公开(公告)号：US20170271285A1

公开(公告)日：2017-09-21

申请号：US15072655

申请日：2016-03-17

Applicant: GLOBALFOUNDRIES INC.

Inventor： Richard S. Graf ,  Kibby B. Horsford ,  Sudeep Mandal

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0332 ,  H01L2224/03464 ,  H01L2224/0362 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/0519 ,  H01L2224/0529 ,  H01L2224/05339 ,  H01L2224/05344 ,  H01L2224/05347 ,  H01L2224/05355 ,  H01L2224/0539 ,  H01L2224/05444 ,  H01L2224/05455 ,  H01L2224/05564 ,  H01L2224/05573 ,  H01L2224/05655 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1319 ,  H01L2224/94 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01005 ,  H01L2924/01015

Abstract: A conductive polymer-solder ball structure is provided. The conductive polymer-solder ball structure includes a wafer having at least one metal pad providing an electrical conductive path to a substrate layer, a conductive polymer pad located directly on the wafer over the at least one metal pad, an electrolessly plated layer located on a surface of the conductive polymer pad, and a solder ball located on a surface of the electrolessly plated layer.

公开(公告)号：US09496234B1

公开(公告)日：2016-11-15

申请号：US14741802

申请日：2015-06-17

Applicant: GLOBALFOUNDRIES INC.

Inventor： Richard S. Graf ,  Kibby B. Horsford ,  Sudeep Mandal

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L24/13 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/03828 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/1132 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13171 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/1339 ,  H01L2224/13444 ,  H01L2224/13455 ,  H01L2224/94 ,  H01L2924/00015 ,  H01L2924/381 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01023 ,  H01L2924/01074 ,  H01L2224/11334 ,  H01L2224/023 ,  H01L2224/03

Abstract: An integrated conductive polymer-solder ball structure is provided. The integrated conductive polymer-solder ball structure comprises a sputter seed layer applied to a wafer structure, one or more conductive polymer pad structures applied to the sputtered seed layer at locations on the wafer structure where one or more solder ball structures will be formed, an electroplating layer applied to portions of the one or more conductive polymer pad structures where a photoresist layer has been exposed, and a solder ball formed on each of the electroplating layers thereby forming the one or more solder ball structures.

Abstract translation: 提供了一种集成的导电聚合物 - 焊球结构。 集成导电聚合物 - 焊球结构包括施加到晶片结构的溅射籽晶层，在晶片结构上将形成一个或多个焊球结构的位置处施加到溅射种子层的一个或多个导电聚合物垫结构， 电镀层施加到已经暴露光致抗蚀剂层的一个或多个导电聚合物垫结构的部分，以及形成在每个电镀层上的焊球，从而形成一个或多个焊球结构。