公开(公告)号：US07327022B2

公开(公告)日：2008-02-05

申请号：US10248237

申请日：2002-12-30

申请人： Glenn Scott Claydon ,  Matthew Christian Nielsen ,  Samhita Dasgupta ,  Robert John Filkins ,  Glenn Alan Forman

发明人： Glenn Scott Claydon ,  Matthew Christian Nielsen ,  Samhita Dasgupta ,  Robert John Filkins ,  Glenn Alan Forman

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/29 ,  H01L23/02

CPC分类号： G02B6/4206 ,  G02B6/4214 ,  G02B6/43 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/00

摘要： A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip interconnection by microwave electrical, optical guided and unguided waves, and power or bias electrical contacts or interfaces by a novel chip in flexible circuit, rigid or inflexible embodiments.

摘要翻译： 一种新颖的微光学系统作为电气和光学互连的平台技术，电子，光电子，被动和有源组件的热和机械组装和集成。 该平台通过柔性电路，刚性或不灵活的实施例中的新型芯片提供了通过微波电，光引导和非导向波以及功率或偏置电触点或接口的光耦合和芯片到芯片互连。

公开(公告)号：US06935792B2

公开(公告)日：2005-08-30

申请号：US10065460

申请日：2002-10-21

申请人： Richard Joseph Saia ,  Thomas Bert Gorczyca ,  Christopher James Kapusta ,  Ernest Wayne Balch ,  Glenn Scott Claydon ,  Samhita Dasgupta ,  Eladio Clemente Delgado

发明人： Richard Joseph Saia ,  Thomas Bert Gorczyca ,  Christopher James Kapusta ,  Ernest Wayne Balch ,  Glenn Scott Claydon ,  Samhita Dasgupta ,  Eladio Clemente Delgado

IPC分类号： G02B6/12 ,  G02B6/122 ,  G02B6/138 ,  G02B6/42 ,  G02B6/00

CPC分类号： G02B6/122 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/1221 ,  G02B6/138 ,  G02B6/42 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/15153 ,  H01L2924/15192

摘要： An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

摘要翻译： 通过一种方法制造光电子封装，该方法包括：将光学器件定位在衬底主动侧的窗口内，顶部衬底表面上方和下方; 用光学聚合物材料填充窗户; 光学聚合物材料和基底的平坦化表面; 在光学聚合物材料和基底上形成波导材料以形成光学互连路径; 并且形成反射镜以将来自光学装置的光反射到互连路径; 以及形成通孔以暴露所述光学器件的接合焊盘。

公开(公告)号：US07508189B2

公开(公告)日：2009-03-24

申请号：US11733896

申请日：2007-04-11

申请人： Ertugrul Berkcan ,  Shankar Chandrasekaran ,  Christopher James Kapusta ,  Laura Jean Meyer ,  Glenn Scott Claydon ,  Debbie Gahaton Jones ,  Anis Zribi

发明人： Ertugrul Berkcan ,  Shankar Chandrasekaran ,  Christopher James Kapusta ,  Laura Jean Meyer ,  Glenn Scott Claydon ,  Debbie Gahaton Jones ,  Anis Zribi

IPC分类号： G01R31/00

CPC分类号： G01R15/207 ,  G01R15/148 ,  G01R33/0283 ,  G01R33/0286 ,  G01R35/005 ,  Y10T29/49002

摘要： A micro-electromechanical system current and magnetic field sensor is presented. The micro-electromechanical system current and magnetic field sensor is configured to sense a magnetic field produced by a current carrying conductor. The sensor includes a structural component comprising a substrate and a compliant layer, a magnetic-to-mechanical converter coupled to the structural component to provide a mechanical indication of the magnetic field. The sensor further includes a strain responsive component coupled to the structural component to sense the mechanical indication and to provide an indication of the current in the current carrying conductor in response thereto.

摘要翻译： 提出了一种微机电系统电流和磁场传感器。 微机电系统电流和磁场传感器被配置为感测由载流导体产生的磁场。 该传感器包括结构部件，其包括基板和柔性层，耦合到结构部件的磁 - 机械转换器，以提供磁场的机械指示。 传感器还包括耦合到结构部件的应变响应部件以感测机械指示并且响应于此而提供载流导体中的电流的指示。

公开(公告)号：US07495430B2

公开(公告)日：2009-02-24

申请号：US11506988

申请日：2006-08-18

申请人： Ertugrul Berkcan ,  Christopher James Kapusta ,  Glenn Scott Claydon ,  Anis Zribi ,  Laura Jean Meyer ,  Wei-Cheng Tian

发明人： Ertugrul Berkcan ,  Christopher James Kapusta ,  Glenn Scott Claydon ,  Anis Zribi ,  Laura Jean Meyer ,  Wei-Cheng Tian

IPC分类号： G01R33/00

CPC分类号： G01R33/0283 ,  G01R15/148 ,  G01R33/0286

摘要： A micro-electromechanical system (MEMS) current sensor is described as including a first conductor, a magnetic field shaping component for shaping a magnetic field produced by a current in the first conductor, and a MEMS-based magnetic field sensing component including a magneto-MEMS component for sensing the shaped magnetic field and, in response thereto, providing an indication of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.

