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1.发明申请Method for Processing Material by Laser Ablation and Material Processed by Processing Method Thereof 审中-公开通过激光烧蚀处理材料的方法及其加工方法加工材料公开(公告)号：US20090152246A1
公开(公告)日：2009-06-18
申请号：US11885459
申请日：2006-02-23
申请人： Hidehiko Mishima , Yasuhito Masuda , Yasuhiro Okuda , Kenichi Watatani , Shuji Sakabe , Masaki Hashida , Seiji Shimizu
发明人： Hidehiko Mishima , Yasuhito Masuda , Yasuhiro Okuda , Kenichi Watatani , Shuji Sakabe , Masaki Hashida , Seiji Shimizu
IPC分类号： B23K26/38
CPC分类号： B23K26/0624 , B23K2103/42 , B23K2103/50
摘要： In order to easily control the laser pulse width and perform high-precision processing, the method for processing a material by laser ablation according to the present invention is characterized in that the material having a region of which a double logarithmic chart shows a linearly-shaped line with a gradient of not more than 0.5, when a relationship between laser pulse width and ablation threshold is represented in the logarithmic chart with a laser pulse width in picosecond plotted along the horizontal axis and an ablation threshold in J/cm2 plotted along the vertical axis, is processed by the pulsed laser beam having the laser pulse width within the region.
摘要翻译： 为了容易地控制激光脉冲宽度并执行高精度处理，根据本发明的通过激光烧蚀处理材料的方法的特征在于，具有双对数图的区域的材料呈直线状 以激光脉冲宽度和消融阈值之间的关系在对数图中以沿着水平轴绘制的皮秒的激光脉冲宽度表示，并且以纵向绘制的消光阈值（J / cm 2）绘制在不大于0.5的梯度上 由具有该区域内的激光脉冲宽度的脉冲激光束进行处理。
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2.发明申请Microhole-Formed Stretched Porous Polytetrafluoroethylene Material and Production Process Thereof, and Abrasion Working Process 审中-公开微孔形拉伸多孔聚四氟乙烯材料及其制备工艺及磨损工艺公开(公告)号：US20080044637A1
公开(公告)日：2008-02-21
申请号：US10586876
申请日：2005-01-20
CPC分类号： H05K3/0032 , B23K26/0624 , B23K26/382 , B23K2101/40 , B23K2103/42 , B23K2103/50 , H05K2201/0116 , H05K2201/015 , Y10T428/249955
摘要： A microhole-formed stretched porous polytetrafluoroethylene material, in which a microhole having a hole diameter greater than an average pore diameter of a stretched porous polytetrafluoroethylene material is formed in the stretched porous polytetrafluoroethylene material by irradiation of a pulse laser beam having a pulse length of at most 10 picoseconds, and the microporous structure of the wall surface of the microhole is substantially retained without being destroyed, a production process thereof, and an abrasion working process.
摘要翻译： 微孔形拉伸多孔聚四氟乙烯材料，其中通过照射脉冲长度为at的脉冲激光束，在拉伸的多孔聚四氟乙烯材料中形成具有大于拉伸多孔聚四氟乙烯材料的平均孔径的孔直径的微孔 最多10皮秒，微孔壁面的微孔结构基本保持不被破坏，其制造过程和磨损加工过程。
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3.发明授权Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall faces 失效具有穿孔的多孔树脂基板的制造方法以及包括具有导电壁面的穿孔的多孔树脂基板的制造方法公开(公告)号：US07807066B2
公开(公告)日：2010-10-05
申请号：US11660993
申请日：2005-07-11
申请人： Mayo Uenoyama , Yasuhiro Okuda , Fumihiro Hayashi , Taro Fujita , Yasuhito Masuda , Yuichi Idomoto
发明人： Mayo Uenoyama , Yasuhiro Okuda , Fumihiro Hayashi , Taro Fujita , Yasuhito Masuda , Yuichi Idomoto
IPC分类号： B31D3/00
CPC分类号： H05K3/0055 , H05K3/426 , H05K2201/0116 , H05K2201/015 , H05K2203/0793 , H05K2203/0796
摘要： A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
摘要翻译： 一种穿孔多孔树脂基板的制造方法，其特征在于，包括以下步骤：在由含有树脂材料的树脂材料制成的多孔树脂基材中，从厚度方向从第一面到第二面形成至少一个穿孔的工序 氟聚合物; 通过将含有碱金属的蚀刻剂与每个穿孔的壁面接触进行蚀刻处理的步骤2; 和将可氧化化合物或其溶液与通过蚀刻处理产生的退化层接触的步骤3，从而除去退化层。 一种多孔树脂基板的制造方法，其中，对穿孔的壁面提供导电性。
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4.发明申请Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component 失效图案化多孔成型体或无纺布的制造方法以及电路部件公开(公告)号：US20070160810A1
公开(公告)日：2007-07-12
申请号：US10586341
申请日：2005-01-13
CPC分类号： B24C3/322 , B24C1/04 , B24C11/00 , C23C18/1605 , C23C18/1644 , C23C18/1651 , C23C18/1653 , C23C18/30 , H05K1/0284 , H05K3/107 , H05K3/182 , H05K3/184 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , H05K2201/0293 , H05K2201/09036 , H05K2201/09118 , H05K2203/025 , H05K2203/0565 , Y10T428/24479 , Y10T428/24496 , Y10T428/24612 , Y10T428/249953 , Y10T428/249987 , Y10T442/674
摘要： An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions. With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric. The invention provides a porous molded product or a nonwoven fabric in which a plated layer has been selectively formed on the surfaces of the through portions or the recessed portions, or both of these, an electric circuit component, or the like.
