A semiconductive device is described in which electrical contact is made with the semiconductor surface through a rupture in an overlying frangible dielectric coating. Contact is achieved by forming an electrode pad on the semiconductor surface, coating the surface of the semiconductor and the electrode pad with a frangible layer of dielectric, forming a terminal connector contact pad on the dielectric coating over the electrode pad, rupturing the dielectric layer to communicate the pads, and bonding a terminal lead to the connector contact pad. In a preferred embodiment, the rupturing and bonding steps are simultaneously achieved by compression bonding a terminal wire to the connector contact pad.

公开(公告)号：US3287611A

公开(公告)日：1966-11-22

申请号：US13208361

申请日：1961-08-17

Applicant: GEN MOTORS CORP

Inventor： BOCKEMUEHL ROBERT R ,  KAUPPILA JAMES E

IPC: H01L29/00 ,  H01L29/80

CPC classification number: H01L29/00 ,  H01L29/80