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公开(公告)号：US20120108439A1
公开(公告)日：2012-05-03
申请号：US13381191
申请日：2010-06-15
申请人： Hajime Ota , Masaya Konishi , Takashi Yamaguchi
发明人： Hajime Ota , Masaya Konishi , Takashi Yamaguchi
CPC分类号： H01L39/2461
摘要： The present invention relates to a method of producing a substrate, including the steps of preparing a substrate having a nickel layer formed on a copper layer through plating, subjecting the nickel layer to thermal treatment at 800-1000° C., and epitaxial-growing an intermediate layer on the nickel layer, after the step of subjecting the nickel layer to thermal treatment. According to the present invention, there can be provided a substrate that allows the orientation and flatness at the surface of a nickel layer to be improved, and a method of producing the substrate.
摘要翻译： 本发明涉及一种制造基板的方法，包括以下步骤：通过电镀制备具有在铜层上形成的镍层的基板，对镍层进行800-1000℃的热处理和外延生长 在对镍层进行热处理的步骤之后的镍层上的中间层。 根据本发明，可以提供能够提高镍层表面的取向性和平坦性的基板，以及制造基板的方法。
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公开(公告)号：US09306147B2
公开(公告)日：2016-04-05
申请号：US13381191
申请日：2010-06-15
申请人： Hajime Ota , Masaya Konishi , Takashi Yamaguchi
发明人： Hajime Ota , Masaya Konishi , Takashi Yamaguchi
IPC分类号： H01L39/24
CPC分类号： H01L39/2461
摘要： The present invention relates to a method of producing a substrate, including the steps of preparing a substrate having a nickel layer formed on a copper layer through plating, subjecting the nickel layer to thermal treatment at 800-1000° C., and epitaxial-growing an intermediate layer on the nickel layer, after the step of subjecting the nickel layer to thermal treatment. According to the present invention, there can be provided a substrate that allows the orientation and flatness at the surface of a nickel layer to be improved, and a method of producing the substrate.
摘要翻译： 本发明涉及一种制造基板的方法，包括以下步骤：通过电镀制备具有在铜层上形成的镍层的基板，对镍层进行800-1000℃的热处理和外延生长 在对镍层进行热处理的步骤之后的镍层上的中间层。 根据本发明，可以提供能够提高镍层表面的取向性和平坦性的基板，以及制造基板的方法。
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3.发明申请SUBSTRATE, METHOD OF PRODUCING SUBSTRATE, SUPERCONDUCTING WIRE, AND METHOD OF PRODUCING SUPERCONDUCTING WIRE 有权基板，制造基板的方法，超导电线以及生产超导线的方法公开(公告)号：US20120108436A1
公开(公告)日：2012-05-03
申请号：US13381109
申请日：2010-07-07
申请人： Takashi Yamaguchi , Masaya Konishi , Hajime Ota
发明人： Takashi Yamaguchi , Masaya Konishi , Hajime Ota
CPC分类号： H01B12/06 , H01L39/2461 , Y02E40/642 , Y10T428/12458 , Y10T428/12611 , Y10T428/12903
摘要： A substrate of the present invention includes a copper layer, an alloy layer containing copper and nickel, formed on the copper layer, a nickel layer formed on the alloy layer, and an intermediate layer formed on the nickel layer. The concentration of nickel in the alloy layer at the interface between the alloy layer and the nickel layer is greater than the concentration of nickel in the alloy layer at the interface between the alloy layer and the copper layer. According to the present invention, there can be provided a substrate that allows the AC loss of a superconducting wire to be reduced, a method of producing a substrate, a superconducting wire, and a method of producing a superconducting wire.
摘要翻译： 本发明的基板包括在铜层上形成的铜层，含有铜和镍的合金层，在合金层上形成的镍层和形成在镍层上的中间层。 合金层与镍层界面处合金层中的镍浓度大于合金层与铜层界面处合金层中镍的浓度。 根据本发明，可以提供一种能够减少超导线材的AC损耗的基板，制造基板的方法，超导线材以及超导线材的制造方法。
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4.发明授权Substrate, method of producing substrate, superconducting wire, and method of producing superconducting wire 有权基板，基板的制造方法，超导线以及超导线的制造方法公开(公告)号：US08912126B2
公开(公告)日：2014-12-16
申请号：US13381109
申请日：2010-07-07
申请人： Takashi Yamaguchi , Masaya Konishi , Hajime Ota
发明人： Takashi Yamaguchi , Masaya Konishi , Hajime Ota
CPC分类号： H01B12/06 , H01L39/2461 , Y02E40/642 , Y10T428/12458 , Y10T428/12611 , Y10T428/12903
摘要： A substrate of the present invention includes a copper layer, an alloy layer containing copper and nickel, formed on the copper layer, a nickel layer formed on the alloy layer, and an intermediate layer formed on the nickel layer. The concentration of nickel in the alloy layer at the interface between the alloy layer and the nickel layer is greater than the concentration of nickel in the alloy layer at the interface between the alloy layer and the copper layer. According to the present invention, there can be provided a substrate that allows the AC loss of a superconducting wire to be reduced, a method of producing a substrate, a superconducting wire, and a method of producing a superconducting wire.
