公开(公告)号：US20080160851A1

公开(公告)日：2008-07-03

申请号：US11616853

申请日：2006-12-27

申请人： Gregory J. Dunn ,  Remy J. Chelini ,  Howard W. Davis ,  Jeffrey M. Petsinger ,  John A. Svigelj

发明人： Gregory J. Dunn ,  Remy J. Chelini ,  Howard W. Davis ,  Jeffrey M. Petsinger ,  John A. Svigelj

IPC分类号： B32B5/02

CPC分类号： B32B5/26 ,  Y10T442/2418

摘要： A textile may include conductive matter and a high impedance surface defined at least in part by the conductive matter.

摘要翻译： 织物可以包括导电物质和至少部分地由导电物质限定的高阻抗表面。

公开(公告)号：US07030815B2

公开(公告)日：2006-04-18

申请号：US10936286

申请日：2004-09-08

申请人： Gregory J. Dunn ,  Jeffrey M. Petsinger ,  William R. Ziemer

发明人： Gregory J. Dunn ,  Jeffrey M. Petsinger ,  William R. Ziemer

IPC分类号： H01Q1/38

CPC分类号： H05K1/16 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q9/0407 ,  H01Q23/00 ,  H05K1/024 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/09454 ,  H05K2201/09509

摘要： An integrated patch antenna and electronics assembly (300) comprises an antenna dielectric layer (305), a ground plane layer (310) disposed on a first side of the antenna dielectric layer, a printed circuit dielectric layer (315) disposed on the ground plane layer opposite the antenna dielectric layer, a patterned conductive metal foil layer (320) on a component surface (323) of the assembly (300), and a conductive metal foil antenna patch (325) disposed on a second side of the antenna dielectric layer that is in a patch side (391) of the assembly. In some embodiments, a plated through hole (330) couples the antenna patch to the patterned conductive metal foil layer. In some embodiments, there are one or more printed circuit dielectric layers (316, 341, 346, 351) disposed over the antenna patch on the antenna patch side of the assembly. In some embodiments, pairs of printed circuit dielectric layers ([315, 316], [340, 341], [345, 346], [350, 351]) are formed simultaneously on each side of the assembly.

公开(公告)号：US07079373B2

公开(公告)日：2006-07-18

申请号：US10837461

申请日：2004-04-30

申请人： Gregory J. Dunn ,  Jeffrey M. Petsinger ,  Jovica Savic

发明人： Gregory J. Dunn ,  Jeffrey M. Petsinger ,  Jovica Savic

IPC分类号： H01G4/06 ,  H05K1/11

CPC分类号： H05K3/0023 ,  H05K1/0366 ,  H05K1/162 ,  H05K3/064 ,  H05K3/429 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/0571

摘要： A dielectric sheet (500, 600, 1621) includes a photodielectric support layer (505, 1630) that may be glass reinforced and a dielectric laminate (510, 605). The dielectric laminate includes first and second metal foil layers (415, 660; 210, 665, 1605, 1610), and a dielectric layer (405, 655, 1620) disposed between the first and second metal foil layers. The first metal foil layer is adhered to the photodielectric support layer. In a printed circuit and patch antenna that includes the dielectric sheet, the first metal layer is patterned by removal of metal according to a circuit pattern and the photodielectric support layer is patterned by removal of dielectric material according to the circuit pattern.

摘要翻译： 电介质片（500,600,1621）包括可以被玻璃增强的光电介质支撑层（505,1630）和介电层压板（510,605）。 介电层压板包括设置在第一和第二金属箔层之间的第一和第二金属箔层（415,660; 210,665,1605,1610）和介电层（405,655,1620）。 第一金属箔层粘附到光致介电支撑层上。 在包括电介质片的印刷电路和贴片天线中，通过根据电路图案去除金属来对第一金属层进行构图，并且通过根据电路图案去除介电材料来对光致介电支撑层进行图案化。

公开(公告)号：US07390978B2

公开(公告)日：2008-06-24

申请号：US11021429

申请日：2004-12-23

申请人： Timothy B. Dean ,  Daniel T. Rooney ,  Jeffrey M. Petsinger

发明人： Timothy B. Dean ,  Daniel T. Rooney ,  Jeffrey M. Petsinger

IPC分类号： H01L23/28

CPC分类号： H05K3/284 ,  H01R43/24 ,  H05K1/117 ,  H05K3/0052 ,  H05K2201/09127 ,  H05K2201/10037 ,  H05K2201/10325

摘要： An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.

摘要翻译： 包覆成型的电子组件（900,1000,1200）由一个或多个包覆模制的接口部件（300,400,500,420,1750）制成，所述接口部件可以是具有诸如扬声器或传感器之类的物理接口的电触点或电子部件。 包覆模制的界面部件具有牺牲端，在电子组件中包覆成型之后，其余的可包覆模制的界面部件被切掉，从而为包覆模制的电子组件提供了一个密封腔。

公开(公告)号：US5825633A

公开(公告)日：1998-10-20

申请号：US740940

申请日：1996-11-05

申请人： C. Gregory Bujalski ,  Jeffrey M. Petsinger ,  Daniel T. Rooney

发明人： C. Gregory Bujalski ,  Jeffrey M. Petsinger ,  Daniel T. Rooney

IPC分类号： H05K3/34 ,  H05K3/36 ,  H05K1/11

CPC分类号： H05K3/368 ,  H01R12/523 ,  H05K2201/09063 ,  H05K2201/10893 ,  H05K3/3442

摘要： A multi-board electronic assembly (10) includes a first substrate (12) and a second substrate (14) electrically connected by a spacer (16). The spacer (16) includes a first end (26) that is received in a first receptacle (18) on the first substrate (12) and a second end (28) that is received in a second receptacle (22) in the second substrate (14). The spacer (16) is formed generally of a nonconductive body (15) and includes ridges (60) and longitudinal channels (30) defined between the ridges (60). The ridges (60) are formed generally of a nonconductive material, and the spacer (16) includes a metallic strip (32) disposed within the channel (30). The metallic strip (32) forms a conductive path to connect the first circuit trace (20) to the second circuit trace (24) to form an electrically connected microelectronic assembly (10).

摘要翻译： 多板电子组件（10）包括通过间隔件（16）电连接的第一基板（12）和第二基板（14）。 间隔件（16）包括容纳在第一基板（12）上的第一容器（18）中的第一端（26）和容纳在第二基板（22）中的第二容器（22）中的第二端 （14）。 间隔物（16）通常由非导电体（15）形成，并且包括限定在脊（60）之间的脊（60）和纵向通道（30）。 脊（60）通常由非导电材料形成，并且间隔件（16）包括设置在通道（30）内的金属条（32）。 金属条（32）形成导电路径以将第一电路迹线（20）连接到第二电路迹线（24）以形成电连接的微电子组件（10）。