公开(公告)号：US20120267647A1

公开(公告)日：2012-10-25

申请号：US13452561

申请日：2012-04-20

申请人： Hak Hwan KIM ,  Kyung Mi Moon ,  Ho Sun Paek ,  Young Hee Song

发明人： Hak Hwan KIM ,  Kyung Mi Moon ,  Ho Sun Paek ,  Young Hee Song

IPC分类号： H01L33/50

CPC分类号： H01L33/502 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

摘要： A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.

摘要翻译： 提供了可应用于各种应用的发光器件（LED）模块及其制造方法。 通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量，可以提高价格竞争力。 在制造LED模块的方法中，通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作，可以最小化和简化操作。 可以通过使用金属材料作为基板和凸块来增强散热特性。

公开(公告)号：US20120241797A1

公开(公告)日：2012-09-27

申请号：US13428726

申请日：2012-03-23

申请人： Hak Hwan KIM ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

发明人： Hak Hwan KIM ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

IPC分类号： H01L33/50

CPC分类号： H01L33/62 ,  H01L21/568 ,  H01L33/505 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/83

摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

摘要翻译： 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

公开(公告)号：US20120007120A1

公开(公告)日：2012-01-12

申请号：US13181007

申请日：2011-07-12

申请人： Hak Hwan KIM ,  Ho Sun Paek ,  Hyung Kun Kim ,  Sung Kyong Oh ,  Jong In Yang

发明人： Hak Hwan KIM ,  Ho Sun Paek ,  Hyung Kun Kim ,  Sung Kyong Oh ,  Jong In Yang

IPC分类号： H01L33/58 ,  H01L33/50

CPC分类号： H01L33/58 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/385

摘要： Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.

摘要翻译： 公开了一种发光器件及其制造方法。 发光装置包括：基板; 发光结构，其设置在所述基板上，并具有其中层叠有第一导电类型半导体层，有源层和第二导电类型半导体层的堆叠结构; 设置在所述发光结构上的透镜; 以及分别电连接到第一导电类型半导体层和第二导电类型半导体层的第一端子部分和第二端子部分。 第一和第二端子部分中的至少一个从发光结构的顶表面沿着发光结构和基板的相应侧表面延伸。

公开(公告)号：US20130051069A1

公开(公告)日：2013-02-28

申请号：US13594014

申请日：2012-08-24

申请人： Kyung Mi MOON ,  Hak Hwan KIM

发明人： Kyung Mi MOON ,  Hak Hwan KIM

IPC分类号： F21V8/00 ,  H01L33/58

CPC分类号： G02B6/0021 ,  G02F1/133615 ,  H01L33/58

摘要： A backlight unit (BLU) is disclosed. The BLU may include a light emitting diode (LED) module including at least one LED chip mounted on a substrate in a chip-on-board (COB) type, and a light guide panel including an incidence surface configured to receive light emitted from an emission surface of the LED chip and to include at least one insertion recess disposed corresponding to the LED chip, such that the LED chip is bonded to the LED module to be inserted in the insertion recess.

摘要翻译： 公开了一种背光单元（BLU）。 BLU可以包括发光二极管（LED）模块，其包括安装在基板上（COB）类型的基板上的至少一个LED芯片，以及导光板，其包括入射表面，该入射表面被配置为接收从 并且包括与LED芯片相对设置的至少一个插入凹槽，使得LED芯片被结合到LED模块以插入插入凹部中。

公开(公告)号：US20140339581A1

公开(公告)日：2014-11-20

申请号：US14274497

申请日：2014-05-09

申请人： Yong Min KWON ,  Hak Hwan KIM ,  Min Young SON ,  Sung Jun IM

发明人： Yong Min KWON ,  Hak Hwan KIM ,  Min Young SON ,  Sung Jun IM

IPC分类号： H01L33/64 ,  H01L33/50 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L33/382 ,  H01L33/0079 ,  H01L33/20 ,  H01L33/50

摘要： A semiconductor light emitting device package is provided having a light transmissive substrate, and a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially laminated on the light transmissive substrate. The light emitting structure comprises a first surface and a second opposing surface facing the light transmissive substrate. The semiconductor light emitting device package comprises a via penetrating the second conductivity-type semiconductor layer and the active layer, and exposing the first conductivity-type semiconductor layer. A first electrode has a first portion disposed on the first surface, and a second portion extending into the via and contacting the first conductivity-type semiconductor layer. An insulating layer is disposed between the first electrode, and each of the second conductivity type semiconductor layer, the active layer, and the first surface. A second electrode is disposed on the first surface.

摘要翻译： 提供一种半导体发光器件封装，其具有透光性基板，以及包括依次层叠在透光性基板上的第一导电型半导体层，有源层和第二导电型半导体层的发光结构。 发光结构包括面向透光基板的第一表面和第二相对表面。 半导体发光器件封装包括穿透第二导电型半导体层和有源层的通孔，并露出第一导电型半导体层。 第一电极具有设置在第一表面上的第一部分和延伸到通孔中并与第一导电类型半导体层接触的第二部分。 绝缘层设置在第一电极和第二导电类型半导体层，有源层和第一表面之间。 第二电极设置在第一表面上。

公开(公告)号：US20080120058A1

公开(公告)日：2008-05-22

申请号：US11780152

申请日：2007-07-19

申请人： Hak Hwan KIM

发明人： Hak Hwan KIM

IPC分类号： G01R31/00 ,  G06F19/00

CPC分类号： G06F11/2236

摘要： A mobile terminal equipped with multiple CPUs and a system and method for testing multiple CPUs of the mobile terminal are provided. A mobile terminal of the present invention includes test ports installed in processors, respectively, an earphone port, a first interface connector to connect an external device to the mobile terminal, a first switch to selectively connect the first interface connector to the earphone port and at least one of the test ports, a second interface connector to connect the external device to the mobile terminal, and a second switch to selectively connect the second interface connector to the remaining test ports.

摘要翻译： 提供了一种配备有多个CPU的移动终端以及用于测试移动终端的多个CPU的系统和方法。 本发明的移动终端包括分别安装在处理器中的测试端口，耳机端口，将外部设备连接到移动终端的第一接口连接器，用于选择性地将第一接口连接器连接到耳机端口的第一开关 至少一个测试端口，用于将外部设备连接到移动终端的第二接口连接器，以及用于选择性地将第二接口连接器连接到其余测试端口的第二开关。