公开(公告)号：US08142240B2

公开(公告)日：2012-03-27

申请号：US12805214

申请日：2010-07-19

申请人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

发明人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

IPC分类号： H01R4/02

CPC分类号： H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

摘要： Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

摘要翻译： 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。

公开(公告)号：US20110014827A1

公开(公告)日：2011-01-20

申请号：US12805214

申请日：2010-07-19

申请人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

发明人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

IPC分类号： H01R13/04

CPC分类号： H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

摘要： Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

摘要翻译： 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。

公开(公告)号：US20110014826A1

公开(公告)日：2011-01-20

申请号：US12805211

申请日：2010-07-19

申请人： Ki Taek Lee ,  Heung Jae Oh ,  Sung Won Jeong ,  Jin Won Choi

发明人： Ki Taek Lee ,  Heung Jae Oh ,  Sung Won Jeong ,  Jin Won Choi

IPC分类号： H01R13/04

CPC分类号： H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate that is bonded to a package substrate by interposing a solder paste between the lead pin for the package substrate and the package substrate, the lead pin for the package substrate including: a cylindrical connection pin; and a head part that is formed on one end of the connection pin, wherein the head part includes a disk shaped flange part, and a round part that is formed on one surface of the flange part and is configured to include first and second curved surfaces having different radii of curvature, the first and second curved surfaces each having different radii of curvature selected from a range of 1:0.1 to 1:5 as compared to a diameter of the connection pin.

摘要翻译： 这里公开了一种用于封装衬底的引脚。 通过在封装基板的引脚和封装基板之间插入焊膏将封装基板接合到封装基板的引脚，所述封装基板的引脚包括：圆筒形连接引脚; 以及头部，其形成在所述连接销的一端上，其中所述头部包括盘形凸缘部，以及形成在所述凸缘部的一个表面上并且构造成包括第一和第二弯曲表面的圆形部分 具有不同的曲率半径，与连接销的直径相比，第一和第二曲面各自具有不同的曲率半径，其范围为1：0.1至1：5。

公开(公告)号：US08159064B2

公开(公告)日：2012-04-17

申请号：US12926626

申请日：2010-11-30

申请人： Heung Jae Oh ,  Jin Won Choi ,  Ki Taek Lee

发明人： Heung Jae Oh ,  Jin Won Choi ,  Ki Taek Lee

IPC分类号： H01L23/48

CPC分类号： H05K3/4015 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/10704

摘要： Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an opposite side to the one surface; and a connection pin having a pin shape bonded to the other surface of the head part, wherein the head part has a concave depression part toward the package substrate.

摘要翻译： 这里公开了一种用于封装衬底的引脚。 根据本发明的示例性实施例的封装基板的引脚包括具有与封装基板相对的一个表面和与该表面相对的另一个表面的头部; 以及具有与所述头部的另一个表面接合的销形状的连接销，其中，所述头部具有朝向所述封装基板的凹陷部。

公开(公告)号：US20120043653A1

公开(公告)日：2012-02-23

申请号：US12926626

申请日：2010-11-30

申请人： Heung Jae Oh ,  Jin Won Choi ,  Ki Taek Lee

发明人： Heung Jae Oh ,  Jin Won Choi ,  Ki Taek Lee

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H05K3/4015 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/10704

摘要： Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an opposite side to the one surface; and a connection pin having a pin shape bonded to the other surface of the head part, wherein the head part has a concave depression part toward the package substrate.

摘要翻译： 这里公开了一种用于封装衬底的引脚。 根据本发明的示例性实施例的封装基板的引脚包括具有与封装基板相对的一个表面和与该表面相对的另一个表面的头部; 以及具有与所述头部的另一个表面接合的销形状的连接销，其中，所述头部具有朝向所述封装基板的凹陷部。

公开(公告)号：US20110068473A1

公开(公告)日：2011-03-24

申请号：US12805559

申请日：2010-08-05

申请人： Ki Taek Lee ,  Hueng Jae OH ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

发明人： Ki Taek Lee ,  Hueng Jae OH ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

IPC分类号： H01L23/498 ,  H01B5/00

CPC分类号： H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

摘要翻译： 提供了一种用于封装基板的引脚，包括：连接销插入形成在外部基板中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。

公开(公告)号：US08766450B2

公开(公告)日：2014-07-01

申请号：US12805559

申请日：2010-08-05

申请人： Ki Taek Lee ,  Hueng Jae Oh ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

发明人： Ki Taek Lee ,  Hueng Jae Oh ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

IPC分类号： H01L23/28

CPC分类号： H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

摘要翻译： 提供了一种用于封装基板的引脚，包括：连接销插入形成在外部基板中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。

公开(公告)号：US08822841B2

公开(公告)日：2014-09-02

申请号：US13411168

申请日：2012-03-02

申请人： Dong Gyu Lee ,  Jin Won Choi ,  Sung Won Jeong ,  Dae Young Lee ,  Gi Sub Lee ,  Jin Ho Kim

发明人： Dong Gyu Lee ,  Jin Won Choi ,  Sung Won Jeong ,  Dae Young Lee ,  Gi Sub Lee ,  Jin Ho Kim

IPC分类号： H05K1/11 ,  H01K3/10

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/10145 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2224/05552

摘要： Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

摘要翻译： 这里公开了一种封装基板及其制造方法。 封装衬底包括：衬底，其包括至少一个导电焊盘，形成在衬底上的绝缘层，并且包括导电焊盘暴露的开口，沿着通过开口暴露的导电焊盘的顶表面形成的防泡层， 绝缘层的侧壁，由至少一种合金材料制成并形成在防泡层上的金属柱以及形成在金属柱上的热扩散防止膜。

公开(公告)号：US20120267285A1

公开(公告)日：2012-10-25

申请号：US13411168

申请日：2012-03-02

申请人： Dong Gyu LEE ,  Jin Won Choi ,  Sung Won Jeong ,  Dae Young Lee ,  Gi Sub Lee ,  Jin Ho Kim

发明人： Dong Gyu LEE ,  Jin Won Choi ,  Sung Won Jeong ,  Dae Young Lee ,  Gi Sub Lee ,  Jin Ho Kim

IPC分类号： B65D85/00 ,  B65B1/04

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/10145 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2224/05552

摘要： Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

摘要翻译： 这里公开了一种封装基板及其制造方法。 封装衬底包括：衬底，其包括至少一个导电焊盘，形成在衬底上的绝缘层，并且包括导电焊盘暴露的开口，沿着通过开口暴露的导电焊盘的顶表面形成的防泡层， 绝缘层的侧壁，由至少一种合金材料制成并形成在防泡层上的金属柱以及形成在金属柱上的热扩散防止膜。

公开(公告)号：US08420955B2

公开(公告)日：2013-04-16

申请号：US12805413

申请日：2010-07-29

申请人： Jin Won Choi ,  Seung Jean Moon ,  Ki Taek Lee

发明人： Jin Won Choi ,  Seung Jean Moon ,  Ki Taek Lee

IPC分类号： H05K1/11 ,  H05K7/00 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing prevention portion is formed on the top surface of the head portion and prevents a solder paste from flowing toward the coupling pin on the top surface of the head portion when the head portion is mounted on the package substrate.

摘要翻译： 用于封装衬底的引脚包括耦合销，头部和防止流动部分。 连接销插入到形成在外部基板中的孔中。 头部形成在连接销的一端。 当头部安装在封装基板上时，流动防止部分形成在头部的顶表面上，并防止焊膏朝向头部的顶表面上的连接销流动。