-
公开(公告)号：US20050001316A1
公开(公告)日：2005-01-06
申请号：US10612590
申请日：2003-07-01
申请人： Timothy Dean , Terance Blake , Gregory Dunn , Remy Chelini , William Lytle , Owen Fay , George Strumberger
发明人： Timothy Dean , Terance Blake , Gregory Dunn , Remy Chelini , William Lytle , Owen Fay , George Strumberger
IPC分类号： H01L23/485 , H01L23/48 , H01L21/44 , H01L23/52 , H01L29/40
CPC分类号： H01L24/05 , H01L24/32 , H01L24/45 , H01L24/73 , H01L2224/04042 , H01L2224/05644 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/73265 , H01L2224/8501 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/157 , H01L2924/16151 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/48744
摘要： The invention provides an integrated device with corrosion-resistant capped bond pads. The capped bond pads include at least one aluminum bond pad on a semiconductor substrate. A layer of electroless nickel is disposed on the aluminum bond pad. A layer of electroless palladium is disposed on the electroless nickel, and a layer of immersion gold is disposed on the electroless palladium. A capped bond pad and a method of forming the capped bond pads are also disclosed.
摘要翻译： 本发明提供了一种具有耐腐蚀的封盖焊盘的集成器件。 封装的接合焊盘包括半导体衬底上的至少一个铝接合焊盘。 在铝合金焊盘上设置一层无电镀镍。 在化学镀镍上设置一层无电镀钯，并在无电镀钯上设置一层浸金。 还公开了一种封盖接合焊盘和形成封盖接合焊盘的方法。
-
公开(公告)号：US20050104207A1
公开(公告)日：2005-05-19
申请号：US10982432
申请日：2004-11-05
申请人： Timothy Dean , Terance Blake , Gregory Dunn , Remy Chelini , William Lytle , Owen Fay , George Strumberger
发明人： Timothy Dean , Terance Blake , Gregory Dunn , Remy Chelini , William Lytle , Owen Fay , George Strumberger
IPC分类号： H01L23/485 , H01L21/44 , H01L21/48
CPC分类号： H01L24/05 , H01L24/32 , H01L24/45 , H01L24/73 , H01L2224/04042 , H01L2224/05644 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/73265 , H01L2224/8501 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/157 , H01L2924/16151 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/48744
摘要： The invention provides an integrated device with corrosion-resistant capped bond pads. The capped bond pads include at least one aluminum bond pad on a semiconductor substrate. A layer of electroless nickel is disposed on the aluminum bond pad. A layer of electroless palladium is disposed on the electroless nickel, and a layer of immersion gold is disposed on the electroless palladium. A capped bond pad and a method of forming the capped bond pads are also disclosed.
-
公开(公告)号：US20050001324A1
公开(公告)日：2005-01-06
申请号：US10610745
申请日：2003-07-01
申请人： Gregory Dunn , Owen Fay , Timothy Dean , Terance Blake , Remy Chelini , William Lytle , George Strumberger
发明人： Gregory Dunn , Owen Fay , Timothy Dean , Terance Blake , Remy Chelini , William Lytle , George Strumberger
IPC分类号： G01L9/00 , H01L21/60 , H01L23/485 , H01L23/498 , H01L23/48
CPC分类号： H01L24/12 , G01L19/0069 , G01L19/147 , H01L23/498 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05644 , H01L2224/13099 , H01L2224/13109 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/73265 , H01L2224/85013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48744 , H01L2924/00012
摘要： The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion ruthernium is disposed on the copper bond pad. A first intermediate layer of electroless nickel-boron alloy is disposed on the activation layer. A second intermediate layer comprising one of electroless nickel or electroless palladium is disposed on the first intermediate layer, and an immersion gold layer is disposed on the second intermediate layer. A capped copper bond pad and a method of forming the capped copper bond pads are also disclosed.
摘要翻译： 本发明提供了一种具有耐腐蚀的封盖铜焊盘的集成器件。 封装的铜键合焊盘包括半导体衬底上的至少一个铜焊盘。 包含浸渍钯，无电解钴或浸渍铯中的一种的活化层设置在铜键合焊盘上。 化学镀镍 - 硼合金的第一中间层设置在活化层上。 在第一中间层上设置包含非电解镍或无电解钯中的一种的第二中间层，在第二中间层上设置浸金层。 还公开了封盖铜键合焊盘和形成封盖铜键合焊盘的方法。
-
公开(公告)号：US07078796B2
公开(公告)日：2006-07-18
申请号：US10610745
申请日：2003-07-01
申请人： Gregory J. Dunn , Owen R. Fay , Timothy B. Dean , Terance Blake , Remy J. Chelini , William H. Lytle , George A. Strumberger
发明人： Gregory J. Dunn , Owen R. Fay , Timothy B. Dean , Terance Blake , Remy J. Chelini , William H. Lytle , George A. Strumberger
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , G01L19/0069 , G01L19/147 , H01L23/498 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05644 , H01L2224/13099 , H01L2224/13109 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/73265 , H01L2224/85013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48744 , H01L2924/00012
摘要： The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion ruthernium is disposed on the copper bond pad. A first intermediate layer of electroless nickel-boron alloy is disposed on the activation layer. A second intermediate layer comprising one of electroless nickel or electroless palladium is disposed on the first intermediate layer, and an immersion gold layer is disposed on the second intermediate layer. A capped copper bond pad and a method of forming the capped copper bond pads are also disclosed.
摘要翻译： 本发明提供了一种具有耐腐蚀的封盖铜焊盘的集成器件。 封装的铜键合焊盘包括半导体衬底上的至少一个铜焊盘。 包含浸渍钯，无电解钴或浸渍铯中的一种的活化层设置在铜键合焊盘上。 化学镀镍 - 硼合金的第一中间层设置在活化层上。 在第一中间层上设置包含非电解镍或无电解钯中的一种的第二中间层，在第二中间层上设置浸金层。 还公开了封盖铜键合焊盘和形成封盖铜键合焊盘的方法。
-
-
-
搜索结果
4 条记录 (耗时 0.023 秒)
