Horizontal continuous casting installation
    1.
    发明授权
    Horizontal continuous casting installation 失效
    水平连铸安装

    公开(公告)号:US4527616A

    公开(公告)日:1985-07-09

    申请号:US390712

    申请日:1982-06-21

    CPC分类号: B22D11/10 B22D11/047

    摘要: A horizontal continuous casting installation, particularly for casting a strand of a large transverse dimension, wherein a body of molten metal stored in a tundish is continuously supplied through a tundish nozzle secured to the tundish in the vicinity of its bottom and extending horizontally therefrom to a mold connected to the forward end of the tundish nozzle and arranged coaxially therewith to cast a strand which is continuously withdrawn horizontally from the mold. The mold has an inner transverse dimension greater than the inner transverse dimension of the tundish nozzle. An electromagnetic field generating device is located between an outer surface of the tundish nozzle and an inner surface of the mold in the vicinity of an end surface of the mold facing the tundish nozzle for exerting an electromagnetic force on the body of molten metal flowing from the tundish nozzle to the mold in such a manner that the electromagnetic force is oriented toward the center of the body of molten metal.

    摘要翻译: 一种水平连续铸造装置,特别是用于铸造大横向尺寸的股线,其中储存在中间包中的熔融金属体通过固定在其底部附近的中间包并从其水平延伸到中间包的中间包喷嘴连续供应到 模具连接到中间包喷嘴的前端并与其同轴布置,以铸造从模具水平地连续取出的股线。 模具具有大于中间包喷嘴的内横向尺寸的内横向尺寸。 电磁场产生装置位于中间包喷嘴的外表面和模具的内表面之间,在与中间包喷嘴相对的模具的端面附近,用于向从中间包喷嘴流动的熔融金属体上施加电磁力 将中间包喷嘴浇注到模具中,使得电磁力朝向熔融金属体的中心。

    Sputtering target material, silicon-containing film forming method, and photomask blank
    6.
    发明授权
    Sputtering target material, silicon-containing film forming method, and photomask blank 有权
    溅射靶材料,含硅膜形成方法和光掩模坯料

    公开(公告)号:US08647795B2

    公开(公告)日:2014-02-11

    申请号:US13273656

    申请日:2011-10-14

    IPC分类号: G03F1/60 C23C14/00

    摘要: Provided is a silicon target material in which particles are not easily generated during a sputtering process and to form a low-defect (high quality) silicon-containing film. A silicon target material having a specific resistance of 20 Ω·cm or more at room temperature is used for forming a silicon-containing film. The silicon target material may be polycrystalline or noncrystalline. However, when the silicon target material is single-crystalline, a more stable discharge state can be obtained. Also, a single-crystal silicon in which crystals are grown by an FZ method is a preferable material as a highly-pure silicon target material because its content of oxygen is low. Further, a target material having n-type conductivity and containing donor impurities is preferable to obtain stable discharge characteristics. Only a single or a plurality of silicon target materials according to the present invention may be used for sputtering film formation of the silicon-containing film.

    摘要翻译: 提供了一种硅靶材料,其中在溅射工艺期间不容易产生颗粒并形成低缺陷(高质量)含硅膜。 使用在室温下电阻率为20Ω·cm以上的硅靶材料来形成含硅膜。 硅靶材料可以是多晶的或非晶的。 然而,当硅靶材料是单晶时,可以获得更稳定的放电状态。 此外,由于其含氧量低,因此通过FZ法生长晶体的单晶硅是优选的高纯度硅靶材料。 此外,优选具有n型导电性且含有供体杂质的靶材料,以获得稳定的放电特性。 根据本发明,只有一种或多种硅靶材料可用于溅射含硅膜的成膜。

    Photomask making method
    7.
    发明授权
    Photomask making method 有权
    光掩模制作方法

    公开(公告)号:US08309277B2

    公开(公告)日:2012-11-13

    申请号:US12813137

    申请日:2010-06-10

    IPC分类号: G03F1/50

    摘要: A photomask is manufactured from a photomask blank comprising a transparent substrate and a light-shielding film consisting of upper and lower layers of transition metal-containing silicon base materials, the content of O+N in the upper layer being higher than that of the lower layer. The light-shielding film is processed in two steps by fluorine dry etching through a resist pattern such that a lower portion of the film is left behind, and oxygen-containing chlorine dry etching for removing the remainder of the film.

    摘要翻译: 光掩模由包括透明基板和由含过渡金属的硅基材料的上层和下层组成的遮光膜的光掩模坯料制造,上层中的O + N的含量高于下层的含量 层。 遮光膜通过氟干蚀刻通过抗蚀剂图案进行两步加工,使得膜的下部留下,并且含氧氯干蚀刻用于除去膜的其余部分。

    Method for inspecting photomask blank or intermediate thereof, method for determining dosage of high-energy radiation, and method for manufacturing photomask blank
    8.
    发明授权
    Method for inspecting photomask blank or intermediate thereof, method for determining dosage of high-energy radiation, and method for manufacturing photomask blank 有权
    检查光掩模坯料或其中间体的方法,用于确定高能辐射剂量的方法,以及制造光掩模坯料的方法

    公开(公告)号:US08168351B2

    公开(公告)日:2012-05-01

    申请号:US12750121

    申请日:2010-03-30

    IPC分类号: G03F1/00 G06K9/00

    CPC分类号: G03F1/84 G03F7/70783

    摘要: A photomask blank which is manufactured by depositing a phase shift film on a substrate and irradiating the phase shift film with high-energy radiation to effect substrate shape adjusting treatment is inspected by measuring a surface topography of the photomask blank after the substrate shape adjusting treatment, removing the phase shift film from the photomask blank, measuring a surface topography of the treated substrate after removal of the phase shift film, and comparing the surface topographies, thereby evaluating a warpage change before and after removal of the phase shift film, due to a stress of the phase shift film having undergone substrate shape adjusting treatment.

    摘要翻译: 通过在基板形状调整处理之后测量光掩模坯料的表面形貌来检查通过在基板上沉积相变膜并用高能辐射照射相移膜来进行基板形状调整处理而制造的光掩模坯料, 从光掩模坯料中去除相移膜,在移除相移膜之后测量处理过的基板的表面形貌,并比较表面形貌,由此评估在移相膜之前和之后的翘曲变化,由于 经过衬底形状调整处理的相移膜的应力。