公开(公告)号：US07189923B2

公开(公告)日：2007-03-13

申请号：US11019291

申请日：2004-12-23

申请人： Hideho Inagawa ,  Hiroyuki Yamaguchi ,  Shin′ichi Nishimura ,  Daishiro Sekijima ,  Tsunao Hombo ,  Masafumi Kamei

发明人： Hideho Inagawa ,  Hiroyuki Yamaguchi ,  Shin′ichi Nishimura ,  Daishiro Sekijima ,  Tsunao Hombo ,  Masafumi Kamei

IPC分类号： H01B1/00

CPC分类号： H05K9/00

摘要： A digital electronic apparatus includes a plurality of units and a cable. The plurality of units have metallic housings and are combined such that surfaces of the metallic housings are opposed to each other. The cable is laid on a surface of the metallic housing of at least one of the units. The surface on which the cable is laid is other than the surfaces of the metallic housings that are opposed to each other.

摘要翻译： 数字电子设备包括多个单元和电缆。 多个单元具有金属壳体并且组合使得金属壳体的表面彼此相对。 电缆被放置在至少一个单元的金属外壳的表面上。 敷设电缆的表面不是彼此相对的金属外壳的表面。

公开(公告)号：US20070117427A1

公开(公告)日：2007-05-24

申请号：US11624825

申请日：2007-01-19

申请人： Hideho Inagawa ,  Hiroyuki Yamaguchi ,  Shin'ichi Nishimura ,  Daishiro Sekijima ,  Tsunao Hombo ,  Masafumi Kamei

发明人： Hideho Inagawa ,  Hiroyuki Yamaguchi ,  Shin'ichi Nishimura ,  Daishiro Sekijima ,  Tsunao Hombo ,  Masafumi Kamei

IPC分类号： H01R13/44

CPC分类号： H05K9/00

摘要： A digital electronic apparatus includes a plurality of units and a cable. The plurality of units have metallic housings and are combined such that surfaces of the metallic housings are opposed to each other. The cable is laid on a surface of the metallic housing of at least one of the units. The surface on which the cable is laid is other than the surfaces of the metallic housings that are opposed to each other.

摘要翻译： 数字电子设备包括多个单元和电缆。 多个单元具有金属壳体并且组合使得金属壳体的表面彼此相对。 电缆被放置在至少一个单元的金属外壳的表面上。 敷设电缆的表面不是彼此相对的金属外壳的表面。

公开(公告)号：US20050139369A1

公开(公告)日：2005-06-30

申请号：US11019291

申请日：2004-12-23

申请人： Hideho Inagawa ,  Hiroyuki Yamaguchi ,  Shin'ichi Nishimura ,  Daishiro Sekijima ,  Tsunao Hombo ,  Masafumi Kamei

发明人： Hideho Inagawa ,  Hiroyuki Yamaguchi ,  Shin'ichi Nishimura ,  Daishiro Sekijima ,  Tsunao Hombo ,  Masafumi Kamei

IPC分类号： B41J29/00 ,  G01R31/08 ,  G03G21/00 ,  G06F11/00 ,  G08C15/00 ,  H01B7/00 ,  H01B9/00 ,  H01B11/00 ,  H04J1/16 ,  H04J3/14 ,  H04L1/00 ,  H04L12/26 ,  H05K9/00

CPC分类号： H05K9/00

摘要： A digital electronic apparatus includes a plurality of units and a cable. The plurality of units have metallic housings and are combined such that surfaces of the metallic housings are opposed to each other. The cable is laid on a surface of the metallic housing of at least one of the units. The surface on which the cable is laid is other than the surfaces of the metallic housings that are opposed to each other.

摘要翻译： 数字电子设备包括多个单元和电缆。 多个单元具有金属壳体并且组合使得金属壳体的表面彼此相对。 电缆被放置在至少一个单元的金属外壳的表面上。 敷设电缆的表面不是彼此相对的金属外壳的表面。

公开(公告)号：US07453699B2

公开(公告)日：2008-11-18

申请号：US11624825

申请日：2007-01-19

申请人： Hideho Inagawa ,  Hiroyuki Yamaguchi ,  Shin'ichi Nishimura ,  Daishiro Sekijima ,  Tsunao Hombo ,  Masafumi Kamei

发明人： Hideho Inagawa ,  Hiroyuki Yamaguchi ,  Shin'ichi Nishimura ,  Daishiro Sekijima ,  Tsunao Hombo ,  Masafumi Kamei

IPC分类号： H05K5/00

CPC分类号： H05K9/00

摘要： A digital electronic apparatus includes a plurality of units and a cable. The plurality of units have metallic housings and are combined such that surfaces of the metallic housings are opposed to each other. The cable is laid on a surface of the metallic housing of at least one of the units. The surface on which the cable is laid is other than the surfaces of the metallic housings that are opposed to each other.

