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16 条记录 (耗时 0.018 秒)

    Low cost programmable CPU package/substrate
    1.
    发明授权
    Low cost programmable CPU package/substrate 失效
    低成本可编程CPU封装/基板

    公开(公告)号：US07005727B2

    公开(公告)日：2006-02-28

    申请号：US10234030

    申请日：2002-09-03

    申请人： Hamid Azimi ,  Debabrata Gupta ,  Saliya Witharana

    发明人： Hamid Azimi ,  Debabrata Gupta ,  Saliya Witharana

    IPC分类号： H01L23/58

    CPC分类号： H01L21/485 ,  H01L23/5382 ,  H01L2924/0002 ,  Y10S257/91 ,  H01L2924/00

    摘要： A programmable package with a fuse embedded therein, and fabrication method are provided. The fuse has first and second terminal ends joined by a central portion defining a fusible link. The ends include a portion of the first and second conductive layers, the central portion including a portion of the first conductive layer. The first layer may be electroless copper and the second layer may be electrolytic copper. The fuse may have a dog-bone or a bow tie shape. The method includes providing a substrate with a dielectric layer, and forming the fuse by depositing first conductive layer, forming and patterning second conductive layer over a portion of the first layer, and patterning first layer to form interconnects between areas of the second layer.

    摘要翻译： 提供了嵌入其中的熔丝的可编程封装以及制造方法。 保险丝具有由限定可熔连接件的中心部分连接的第一和第二端部。 端部包括第一和第二导电层的一部分，中心部分包​​括第一导电层的一部分。 第一层可以是无电解铜，第二层可以是电解铜。 保险丝可能具有狗骨或蝴蝶结的形状。 该方法包括：提供具有电介质层的衬底，以及通过沉积第一导电层形成熔丝，在第一层的一部分上形成和图案化第二导电层，以及图案化第一层以在第二层的区域之间形成互连。

    Method of forming copper layers
    2.
    发明授权
    Method of forming copper layers 有权
    形成铜层的方法

    公开(公告)号：US07413936B2

    公开(公告)日：2008-08-19

    申请号：US11269955

    申请日：2005-11-09

    申请人： Hamid Azimi ,  Debabrata Gupta ,  Saliya Witharana

    发明人： Hamid Azimi ,  Debabrata Gupta ,  Saliya Witharana

    IPC分类号： H01L21/82

    CPC分类号： H01L21/485 ,  H01L23/5382 ,  H01L2924/0002 ,  Y10S257/91 ,  H01L2924/00

    摘要： A programmable package with a fuse embedded therein, and fabrication method are provided. The fuse has first and second terminal ends joined by a central portion defining a fusible link. The ends include a portion of the first and second conductive layers, the central portion including a portion of the first conductive layer. The first layer may be electroless copper and the second layer may be electrolytic copper. The fuse may have a dog-bone or a bow tie shape. The method includes providing a substrate with a dielectric layer, and forming the fuse by depositing first conductive layer, forming and patterning second conductive layer over a portion of the first layer, and patterning first layer to form interconnects between areas of the second layer.

    摘要翻译： 提供了嵌入其中的熔丝的可编程封装以及制造方法。 保险丝具有由限定可熔连接件的中心部分连接的第一和第二端部。 端部包括第一和第二导电层的一部分，中心部分包​​括第一导电层的一部分。 第一层可以是无电解铜，第二层可以是电解铜。 保险丝可能具有狗骨或蝴蝶结的形状。 该方法包括：提供具有电介质层的衬底，以及通过沉积第一导电层形成熔丝，在第一层的一部分上形成和图案化第二导电层，以及图案化第一层以在第二层的区域之间形成互连。

    Low cost programmable CPU package/substrate
    3.
    发明申请
    Low cost programmable CPU package/substrate 有权

    公开(公告)号：US20060060946A1

    公开(公告)日：2006-03-23

    申请号：US11269955

    申请日：2005-11-09

    申请人： Hamid Azimi ,  Debabrata Gupta ,  Saliya Witharana

    发明人： Hamid Azimi ,  Debabrata Gupta ,  Saliya Witharana

    IPC分类号： H01L23/62

    CPC分类号： H01L21/485 ,  H01L23/5382 ,  H01L2924/0002 ,  Y10S257/91 ,  H01L2924/00

    摘要： A programmable package with a fuse embedded therein, and fabrication method are provided. The fuse has first and second terminal ends joined by a central portion defining a fusible link. The ends include a portion of the first and second conductive layers, the central portion including a portion of the first conductive layer. The first layer may be electroless copper and the second layer may be electrolytic copper. The fuse may have a dog-bone or a bow tie shape. The method includes providing a substrate with a dielectric layer, and forming the fuse by depositing first conductive layer, forming and patterning second conductive layer over a portion of the first layer, and patterning first layer to form interconnects between areas of the second layer.

    Process for decarburizing alloy melts
    9.
    发明授权
    Process for decarburizing alloy melts 失效
    脱碳合金熔体的工艺

    公开(公告)号：US4472195A

    公开(公告)日：1984-09-18

    申请号：US523250

    申请日：1983-08-15

    申请人： Debabrata Gupta ,  John C. Yarwood

    发明人： Debabrata Gupta ,  John C. Yarwood

    IPC分类号： C21C7/072 ,  C21C5/00 ,  C21C5/35 ,  C21C5/56 ,  C22B9/05 ,  C21C7/00

    CPC分类号： C21C5/35 ,  C21C5/005 ,  C21C5/56

    摘要： The present invention relates to either a batch or continuous process for decarburization of metals and metal alloys. A shallow melt of metal or metal alloy having a depth of between about 2 in. to about 24 in. is provided. The carbon content of the melt is reduced from its initial value to a range of about 0.3 to 0.1 wt. % carbon. To accomplish this reduction, an oxygen enriched gas is blown onto the surface of the melt at a velocity of about 10 to about 50% of supersonic velocity so as to decarburize the melt without creating any substantial splashing of the melt. At the same time, the melt is stirred by injecting an inert gas below the melt surface. Subsequently, the carbon content of the melt is further reduced from the carbon percentage achieved in the first reduction to a value of not less than about 0.001 wt. % carbon. This latter step is accomplished by injecting a gas mixture comprising an oxygen enriched gas and an inert gas having a ratio of between about 4:1 oxygen enriched gas to inert gas to about 1:10 oxygen enriched gas to inert gas below the surface of the melt for both decarburizing and stirring the melt.

    摘要翻译： 本发明涉及用于金属和金属合金的脱碳的间歇或连续方法。 提供深度在约2英寸至约24英寸之间的金属或金属合金的浅熔体。 熔体的碳含量从其初始值降低至约0.3至0.1重量％的范围。 ％ 碳。 为了实现这种还原，将富氧气体以超音速约10至约50％的速度吹到熔体的表面上，以使熔体脱碳而不产生熔体的任何明显的飞溅。 同时，通过在熔体表面下方注入惰性气体来搅拌熔体。 随后，熔体的碳含量从第一次还原中所得的碳百分比进一步降低至不小于约0.001wt。 ％ 碳。 后一步骤是通过将包含富氧气体和惰性气体的惰性气体与惰性气体之间的惰性气体与大约1:10富氧气体的惰性气体注入到位于 熔化，用于脱碳和搅拌熔体。