摘要翻译： 本发明的基板包括在铜层上形成的铜层，含有铜和镍的合金层，在合金层上形成的镍层和形成在镍层上的中间层。 合金层与镍层界面处合金层中的镍浓度大于合金层与铜层界面处合金层中镍的浓度。 根据本发明，可以提供一种能够减少超导线材的AC损耗的基板，制造基板的方法，超导线材以及超导线材的制造方法。
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5.发明授权公开(公告)号：US08993064B2
公开(公告)日：2015-03-31
申请号：US13510406
申请日：2010-11-12
申请人： Hironao Okayama , Kouji Nanbu , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuhiko Hayashi , Kazuya Ohmatsu
发明人： Hironao Okayama , Kouji Nanbu , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuhiko Hayashi , Kazuya Ohmatsu
CPC分类号： C22C9/00 , B32B15/015 , C21D8/1255 , C22C19/03 , C22C38/007 , C22C38/40 , C22F1/08 , H01L39/2454 , Y10T428/12903 , Y10T428/12924 , Y10T428/12979
摘要： Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
摘要翻译： 提供了一种用于超导化合物的基板和用于制造基板的方法，其可以在铜的高取向同时实现优异的粘合强度。 通过对铜箔的表面进行溅射蚀刻，去除在90％以上的卷取条件下施加轧制的铜箔的表面上的吸收材料，对非磁性金属板进行溅射蚀刻，铜箔 并且通过使用还原辊对铜箔和金属板施加压力来将金属片彼此接合，铜箔中的铜的晶体通过加热由这种键合形成的层叠体而取向，铜扩散到 金属片通过加热铜扩散距离为10nm以上，并且保护层层压到层叠体的铜箔的表面。
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6.发明申请公开(公告)号：US20120208703A1
公开(公告)日：2012-08-16
申请号：US13383957
申请日：2010-07-08
申请人： Hironao Okayama , Teppei Kurokawa , Kouji Nanbu , Yoshihiko Isobe , Takashi Koshiro , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuya Ohmastu
发明人： Hironao Okayama , Teppei Kurokawa , Kouji Nanbu , Yoshihiko Isobe , Takashi Koshiro , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuya Ohmastu
CPC分类号： H01L39/2454 , B32B15/01 , B32B15/015 , B32B15/04 , B32B15/20 , C22C9/00 , C22F1/08
摘要： A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
摘要翻译： 在将氧化物超导线材的金属层压基板在以90％以上的牵伸下施加轧制的铜箔保持在低于再结晶温度的温度的状态下，除去表面上的吸收材料， 通过对铜箔的表面进行溅射蚀刻; 通过对非磁性金属片的表面进行溅射蚀刻，去除非磁性金属片表面上的吸收材料; 在300MPa〜1500MPa的施加压力下通过还原辊将铜箔和金属板彼此接合; 通过加热通过在铜或更高的晶体取向温度下接合获得的层压体来取向铜的晶体; 并通过涂布在层叠体的铜侧表面上形成保护层。
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7.发明授权公开(公告)号：US08815777B2
公开(公告)日：2014-08-26
申请号：US13383957
申请日：2010-07-08
申请人： Hironao Okayama , Teppei Kurokawa , Kouji Nanbu , Yoshihiko Isobe , Takashi Koshiro , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuya Ohmastu
发明人： Hironao Okayama , Teppei Kurokawa , Kouji Nanbu , Yoshihiko Isobe , Takashi Koshiro , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuya Ohmastu
IPC分类号： H01L39/24
CPC分类号： H01L39/2454 , B32B15/01 , B32B15/015 , B32B15/04 , B32B15/20 , C22C9/00 , C22F1/08
摘要： A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
摘要翻译： 在将氧化物超导线材的金属层压基板在以90％以上的牵伸下施加轧制的铜箔保持在低于再结晶温度的温度的状态下，除去表面上的吸收材料， 通过对铜箔的表面进行溅射蚀刻; 通过对非磁性金属片的表面进行溅射蚀刻，去除非磁性金属片表面上的吸收材料; 在300MPa〜1500MPa的施加压力下通过还原辊将铜箔和金属板彼此接合; 通过加热通过在铜或更高的晶体取向温度下接合获得的层压体来取向铜的晶体; 并通过涂布在层叠体的铜侧表面上形成保护层。
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8.发明申请公开(公告)号：US20130040821A1
公开(公告)日：2013-02-14
申请号：US13510406
申请日：2010-11-12
申请人： Hironao Okayama , Kouji Nanbu , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuhiko Hayashi , Kazuya Ohmatsu
发明人： Hironao Okayama , Kouji Nanbu , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuhiko Hayashi , Kazuya Ohmatsu
CPC分类号： C22C9/00 , B32B15/015 , C21D8/1255 , C22C19/03 , C22C38/007 , C22C38/40 , C22F1/08 , H01L39/2454 , Y10T428/12903 , Y10T428/12924 , Y10T428/12979
摘要： Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of lOnm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
摘要翻译： 提供了一种用于超导化合物的基板和用于制造基板的方法，其可以在铜的高取向同时实现优异的粘合强度。 通过对铜箔的表面进行溅射蚀刻，去除在90％以上的卷取条件下施加轧制的铜箔的表面上的吸收材料，对非磁性金属板进行溅射蚀刻，铜箔 并且通过使用还原辊对铜箔和金属板施加压力来将金属片彼此接合，铜箔中的铜的晶体通过加热由这种键合形成的层叠体而取向，铜扩散到 金属片通过加热至100nm以上的铜扩散距离，并且在层叠体的铜箔的表面上层叠保护层。