摘要翻译： 数字电子设备包括多个单元和电缆。 多个单元具有金属壳体并且组合使得金属壳体的表面彼此相对。 电缆被放置在至少一个单元的金属外壳的表面上。 敷设电缆的表面不是彼此相对的金属外壳的表面。

公开(公告)号：US07154050B2

公开(公告)日：2006-12-26

申请号：US10676283

申请日：2003-09-30

申请人： Daishiro Sekijima ,  Hideho Inagawa ,  Satoshi Sugimoto ,  Seiji Hayashi ,  Shinichi Nishimura

发明人： Daishiro Sekijima ,  Hideho Inagawa ,  Satoshi Sugimoto ,  Seiji Hayashi ,  Shinichi Nishimura

IPC分类号： H05K9/00

CPC分类号： H01R12/79 ,  H01R12/594 ,  H01R13/6581 ,  H01R13/6585 ,  H05K1/0218 ,  H05K1/148

摘要： A cable arranging structure for exchanging electric signals between a pair of printed circuit boards includes at least a pair of electrically conductive members adapted to arrange the cable between them over the entire length thereof. The electrically conductive members show an electric potential substantially equal to that of the ground. Such a structure requires only the two electrically conductive members to be rigidly secured so that radiant noises generated by the cable can be effectively suppressed by means of the structure without the need of deforming the cable.

摘要翻译： 用于在一对印刷电路板之间交换电信号的电缆布置结构包括至少一对导电构件，其适于在其整个长度上将电缆布置在它们之间。 导电构件表现出与地面大致相等的电位。 这种结构只需要使两个导电构件刚性固定，从而可以通过结构有效地抑制由电缆产生的辐射噪声，而不需要使电缆变形。

公开(公告)号：US20090200666A1

公开(公告)日：2009-08-13

申请号：US12429461

申请日：2009-04-24

申请人： Hideho Inagawa

发明人： Hideho Inagawa

IPC分类号： H01L23/498

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06153 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00

摘要： A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding wires to the wire bonding pads, wherein wire bonding pads on the semiconductor chip are arranged in two rows in a staggered manner along a periphery of the semiconductor chip, and of the wire bonding pads, power supply pads are arranged in a rear row located close to a semiconductor integrated circuit unit as an active area on the semiconductor chip and in a front row, only signal pads are arranged. Because the power supply pads are provided in the rear row, the line width of a power supply line led out from each power supply pad can be made equal to the width of the pad, thus reducing the impedance of the connection circuit between the semiconductor chip and the package, and suppressing generation of radiation noise, ground bounce and so on.

摘要翻译： 提供一种半导体集成电路器件，其包括具有引线接合焊盘的半导体芯片和封装半导体芯片并且经由接合线连接到引线接合焊盘的封装，其中半导体芯片上的引线焊盘以交错布置成两行 沿着半导体芯片的周边以及引线接合焊盘，电源焊盘被布置在靠近半导体集成电路单元的后排中，作为半导体芯片上的有源区域和前排，仅信号焊盘 被安排。 由于电源板设置在后排中，所以可以使从每个电源焊盘引出的电源线的线宽等于焊盘的宽度，从而减小半导体芯片之间的连接电路的阻抗 和封装，并抑制辐射噪声的产生，地面反弹等。

