APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING NEUTRALIZED BEAMS INCLUDING APPLYING A VOLTAGE TO A SUBSTRATE SUPPORT
    2.
    发明申请
    APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING NEUTRALIZED BEAMS INCLUDING APPLYING A VOLTAGE TO A SUBSTRATE SUPPORT 有权
    使用中性线处理基板的装置和方法,包括将电压应用于基板支持

    公开(公告)号:US20090140132A1

    公开(公告)日:2009-06-04

    申请号:US12323783

    申请日:2008-11-26

    IPC分类号: H05H3/02

    摘要: An apparatus and method for processing a substrate using neutralized beams are provided. A substrate processing apparatus includes an ion source generating device configured to form an ion source. An ion extraction device is configured to extract and accelerate ions from the ion source. An ion neutralizing device is configured to convert the ions extracted and accelerated from the ion extraction device into neutralized beams. A remaining portion of the ions extracted and accelerated from the ion extraction device is not converted into the neutralized beams. A substrate support is configured to support a substrate such that the neutralized beams are directed towards the substrate support. A substrate power supply is configured to apply a voltage to the substrate support such that the remaining portion of the ions that is not converted into the neutralized beams is directed away from the substrate support by the applied voltage of the substrate.

    摘要翻译: 提供了一种使用中和束来处理衬底的设备和方法。 衬底处理装置包括被配置为形成离子源的离子源生成装置。 离子提取装置被配置为从离子源提取和加速离子。 离子中和装置被配置为将从离子提取装置提取和加速的离子转化成中和的束。 从离子提取装置提取和加速的离子的剩余部分不被转换成中和的束。 衬底支撑件被配置为支撑衬底,使得中和的光束被引向衬底支撑件。 衬底电源被配置为向衬底支撑件施加电压,使得未转换成中和束的离子的剩余部分通过衬底的施加电压被引导离开衬底支撑。

    Method of fabricating three-dimensional semiconductor device and three-dimensional semiconductor device fabricated using the same
    4.
    发明授权
    Method of fabricating three-dimensional semiconductor device and three-dimensional semiconductor device fabricated using the same 有权
    制造三维半导体器件的方法和使用其制造的三维半导体器件

    公开(公告)号:US09087790B2

    公开(公告)日:2015-07-21

    申请号:US13949600

    申请日:2013-07-24

    摘要: According to example embodiments of inventive concepts, a method of fabricating a 3D semiconductor device may include: forming a stack structure including a plurality of horizontal layers sequentially stacked on a substrate including a cell array region and a contact region; forming a first mask pattern covering the cell array region and defining openings extending in one direction over the contact region; performing a first etching process with a first etch-depth using the first mask pattern as an etch mask on the stack structure; forming a second mask pattern covering the cell array region and exposing a part of the contact region; and performing a second etching process with a second etch-depth using the second mask pattern as an etch mask structure on the stack structure. The second etch-depth may be greater than the first etch-depth.

    摘要翻译: 根据发明构思的示例性实施例,制造3D半导体器件的方法可以包括:形成包括依次层叠在包括单元阵列区域和接触区域的基板上的多个水平层的堆叠结构; 形成覆盖所述单元阵列区域并限定在所述接触区域上沿一个方向延伸的开口的第一掩模图案; 使用所述第一掩模图案作为所述堆叠结构上的蚀刻掩模,利用第一蚀刻深度执行第一蚀刻工艺; 形成覆盖所述单元阵列区域并露出所述接触区域的一部分的第二掩模图案; 以及使用所述第二掩模图案作为所述堆叠结构上的蚀刻掩模结构,用第二蚀刻深度执行第二蚀刻工艺。 第二蚀刻深度可以大于第一蚀刻深度。

    Apparatus and method for collecting contaminants from an air flow for manufacturing semiconductor devices and system using the same
    5.
    发明申请
    Apparatus and method for collecting contaminants from an air flow for manufacturing semiconductor devices and system using the same 审中-公开
    用于从用于制造半导体器件的气流中收集污染物的装置和方法以及使用该污染物的系统