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公开(公告)号：US09184435B2
公开(公告)日：2015-11-10
申请号：US13569319
申请日：2012-08-08
申请人： Akihisa Hosoe , Kazuki Okuno , Hajime Ota , Koutarou Kimura , Kengo Goto , Junichi Nishimura , Hideaki Sakaida
发明人： Akihisa Hosoe , Kazuki Okuno , Hajime Ota , Koutarou Kimura , Kengo Goto , Junichi Nishimura , Hideaki Sakaida
CPC分类号： H01M4/0416 , H01M4/661 , H01M4/745 , H01M4/806 , H01M4/808 , H01M10/052 , H01M10/399 , Y02E60/122 , Y02P70/54 , Y10T29/49993
摘要： The method for producing an electrode for an electrochemical element of the present invention includes a slurry filling step of filling a slurry containing an active material into continuous pores of an aluminum porous body having the continuous pores, and a slurry drying step of drying the slurry filled, and in this method, after the slurry drying step, an electrode for an electrochemical element is produced without undergoing a compressing step of compressing the aluminum porous body having the slurry filled therein and dried. In the electrode, a mixture containing an active material is filled into continuous pores of an aluminum porous body having the continuous pores, and porosity (%) of the aluminum porous body, the porosity being represented by the following equation, is 15 to 55%. Porosity(%)={1−(volume of electrode material)/(apparent volume of electrode)}×100
摘要翻译： 本发明的电化学元件用电极的制造方法包括：将含有活性物质的浆料填充到具有连续孔的铝多孔体的连续孔中的浆料填充工序，以及浆料干燥工序， ，并且在该方法中，在浆料干燥步骤之后，制造用于电化学元件的电极，而不进行压缩填充有浆料的铝多孔体并干燥的压缩步骤。 在电极中，将含有活性物质的混合物填充到具有连续孔的铝多孔体的连续孔中，并且铝多孔体的孔隙率（％）由下式表示为15〜55％ 。 孔隙率（％）= {1-（电极材料的体积）/（电极的表观体积）}×100
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10.发明申请TERMINAL CONNECTOR, ELECTRIC WIRE WITH TERMINAL CONNECTOR, AND METHOD OF CONNECTING TERMINAL CONNECTOR AND ELECTRIC WIRE 有权端子连接器，带有端子连接器的电线，以及连接终端连接器和电线的方法公开(公告)号：US20140224535A1
公开(公告)日：2014-08-14
申请号：US14241744
申请日：2012-08-30
申请人： Takuji Otsuka , Hiroki Hirai , Junichi Ono , Kingo Furukawa , Teruyoshi Munekata , Hajime Ota , Yoshihiro Nakai , Taichiro Nishikawa , Tetsuya Kuwabara , Yoshiyuki Takaki , Hiroyuki Kobayashi
发明人： Takuji Otsuka , Hiroki Hirai , Junichi Ono , Kingo Furukawa , Teruyoshi Munekata , Hajime Ota , Yoshihiro Nakai , Taichiro Nishikawa , Tetsuya Kuwabara , Yoshiyuki Takaki , Hiroyuki Kobayashi
IPC分类号： H01R4/18 , H01R43/048 , H01B1/02
CPC分类号： H01R4/18 , H01B1/02 , H01R4/185 , H01R4/62 , H01R13/03 , H01R43/048 , H01R43/0482 , Y10T29/49185
摘要： An object is to obtain a stable electric connection resistance under a mild crimping condition. The present invention is a terminal connector 12 that includes a crimp portion 30 to be crimped to an electric wire. The crimp portion 30 includes a base material, an aluminum layer or an aluminum alloy layer a surface on the base material, and a hard layer on a surface of the aluminum layer or the aluminum alloy layer. The hard layer is harder than the base material. The present invention may be an electric wire with a terminal connector 10 that includes the above terminal connector 12 and a covered electric wire 40 that includes a core wire 42 made of aluminum or aluminum alloy. The crimp portion 30 of the terminal connector 12 is crimped to the core wire 42.
摘要翻译： 目的是在温和的压接条件下获得稳定的电连接电阻。 本发明是一种端子连接器12，其包括被压接到电线的压接部分30。 压接部30包括基材的基材，铝层或铝合金层，以及铝层或铝合金层的表面上的硬质层。 硬质层比基材硬。 本发明可以是具有包括上述端子连接器12的端子连接器10和包括由铝或铝合金制成的芯线42的被覆电线40的电线。 端子连接器12的压接部分30被压接到芯线42。
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