公开(公告)号：US5215593A

公开(公告)日：1993-06-01

申请号：US691421

申请日：1991-04-25

申请人： Shigenobu Nojo ,  Hideho Inagawa ,  Tohru Ohsaka

发明人： Shigenobu Nojo ,  Hideho Inagawa ,  Tohru Ohsaka

IPC分类号： B08B3/10 ,  C23C18/18 ,  C25D5/34 ,  C25D21/10 ,  H05K3/00 ,  H05K3/26 ,  H05K3/42

CPC分类号： H05K3/0088 ,  B08B3/106

摘要： A substrate having a small-diameter hole is taken from the air and placed in a boiling vapor and/or boiling liquid in a first treatment tank of a vessel having a boiling heater, whereupon the pressure of the air in the small-diameter hole exceeds atmospheric pressure by an amount equivalent to the partial pressure of the air in the hole. Accordingly, the air cannot remain in the hole but is instead expelled to the outside. As a result, the interior of the microhole is replaced entirely by the boiling vapor and/or boiling liquid. Next, without being brought into contact with the external air, the substrate is contacted with a non-boiling liquid inside a second treatment tank, thereby preventing external gas from flowing back into the small-diameter. The non-boiling liquid and the boiling vapor and/or boiling liquid are soluble in each other. As a result, the two are unified and introduced to the small-diameter hole in the form of a liquid.

摘要翻译： 将具有小直径孔的基板从空气中取出并置于具有沸腾加热器的容器的第一处理槽中的沸腾蒸气和/或沸腾液中，于是小直径孔中的空气压力超过 大气压力相当于孔中空气的分压的量。 因此，空气不能保留在孔中，而是排出到外部。 结果，微孔的内部完全被沸腾的蒸气和/或沸腾的液体所取代。 接下来，不与外部空气接触，基板与第二处理槽内的非沸腾液体接触，从而防止外部气体流回小直径。 非沸腾液体和沸腾蒸气和/或沸腾液体彼此可溶。 结果，两者被统一并以液体形式引入小直径孔。

公开(公告)号：US20100128451A1

公开(公告)日：2010-05-27

申请号：US12694951

申请日：2010-01-27

申请人： Seiji Hayashi ,  Hideho Inagawa

发明人： Seiji Hayashi ,  Hideho Inagawa

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H05K1/0231 ,  H05K1/165 ,  H05K3/429 ,  H05K2201/09263 ,  H05K2201/0949 ,  H05K2201/10545 ,  H05K2201/10689

摘要： A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit.

摘要翻译： 多层印刷电路板包括：第一表面层，包括半导体集成电路;第二表面层，包括旁路电容器，并且与第一表面层相对;主电源布线层;以及第一表面层， 和第二表面层。 在多层印刷电路板中，旁路电容器的一个端子连接到从主电源布线层到半导体集成电路的电源端子的布线路径的中点，并且从第一布线路径的阻抗 到旁路电容器的端子的主电源布线层高于从旁路电容器的端子到半导体集成电路的电源端子的第二布线路径的阻抗。

公开(公告)号：US20090040741A1

公开(公告)日：2009-02-12

申请号：US12245988

申请日：2008-10-06

申请人： Seiji Hayashi ,  Hideho Inagawa

发明人： Seiji Hayashi ,  Hideho Inagawa

IPC分类号： H05K1/14

CPC分类号： H05K1/0231 ,  H05K1/165 ,  H05K3/429 ,  H05K2201/09263 ,  H05K2201/0949 ,  H05K2201/10545 ,  H05K2201/10689

摘要： A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit.

摘要翻译： 多层印刷电路板包括：第一表面层，包括半导体集成电路;第二表面层，包括旁路电容器，并且与第一表面层相对;主电源布线层;以及第一表面层， 和第二表面层。 在多层印刷电路板中，旁路电容器的一个端子连接到从主电源布线层到半导体集成电路的电源端子的布线路径的中点，并且从第一布线路径的阻抗 到旁路电容器的端子的主电源布线层高于从旁路电容器的端子到半导体集成电路的电源端子的第二布线路径的阻抗。

公开(公告)号：US06663432B2

公开(公告)日：2003-12-16

申请号：US10106319

申请日：2002-03-27

申请人： Hideho Inagawa

发明人： Hideho Inagawa

IPC分类号： H01R903

CPC分类号： H01R9/032 ,  H01R13/2442 ,  H01R13/6215

摘要： This invention is directed to provide a shielded cable connector that can stabilize electrical connection between a cable-side shield member and a board-side ground pattern. In order to achieve this object, a shielded cable connector to be mounted on a shielded cable having a signal transmission line and a shield member around it includes a metal outer shell member to come into direct contact with the shield member. The outer shell member includes a contact portion extended to come into direct contact with a ground pattern of an electric board to which the shielded cable is to be connected.