摘要翻译： 本发明的一个目的是提供一种多孔材料的制造方法，其中图形化了复杂而精细的通过部分，凹陷部分等。 提供一种图案化的多孔模制产品或非织造织物，其中已经在通孔部分和凹进部分的表面上选择性地形成镀层。 通过本发明，将具有图案部分的面罩放置在多孔成型品或无纺布的至少一侧。 含有磨粒的流体或流体从掩模上方喷射，从而形成通过部分或凹陷部分或两者，其中通过掩模的每个通过部分的开口形状被转移到多孔模制产品中 或无纺布。 本发明提供一种多孔成型体或非织造布，其中，在贯通部或凹部的表面，或这两者，电路部件等的表面上选择性地形成镀层。
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5.发明申请Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface 失效钻孔多孔树脂基材，以及具有导电钻孔内壁表面的多孔树脂基材的制造方法公开(公告)号：US20060141159A1
公开(公告)日：2006-06-29
申请号：US10559580
申请日：2004-06-04
申请人： Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga , Taro Fujita , Mayo Uenoyama , Yasuhito Masuda , Yuichi Idomoto
发明人： Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga , Taro Fujita , Mayo Uenoyama , Yasuhito Masuda , Yuichi Idomoto
IPC分类号： B05D1/40
CPC分类号： B29C44/5618 , B29C67/202 , H05K3/0011 , H05K3/0055 , H05K3/422 , H05K3/426 , H05K2201/0116 , H05K2201/015 , H05K2203/0565 , H05K2203/0769 , H05K2203/1147 , Y10T29/49167
摘要： A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.
摘要翻译： 一种穿孔多孔树脂基底的制造方法，包括：用液体或溶液浸渍多孔树脂基底的多孔结构的步骤1; 从液体或溶液浸渍形成固体物质的步骤2; 形成从多孔结构体内具有固体物质的多孔树脂基材的第一表面延伸到多孔树脂基材中的第二表面的多个穿孔的步骤3; 和步骤4，熔化或溶解固体物质以将其从多孔结构的内部除去，并且具有导电性的孔的内壁表面的多孔树脂基材的制造方法包括仅选择性地施加催化剂的步骤 到穿孔的内壁表面，以将导电金属施加到内壁表面。
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6.发明授权Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive. 失效穿孔多孔树脂基材和多孔树脂基底的生产过程，其内壁表面的穿孔导电。公开(公告)号：US08147911B2
公开(公告)日：2012-04-03
申请号：US10559580
申请日：2004-06-04
申请人： Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga , Taro Fujita , Mayo Uenoyama , Yasuhito Masuda , Yuichi Idomoto
发明人： Yasuhiro Okuda , Fumihiro Hayashi , Tsuyoshi Haga , Taro Fujita , Mayo Uenoyama , Yasuhito Masuda , Yuichi Idomoto
CPC分类号： B29C44/5618 , B29C67/202 , H05K3/0011 , H05K3/0055 , H05K3/422 , H05K3/426 , H05K2201/0116 , H05K2201/015 , H05K2203/0565 , H05K2203/0769 , H05K2203/1147 , Y10T29/49167
摘要： A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.