摘要翻译： 微机电系统（MEMS）电流传感器被描述为包括第一导体，用于使由第一导体中的电流产生的磁场成形的磁场成形部件，以及包括磁 - 用于感测成形磁场的MEMS组件，并且响应于此，提供第一导体中的电流的指示。 还描述了一种用于感测使用MEMS的电流的方法，包括使用在第一导体中的电流产生的磁场成形，用具有磁MEMS组件磁场感测电路的基于MEMS的磁场感测部件感测成形的磁场 并且提供第一导体中的电流的指示。

公开(公告)号：US07112951B2

公开(公告)日：2006-09-26

申请号：US10863442

申请日：2004-06-07

申请人： Ertugrul Berkcan ,  Christopher James Kapusta ,  Glenn Scott Claydon ,  Anis Zribi ,  Laura Jean Meyer ,  Wei-Cheng Tian

发明人： Ertugrul Berkcan ,  Christopher James Kapusta ,  Glenn Scott Claydon ,  Anis Zribi ,  Laura Jean Meyer ,  Wei-Cheng Tian

IPC分类号： G01R33/00

CPC分类号： G01R33/0283 ,  G01R15/148 ,  G01R33/0286

摘要： A micro-electromechanical system (MEMS) current sensor is described as including a first conductor, a magnetic field shaping component for shaping a magnetic field produced by a current in the first conductor, and a MEMS-based magnetic field sensing component including a magneto-MEMS component for sensing the shaped magnetic field and, in response thereto, providing an indication of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.

公开(公告)号：US06239482B1

公开(公告)日：2001-05-29

申请号：US09334572

申请日：1999-06-21

申请人： Raymond Albert Fillion ,  William Edward Burdick, Jr. ,  Ronald Frank Kolc ,  James Wilson Rose ,  Glenn Scott Claydon

发明人： Raymond Albert Fillion ,  William Edward Burdick, Jr. ,  Ronald Frank Kolc ,  James Wilson Rose ,  Glenn Scott Claydon

IPC分类号： H01L2302

CPC分类号： H01L24/25 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043

摘要： An integrated circuit package includes at least one integrated circuit element coupled to a polymer film; a window frame coupled to the polymer film and surrounding the at least one integrated circuit element; and encapsulant material positioned between the at least one integrated circuit element and the window frame.

摘要翻译： 集成电路封装包括耦合到聚合物膜的至少一个集成电路元件; 耦合到所述聚合物膜并围绕所述至少一个集成电路元件的窗框; 以及位于所述至少一个集成电路元件和所述窗框之间的密封材料。

公开(公告)号：US07741832B2

公开(公告)日：2010-06-22

申请号：US11736678

申请日：2007-04-18

申请人： Ertugrul Berkcan ,  Christopher James Kapusta ,  Marco Francesco Aimi ,  Shankar Chandrasekaran ,  Glenn Scott Claydon

发明人： Ertugrul Berkcan ,  Christopher James Kapusta ,  Marco Francesco Aimi ,  Shankar Chandrasekaran ,  Glenn Scott Claydon

IPC分类号： G01R33/00

CPC分类号： G01R15/207 ,  G01R15/148 ,  G01R33/0283 ,  G01R33/0286 ,  G01R35/005

摘要： A micro-electro-mechanical system (MEMS) current sensor for sensing a magnetic field produced by an electrical current flowing in a conductor includes a first fixed element and a moving element. The moving element is spaced away from the first fixed element and is movable relative to the fixed element responsive to a magnetic field produced by an electrical current flowing in a conductor for providing a mechanical indication of a strength of the magnetic field. The sensor also includes a tunneling current generator for generating a tunneling current between the first fixed element and the moving element and a tunneling current monitor for monitoring a change in the tunneling current responsive to the mechanical indication to provide an indication of a value of the electrical current in the conductor.

