公开(公告)号：US06935792B2

公开(公告)日：2005-08-30

申请号：US10065460

申请日：2002-10-21

申请人： Richard Joseph Saia ,  Thomas Bert Gorczyca ,  Christopher James Kapusta ,  Ernest Wayne Balch ,  Glenn Scott Claydon ,  Samhita Dasgupta ,  Eladio Clemente Delgado

发明人： Richard Joseph Saia ,  Thomas Bert Gorczyca ,  Christopher James Kapusta ,  Ernest Wayne Balch ,  Glenn Scott Claydon ,  Samhita Dasgupta ,  Eladio Clemente Delgado

IPC分类号： G02B6/12 ,  G02B6/122 ,  G02B6/138 ,  G02B6/42 ,  G02B6/00

CPC分类号： G02B6/122 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/1221 ,  G02B6/138 ,  G02B6/42 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/15153 ,  H01L2924/15192

摘要： An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

摘要翻译： 通过一种方法制造光电子封装，该方法包括：将光学器件定位在衬底主动侧的窗口内，顶部衬底表面上方和下方; 用光学聚合物材料填充窗户; 光学聚合物材料和基底的平坦化表面; 在光学聚合物材料和基底上形成波导材料以形成光学互连路径; 并且形成反射镜以将来自光学装置的光反射到互连路径; 以及形成通孔以暴露所述光学器件的接合焊盘。

公开(公告)号：US10276486B2

公开(公告)日：2019-04-30

申请号：US12715450

申请日：2010-03-02

申请人： Thomas Bert Gorczyca ,  Richard Joseph Saia ,  Paul Alan McConnelee

发明人： Thomas Bert Gorczyca ,  Richard Joseph Saia ,  Paul Alan McConnelee

IPC分类号： H01L23/498

摘要： A chip package is disclosed that includes an electronic chip having a plurality of die pads formed on a top surface thereof, with a polyimide flex layer positioned thereon by way of an adhesive layer. A plurality of vias is formed through the polyimide flex layer and the adhesive layer corresponding to the die pads. A plurality of metal interconnects are formed on the polyimide flex layer each having a cover pad covering a portion of a top surface of the polyimide flex layer, a sidewall extending down from the cover pad and through the via along a perimeter thereof, and a base connected to the sidewall and forming an electrical connection with a respective die pad. Each of the base and the sidewall is formed to have a thickness that is equal to or greater than a thickness of the adhesive layer.

公开(公告)号：US08604612B2

公开(公告)日：2013-12-10

申请号：US12389060

申请日：2009-02-19

申请人： Richard Joseph Saia ,  Thomas Bert Gorczyca

发明人： Richard Joseph Saia ,  Thomas Bert Gorczyca

IPC分类号： H01L23/12 ,  H01L21/58 ,  C09J163/00 ,  C08G59/68

CPC分类号： H01L24/83 ,  C08G59/226 ,  C08G59/68 ,  C09J5/00 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  G03F7/038 ,  H01L24/19 ,  H01L24/29 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2413 ,  H01L2224/2919 ,  H01L2224/82039 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2924/3512 ,  H01L2924/00

摘要： Present embodiments are directed to an adhesive and method for assembling a chip package. The adhesive may be used to couple a chip to a substrate, and the adhesive may include an epoxy-based dielectric material, an epoxy resin, a photoacid generator, an antioxidant, and a cold catalyst corresponding to the photoacid generator.

摘要翻译： 本实施例涉及用于组装芯片封装的粘合剂和方法。 粘合剂可以用于将芯片耦合到基底，并且粘合剂可以包括对应于光致酸产生剂的环氧基介电材料，环氧树脂，光致酸产生剂，抗氧化剂和冷催化剂。