    公开(公告)号:US20070039470A1

    公开(公告)日:2007-02-22

    申请号:US11329913

    申请日:2006-01-10

    IPC分类号: B01D47/00

    CPC分类号: B01D47/14 B01D53/18

    摘要: Water discharged at a top region of an eliminator flows, e.g., by gravity into, along, and between the portions of the eliminator while an air flow also travels therein, e.g., horizontally and transverse to the water flow. As the air flow encounters the water, e.g., strikes portions of the eliminator having water flowing downward therealong or encounters water falling between portions of the eliminator, contaminants pass from the air flow to the water flow. The air flow, relieved of certain contaminants, continues onward and the water flow collects at the bottom of the eliminator for filtration and re-circulation through the eliminator.

    摘要翻译: 在消除器的顶部区域排出的水例如通过重力流入消除器的部分之间,并且在消除器的部分之间流动,同时气流也在其中行进,例如水平和横向于水流。 当空气流遇到水时,例如撞击具有向下流动的水的消除器的部分或遇到在消除器的部分之间落下的水,污染物从空气流传递到水流。 释放某些污染物的空气流继续向前,水流收集在消除器的底部,以过滤并通过消除器再循环。

    Apparatus and method for processing substrate using neutralized beams including applying a voltage to a substrate support
    6.
    发明授权
    Apparatus and method for processing substrate using neutralized beams including applying a voltage to a substrate support 有权
    用于使用中和束处理衬底的装置和方法,包括向衬底支撑件施加电压

    公开(公告)号:US08089042B2

    公开(公告)日:2012-01-03

    申请号:US12323783

    申请日:2008-11-26

    IPC分类号: H05H3/02

    摘要: An apparatus and method for processing a substrate using neutralized beams are provided. A substrate processing apparatus includes an ion source generating device configured to form an ion source. An ion extraction device is configured to extract and accelerate ions from the ion source. An ion neutralizing device is configured to convert the ions extracted and accelerated from the ion extraction device into neutralized beams. A remaining portion of the ions extracted and accelerated from the ion extraction device is not converted into the neutralized beams. A substrate support is configured to support a substrate such that the neutralized beams are directed towards the substrate support. A substrate power supply is configured to apply a voltage to the substrate support such that the remaining portion of the ions that is not converted into the neutralized beams is directed away from the substrate support by the applied voltage of the substrate.

    摘要翻译: 提供了一种使用中和束来处理衬底的设备和方法。 衬底处理装置包括被配置为形成离子源的离子源生成装置。 离子提取装置被配置为从离子源提取和加速离子。 离子中和装置被配置为将从离子提取装置提取和加速的离子转化成中和的束。 从离子提取装置提取和加速的离子的剩余部分不被转换成中和的束。 衬底支撑件被配置为支撑衬底,使得中和的光束被引向衬底支撑件。 衬底电源被配置为向衬底支撑件施加电压,使得未转换成中和束的离子的剩余部分通过衬底的施加电压被引导离开衬底支撑。

    Vertical memory devices and methods of manufacturing the same
    7.
    发明授权
    Vertical memory devices and methods of manufacturing the same 有权
    垂直存储器件及其制造方法

    公开(公告)号:US09543307B2

    公开(公告)日:2017-01-10

    申请号:US14792114

    申请日:2015-07-06

    摘要: A method of manufacturing a vertical memory device includes: providing a substrate including a cell array region and a peripheral circuit region; forming a mold structure in the cell array region; forming a mold protection film in a portion of the cell array region and the peripheral circuit region, the mold protection film contacting the mold structure; forming an opening for a common source line that passes through the mold structure and extends in a first direction perpendicular to a top surface of the substrate; forming a peripheral circuit contact hole that passes through the mold protection film and extends in the first direction in the peripheral circuit region; and simultaneously forming a first contact plug and a second contact plug, respectively, in the opening for the common source line and in the peripheral circuit contact hole.