摘要翻译： 用于感测由在导体中流动的电流产生的磁场的微机电系统（MEMS）电流传感器包括第一固定元件和移动元件。 移动元件与第一固定元件间隔开，并且可响应于在导体中流动的电流产生的磁场相对于固定元件移动，以提供磁场强度的机械指示。 传感器还包括用于在第一固定元件和移动元件之间产生隧道电流的隧道电流发生器，以及隧道电流监视器，用于响应于机械指示监视隧道电流的变化，以提供电气值的指示 电流在导体中。

公开(公告)号：US20090096088A1

公开(公告)日：2009-04-16

申请号：US11872562

申请日：2007-10-15

申请人： MARCO FRANCESCO AIMI ,  Chirstopher James Kapusta ,  Arun Virupaksha Gowda ,  David Cecil Hays ,  Oliver Charles Boomhower ,  Glenn Scott Claydon ,  Joseph Alfred Iannotti ,  Christopher Fred Keimel

发明人： MARCO FRANCESCO AIMI ,  Chirstopher James Kapusta ,  Arun Virupaksha Gowda ,  David Cecil Hays ,  Oliver Charles Boomhower ,  Glenn Scott Claydon ,  Joseph Alfred Iannotti ,  Christopher Fred Keimel

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/032 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/00

摘要： Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.

摘要翻译： 衬底上的多个微电子机械系统（MEMS）用盖子盖住，使用可用作粘合剂，分离层和气密密封的层。 衬底具有具有多个MEMS器件的第一侧。 形成有用于通孔的通孔的盖，并且具有用于层对准和分离的支柱。 图案化粘合片用于MEMS器件，通孔和支柱的切口。 将粘合片粘合到盖上，然后放置在MEMS基板上并加热以粘合层。 通孔可以用电路板连接的引线金属化。 在密封之后，MEMS单元可以从基底切割，从而保护它们免受污染。

公开(公告)号：US07411670B2

公开(公告)日：2008-08-12

申请号：US11400863

申请日：2006-04-10

申请人： Anis Zribi ,  Ayan Banerjee ,  Shivappa Ningappa Goravar ,  Shankar (nmn) Chandrasekaran ,  Sandip Maity ,  Glenn Scott Claydon ,  Stacey Joy Kennerly ,  Todd Ryan Tolliver ,  David Cecil Hays ,  Sheila Neumann Tandon ,  Long Que ,  Christopher Fred Keimel

发明人： Anis Zribi ,  Ayan Banerjee ,  Shivappa Ningappa Goravar ,  Shankar (nmn) Chandrasekaran ,  Sandip Maity ,  Glenn Scott Claydon ,  Stacey Joy Kennerly ,  Todd Ryan Tolliver ,  David Cecil Hays ,  Sheila Neumann Tandon ,  Long Que ,  Christopher Fred Keimel

IPC分类号： G01J3/44

CPC分类号： G01J3/44 ,  G01J3/02 ,  G01J3/0291 ,  G01N21/65

摘要： A photonic crystal based collection probe is provided. The probe includes a photonic crystal configured to guide and condition a beam of Raman scattered photons. Further, the device includes a spectrograph in optical communication with the photonic crystal and configured to receive Raman scattering from the photonic crystal. The device may be employed in a Raman spectrometer system.

摘要翻译： 提供了一种基于光子晶体的收集探针。 探针包括配置为引导和调节拉曼散射光子束的光子晶体。 此外，该装置包括与光子晶体光学通信并被配置为从光子晶体接收拉曼散射的光谱仪。 该装置可以用在拉曼光谱仪系统中。

公开(公告)号：US20100156577A1

公开(公告)日：2010-06-24

申请号：US12340776

申请日：2008-12-22

申请人： Xuefeng Wang ,  Kuna Venkat Satya Rama Kishore ,  Christopher Fred Keimel ,  Glenn Scott Claydon ,  Kanakasabapathi Subramanian

发明人： Xuefeng Wang ,  Kuna Venkat Satya Rama Kishore ,  Christopher Fred Keimel ,  Glenn Scott Claydon ,  Kanakasabapathi Subramanian

IPC分类号： H01H51/22

CPC分类号： H01H59/0009 ,  H01H1/0036

摘要： A micro electro-mechanical system switch is presented. The switch includes a base substrate having a support surface. An actuating surface having a notch and an electrical contact surface having an extension is provided. The extension is disposed within the notch. A beam is attached to the base substrate. The beam includes an actuatable free end that is configured to flex upon actuation and to make contact with at least a portion of the extension and carry current therethrough.

摘要翻译： 介绍了一种微机电系统开关。 开关包括具有支撑表面的基底。 提供具有凹口和具有延伸部的电接触表面的致动表面。 延伸部位于凹口内。 梁连接到基底基板。 梁包括可致动的自由端，其构造成在致动时弯曲并且与延伸部的至少一部分接触并且携带电流通过其中。