公开(公告)号：US20110215480A1

公开(公告)日：2011-09-08

申请号：US12715450

申请日：2010-03-02

申请人： Thomas Bert Gorczyca ,  Richard Joseph Saia ,  Paul Alan McConnelee

发明人： Thomas Bert Gorczyca ,  Richard Joseph Saia ,  Paul Alan McConnelee

IPC分类号： H01L23/48 ,  H01L21/50 ,  H01L21/768

CPC分类号： H01L23/4985 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A chip package is disclosed that includes an electronic chip having a plurality of die pads formed on a top surface thereof, with a polyimide flex layer positioned thereon by way of an adhesive layer. A plurality of vias is formed through the polyimide flex layer and the adhesive layer corresponding to the die pads. A plurality of metal interconnects are formed on the polyimide flex layer each having a cover pad covering a portion of a top surface of the polyimide flex layer, a sidewall extending down from the cover pad and through the via along a perimeter thereof, and a base connected to the sidewall and forming an electrical connection with a respective die pad. Each of the base and the sidewall is formed to have a thickness that is equal to or greater than a thickness of the adhesive layer.

摘要翻译： 公开了一种芯片封装，其包括具有形成在其顶表面上的多个管芯焊盘的电子芯片，其中聚酰亚胺柔性层通过粘合剂层定位在其上。 通过聚酰亚胺柔性层和对应于芯片焊盘的粘合剂层形成多个通孔。 多个金属互连件形成在聚酰亚胺柔性层上，每层具有覆盖聚酰亚胺柔性层的顶表面的一部分的覆盖层，从盖垫向下延伸并沿其周边穿过通孔的侧壁， 连接到侧壁并与相应的管芯焊盘形成电连接。 基底和侧壁中的每一个被形成为具有等于或大于粘合剂层的厚度的厚度。

公开(公告)号：US20100207261A1

公开(公告)日：2010-08-19

申请号：US12389060

申请日：2009-02-19

申请人： Richard Joseph Saia ,  Thomas Bert Gorczyca

发明人： Richard Joseph Saia ,  Thomas Bert Gorczyca

IPC分类号： H01L23/28 ,  H01L21/50 ,  C08L63/00 ,  C08K5/13

CPC分类号： H01L24/83 ,  C08G59/226 ,  C08G59/68 ,  C09J5/00 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  G03F7/038 ,  H01L24/19 ,  H01L24/29 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2413 ,  H01L2224/2919 ,  H01L2224/82039 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2924/3512 ,  H01L2924/00

摘要： Present embodiments are directed to an adhesive and method for assembling a chip package. The adhesive may be used to couple a chip to a substrate, and the adhesive may include an epoxy-based dielectric material, an epoxy resin, a photoacid generator, an antioxidant, and a cold catalyst corresponding to the photoacid generator.

摘要翻译： 本实施例涉及用于组装芯片封装的粘合剂和方法。 粘合剂可以用于将芯片耦合到基底，并且粘合剂可以包括对应于光致酸产生剂的环氧基介电材料，环氧树脂，光致酸产生剂，抗氧化剂和冷催化剂。

公开(公告)号：US6146558A

公开(公告)日：2000-11-14

申请号：US71624

申请日：1998-05-01

申请人： Thomas Paul Feist ,  Thomas Bert Gorczyca ,  Richard Joseph Saia ,  Paul Alan McConnelee

发明人： Thomas Paul Feist ,  Thomas Bert Gorczyca ,  Richard Joseph Saia ,  Paul Alan McConnelee

IPC分类号： B29C45/26 ,  G11B7/26 ,  B29D11/00

CPC分类号： B29C45/2642 ,  B29C45/2632 ,  B29C2045/2636 ,  Y10S425/81

摘要： A method for molding an optical disk comprises: applying a thermally insulative insert coating to at least one thermally insulative mold insert to provide at least one coated mold insert having a reduced surface roughness; positioning the coated mold insert between a thermally conductive mold form and a portion of a thermally conductive mold apparatus; injecting a molten thermoplastic material into the mold apparatus; retaining the material in the mold apparatus for a time sufficient for the molten thermoplastic material to cool below its glass transition temperature to form the optical disk; and ejecting the optical disk from the mold apparatus. In another embodiment, the mold insert is coated or laminated on the mold form with the mold insert having a coefficient of thermal expansion compatible with the coefficient of thermal expansion of the mold form. In another embodiment, the mold insert is fabricated by being applied, cured, and then removed from a release layer.