摘要翻译： 一种穿孔多孔树脂基底的制造方法，包括：用液体或溶液浸渍多孔树脂基底的多孔结构的步骤1; 从液体或溶液浸渍形成固体物质的步骤2; 形成从多孔结构体内具有固体物质的多孔树脂基材的第一表面延伸到多孔树脂基材中的第二表面的多个穿孔的步骤3; 和步骤4，熔化或溶解固体物质以将其从多孔结构的内部除去，并且具有导电性的孔的内壁表面的多孔树脂基材的制造方法包括仅选择性地施加催化剂的步骤 到穿孔的内壁表面以将导电金属施加到内壁表面。
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公开(公告)号：US07563487B2
公开(公告)日：2009-07-21
申请号：US10551459
申请日：2004-03-12
CPC分类号： H01L23/4828 , G01R1/0408 , G01R31/2863 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R43/007 , H05K3/4069 , Y10T428/24917 , H01L2924/00
摘要： The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.
摘要翻译： 本发明涉及一种各向异性导电膜及其制造方法，其中使用由合成树脂制成的电绝缘多孔膜作为基膜，并且其中形成能够在膜厚度方向上具有导电性的导电部分形成 独立地在基膜的多个位置处，以将穿透从第一表面到第二表面的方式将导电金属粘附到多孔结构的树脂部分上。
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8.发明申请公开(公告)号：US20080006605A1
公开(公告)日：2008-01-10
申请号：US11660993
申请日：2005-07-11
申请人： Mayo Uenoyama , Yasuhiro Okuda , Fumihiro Hayashi , Taro Fujita , Yasuhito Masuda , Yuichi Idomoto
发明人： Mayo Uenoyama , Yasuhiro Okuda , Fumihiro Hayashi , Taro Fujita , Yasuhito Masuda , Yuichi Idomoto
CPC分类号： H05K3/0055 , H05K3/426 , H05K2201/0116 , H05K2201/015 , H05K2203/0793 , H05K2203/0796
摘要： A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
摘要翻译： 一种穿孔多孔树脂基板的制造方法，其特征在于，包括以下步骤：在由含有树脂材料的树脂材料制成的多孔树脂基材中，从厚度方向从第一面到第二面形成至少一个穿孔的工序 氟聚合物; 通过将含有碱金属的蚀刻剂与每个穿孔的壁面接触进行蚀刻处理的步骤2; 和将可氧化化合物或其溶液与通过蚀刻处理产生的退化层接触的步骤3，从而除去退化层。 一种多孔树脂基板的制造方法，其中，对穿孔的壁面提供导电性。
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9.发明授权Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component 失效图案化多孔成型体或无纺布的制造方法以及电路部件公开(公告)号：US07586047B2
公开(公告)日：2009-09-08
申请号：US10586341
申请日：2005-01-13
CPC分类号： B24C3/322 , B24C1/04 , B24C11/00 , C23C18/1605 , C23C18/1644 , C23C18/1651 , C23C18/1653 , C23C18/30 , H05K1/0284 , H05K3/107 , H05K3/182 , H05K3/184 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , H05K2201/0293 , H05K2201/09036 , H05K2201/09118 , H05K2203/025 , H05K2203/0565 , Y10T428/24479 , Y10T428/24496 , Y10T428/24612 , Y10T428/249953 , Y10T428/249987 , Y10T442/674
摘要： An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions.With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric. The invention provides a porous molded product or a nonwoven fabric in which a plated layer has been selectively formed on the surfaces of the through portions or the recessed portions, or both of these, an electric circuit component, or the like.
摘要翻译： 本发明的一个目的是提供一种多孔材料的制造方法，其中图形化了复杂而精细的通过部分，凹陷部分等。 提供一种图案化的多孔模制产品或非织造织物，其中已经在通孔部分和凹进部分的表面上选择性地形成镀层。 通过本发明，将具有图案部分的面罩放置在多孔成型品或无纺布的至少一侧。 含有磨粒的流体或流体从掩模上方喷射，从而形成通过部分或凹陷部分或两者，其中通过掩模的每个通过部分的开口形状被转移到多孔模制产品中 或无纺布。 本发明提供一种多孔成型体或非织造布，其中，在贯通部或凹部的表面，或这两者，电路部件等的表面上选择性地形成镀层。
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公开(公告)号：US20060251871A1
公开(公告)日：2006-11-09
申请号：US10551459
申请日：2004-03-12
IPC分类号： B32B3/00
CPC分类号： H01L23/4828 , G01R1/0408 , G01R31/2863 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R43/007 , H05K3/4069 , Y10T428/24917 , H01L2924/00
摘要： The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.
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