利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

11 条记录 (耗时 0.034 秒)

    Lead pin for package substrate
    1.
    发明授权
    Lead pin for package substrate 失效
    封装基板引脚

    公开(公告)号：US08142240B2

    公开(公告)日：2012-03-27

    申请号：US12805214

    申请日：2010-07-19

    申请人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

    发明人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

    IPC分类号： H01R4/02

    CPC分类号： H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

    摘要： Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

    摘要翻译： 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。

    Lead pin for package substrate
    2.
    发明申请
    Lead pin for package substrate 失效
    封装基板引脚

    公开(公告)号：US20110014827A1

    公开(公告)日：2011-01-20

    申请号：US12805214

    申请日：2010-07-19

    申请人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

    发明人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

    IPC分类号： H01R13/04

    CPC分类号： H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

    摘要： Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

    摘要翻译： 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。

    Lead pin for package substrate
    3.
    发明申请
    Lead pin for package substrate 审中-公开
    封装基板引脚

    公开(公告)号：US20110014826A1

    公开(公告)日：2011-01-20

    申请号：US12805211

    申请日：2010-07-19

    申请人： Ki Taek Lee ,  Heung Jae Oh ,  Sung Won Jeong ,  Jin Won Choi

    发明人： Ki Taek Lee ,  Heung Jae Oh ,  Sung Won Jeong ,  Jin Won Choi

    IPC分类号： H01R13/04

    CPC分类号： H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate that is bonded to a package substrate by interposing a solder paste between the lead pin for the package substrate and the package substrate, the lead pin for the package substrate including: a cylindrical connection pin; and a head part that is formed on one end of the connection pin, wherein the head part includes a disk shaped flange part, and a round part that is formed on one surface of the flange part and is configured to include first and second curved surfaces having different radii of curvature, the first and second curved surfaces each having different radii of curvature selected from a range of 1:0.1 to 1:5 as compared to a diameter of the connection pin.

    摘要翻译： 这里公开了一种用于封装衬底的引脚。 通过在封装基板的引脚和封装基板之间插入焊膏将封装基板接合到封装基板的引脚，所述封装基板的引脚包括：圆筒形连接引脚; 以及头部，其形成在所述连接销的一端上，其中所述头部包括盘形凸缘部，以及形成在所述凸缘部的一个表面上并且构造成包括第一和第二弯曲表面的圆形部分 具有不同的曲率半径，与连接销的直径相比，第一和第二曲面各自具有不同的曲率半径，其范围为1：0.1至1：5。

    Lead pin for package substrate
    4.
    发明申请
    Lead pin for package substrate 有权
    封装基板引脚

    公开(公告)号：US20110068473A1

    公开(公告)日：2011-03-24

    申请号：US12805559

    申请日：2010-08-05

    申请人： Ki Taek Lee ,  Hueng Jae OH ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

    发明人： Ki Taek Lee ,  Hueng Jae OH ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

    IPC分类号： H01L23/498 ,  H01B5/00

    CPC分类号： H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

    摘要翻译： 提供了一种用于封装基板的引脚，包括：连接销插入形成在外部基板中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。

    Lead pin for package substrate
    5.
    发明授权
    Lead pin for package substrate 有权
    封装基板引脚

    公开(公告)号：US08766450B2

    公开(公告)日：2014-07-01

    申请号：US12805559

    申请日：2010-08-05

    申请人： Ki Taek Lee ,  Hueng Jae Oh ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

    发明人： Ki Taek Lee ,  Hueng Jae Oh ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

    IPC分类号： H01L23/28

    CPC分类号： H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

    摘要翻译： 提供了一种用于封装基板的引脚，包括：连接销插入形成在外部基板中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。

    Package substrate
    8.
    发明申请
    Package substrate 审中-公开
    封装衬底

    公开(公告)号：US20110076472A1

    公开(公告)日：2011-03-31

    申请号：US12655516

    申请日：2009-12-30

    申请人： Jin Ho Kim ,  Seok Kyu Lee ,  Jae Joon Lee ,  Sung Won Jeong

    发明人： Jin Ho Kim ,  Seok Kyu Lee ,  Jae Joon Lee ,  Sung Won Jeong

    IPC分类号： B32B7/02

    CPC分类号： H05K3/4682 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/0352 ,  H05K2201/068 ,  Y10T428/2495 ,  H01L2924/00

    摘要： Disclosed is a package substrate, in which the plating area of a first plating layer formed on a layer which is to be connected to a motherboard is larger than the plating area of a second plating layer formed on a layer which is to be connected to an electronic part, and the plating thickness of the second plating layer is greater than the plating thickness of the first plating layer, thus balancing the plating volumes of the plating layers formed on the layers of the package substrate, thereby minimizing warpage of the package substrate which results from the coefficients of thermal expansion being different.

    摘要翻译： 公开了一种封装基板，其中形成在要连接到母板的层上的第一镀层的电镀面积大于形成在要连接到母板的层上的第二镀层的镀覆面积 电子部分，并且第二镀层的镀层厚度大于第一镀层的镀层厚度，从而平衡形成在包装衬底的层上的镀层的镀层体积，从而最小化封装衬底的翘曲 来自热膨胀系数的结果不同。

    METHOD FOR MANUFACTURING RAZOR BLADE EDGE AND RAZOR BLADE FOR RAZOR
    9.
    发明申请
    METHOD FOR MANUFACTURING RAZOR BLADE EDGE AND RAZOR BLADE FOR RAZOR 审中-公开
    用于制造RAZOR叶片边缘和RAZOR刀片的方法

    公开(公告)号：US20130334033A1

    公开(公告)日：2013-12-19

    申请号：US14001380

    申请日：2012-02-28

    申请人： Sung Won Jeong

    发明人： Sung Won Jeong

    IPC分类号： C23C14/02

    CPC分类号： C23C14/028 ,  C23C14/06 ,  C23C14/225 ,  C23C14/3407

    摘要： The present invention relates to a method for manufacturing a razor blade edge and a razor blade for a razor, and more specifically, to a method for manufacturing razor blade edge of a razor blade provided with a light complex thin film having metallic and ceramic properties for improving durability and hardness. According to the present invention, the method comprises: a first step of heat-treating stainless steel; a second step of forming the razor blade edge by polishing the heat-treated stainless steel; and a third step of depositing a plurality of coating materials on the razor blade edge that is formed, wherein a sputtering device is used in the third step, the sputtering device being provided with a sputter target, and the sputtering target comprising a first ingredient and a second ingredient which are deposited on the razor blade edge and on the razor blade.

    摘要翻译： 本发明涉及一种用于剃刀的剃刀刀刃和剃刀刀片的制造方法，更具体地，涉及一种具有金属和陶瓷特性的具有金属和陶瓷性质的光复合薄膜的剃刀刀片的剃刀刀刃的制造方法， 提高耐久性和硬度。 根据本发明，该方法包括：对不锈钢进行热处理的第一步骤; 通过抛光热处理的不锈钢来形成剃刀刀刃的第二步骤; 以及在形成的剃刀刀片边缘上沉积多个涂层材料的第三步骤，其中在第三步骤中使用溅射装置，所述溅射装置设置有溅射靶，并且所述溅射靶包括第一成分和 第二成分沉积在剃刀刀片边缘和剃刀刀片上。