公开(公告)号：US06733711B2

公开(公告)日：2004-05-11

申请号：US10387835

申请日：2003-03-14

申请人： Kevin Matthew Durocher ,  Ernest Wayne Balch ,  Vikram B. Krishnamurthy ,  Richard Joseph Saia ,  Herbert Stanley Cole ,  Ronald Frank Kolc

发明人： Kevin Matthew Durocher ,  Ernest Wayne Balch ,  Vikram B. Krishnamurthy ,  Richard Joseph Saia ,  Herbert Stanley Cole ,  Ronald Frank Kolc

IPC分类号： B29C4514

CPC分类号： H01L23/13 ,  H01L23/3677 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/97 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10S362/80 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.

摘要翻译： 提供了一种柔性电路模块，包括至少一个刚性载体，安装在至少一个刚性载体的第一侧上的至少一个固态装置，支撑至少一个刚性载体的第二侧的柔性基座， 导电互连图案，以及多个馈通电极，其从所述至少一个刚性载体的第一侧延伸到第二侧，并将导电互连图案与多个固态中的至少一个电连接 设备。 固态器件可以是LED芯片以形成LED阵列模块。

公开(公告)号：US06730533B2

公开(公告)日：2004-05-04

申请号：US10387862

申请日：2003-03-14

申请人： Kevin Matthew Durocher ,  Ernest Wayne Balch ,  Vikram B. Krishnamurthy ,  Richard Joseph Saia ,  Herbert Stanley Cole ,  Ronald Frank Kolc

发明人： Kevin Matthew Durocher ,  Ernest Wayne Balch ,  Vikram B. Krishnamurthy ,  Richard Joseph Saia ,  Herbert Stanley Cole ,  Ronald Frank Kolc

IPC分类号： H01L2100

CPC分类号： H01L23/13 ,  H01L23/3677 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/97 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10S362/80 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.

公开(公告)号：US06614103B1

公开(公告)日：2003-09-02

申请号：US09654163

申请日：2000-09-01

申请人： Kevin Matthew Durocher ,  Ernest Wayne Balch ,  Vikram B. Krishnamurthy ,  Richard Joseph Saia ,  Herbert Stanley Cole ,  Ronald Frank Kolc

发明人： Kevin Matthew Durocher ,  Ernest Wayne Balch ,  Vikram B. Krishnamurthy ,  Richard Joseph Saia ,  Herbert Stanley Cole ,  Ronald Frank Kolc

IPC分类号： B60Q100

CPC分类号： H01L23/13 ,  H01L23/3677 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/97 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10S362/80 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.

公开(公告)号：US07752751B2

公开(公告)日：2010-07-13

申请号：US12058912

申请日：2008-03-31

申请人： Christopher James Kapusta ,  Donald Cunningham ,  Richard Joseph Saia

发明人： Christopher James Kapusta ,  Donald Cunningham ,  Richard Joseph Saia

IPC分类号： H01K3/10

CPC分类号： H05K9/0039 ,  C23C14/046 ,  H01L23/29 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/09872 ,  H05K2203/1311 ,  H05K2203/1361 ,  H05K2203/1366 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A system and method for providing shielding to an electrical system is disclosed. A conformal shield is formed by applying a conformal insulating coating to an electrical system. A plurality of openings are formed in the insulating coating at desired locations and a first metallic layer is deposited over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the circuit board at the desired locations. A second metallic layer is then deposited onto the first metallic layer to increase a thickness of the metallic layers.

摘要翻译： 公开了一种用于向电气系统提供屏蔽的系统和方法。 通过将适形绝缘涂层施加到电气系统来形成保形屏蔽。 在绝缘涂层中在所需位置处形成多个开口，并且第一金属层沉积在绝缘涂层上方，并且在多个开口中的每一个中，第一金属层在所需位置处与电路板电连接。 然后将第二金属层沉积到第一金属层上以增加金属层的厚度。