    摘要翻译: 制造垂直存储器件的方法包括:提供包括单元阵列区域和外围电路区域的衬底; 在电池阵列区域中形成模具结构; 在电池阵列区域和外围电路区域的一部分中形成保护膜,模具保护膜与模具结构接触; 形成用于通过所述模具结构并沿垂直于所述基板的顶表面的第一方向延伸的共同源极线的开口; 形成通过所述保护膜并在所述外围电路区域沿所述第一方向延伸的外围电路接触孔; 同时在公共源极线的开口和外围电路接触孔中分别形成第一接触插塞和第二接触插塞。

    Apparatus and method for processing substrate using neutralized beams including applying a voltage to a substrate support
    9.
    发明授权
    Apparatus and method for processing substrate using neutralized beams including applying a voltage to a substrate support 有权
    用于使用中和束处理衬底的装置和方法,包括向衬底支撑件施加电压

    公开(公告)号:US08450680B2

    公开(公告)日:2013-05-28

    申请号:US13306364

    申请日:2011-11-29

    IPC分类号: H05H3/02

    摘要: An apparatus and method for processing a substrate using neutralized beams are provided. A substrate processing apparatus includes an ion source generating device configured to form an ion source. An ion extraction device is configured to extract and accelerate ions from the ion source. An ion neutralizing device is configured to convert the ions extracted and accelerated from the ion extraction device into neutralized beams. A remaining portion of the ions extracted and accelerated from the ion extraction device is not converted into the neutralized beams. A substrate support is configured to support a substrate such that the neutralized beams are directed towards the substrate support. A substrate power supply is configured to apply a voltage to the substrate support such that the remaining portion of the ions that is not converted into the neutralized beams is directed away from the substrate support by the applied voltage of the substrate.

    摘要翻译: 提供了一种使用中和束来处理衬底的设备和方法。 衬底处理装置包括被配置为形成离子源的离子源生成装置。 离子提取装置被配置为从离子源提取和加速离子。 离子中和装置被配置为将从离子提取装置提取和加速的离子转化成中和的束。 从离子提取装置提取和加速的离子的剩余部分不被转换成中和的束。 衬底支撑件被配置为支撑衬底,使得中和的光束被引向衬底支撑件。 衬底电源被配置为向衬底支撑件施加电压,使得未转换成中和束的离子的剩余部分通过衬底的施加电压被引导离开衬底支撑。

    Apparatus and Method for Processing Substrate Using Neutralized Beams Including Applying a Voltage to a Substrate Support
    10.
    发明申请
    Apparatus and Method for Processing Substrate Using Neutralized Beams Including Applying a Voltage to a Substrate Support 有权
    使用包括对基板支撑施加电压的中和束来处理基板的装置和方法

    公开(公告)号:US20120068058A1

    公开(公告)日:2012-03-22

    申请号:US13306364

    申请日:2011-11-29

    IPC分类号: H05H3/02

    摘要: An apparatus and method for processing a substrate using neutralized beams are provided. A substrate processing apparatus includes an ion source generating device configured to form an ion source. An ion extraction device is configured to extract and accelerate ions from the ion source. An ion neutralizing device is configured to convert the ions extracted and accelerated from the ion extraction device into neutralized beams. A remaining portion of the ions extracted and accelerated from the ion extraction device is not converted into the neutralized beams. A substrate support is configured to support a substrate such that the neutralized beams are directed towards the substrate support. A substrate power supply is configured to apply a voltage to the substrate support such that the remaining portion of the ions that is not converted into the neutralized beams is directed away from the substrate support by the applied voltage of the substrate.

    摘要翻译: 提供了一种使用中和束来处理衬底的设备和方法。 衬底处理装置包括被配置为形成离子源的离子源生成装置。 离子提取装置被配置为从离子源提取和加速离子。 离子中和装置被配置为将从离子提取装置提取和加速的离子转化成中和的束。 从离子提取装置提取和加速的离子的剩余部分不被转换成中和的束。 衬底支撑件被配置为支撑衬底,使得中和的光束被引向衬底支撑件。 衬底电源被配置为向衬底支撑件施加电压,使得未转换成中和束的离子的剩余部分通过衬底的施加电压被引导离开衬底支撑。