Shift register circuit
    5.
    发明授权
    Shift register circuit 失效
    移位寄存器电路

    公开(公告)号:US5027382A

    公开(公告)日:1991-06-25

    申请号:US451176

    申请日:1989-12-15

    IPC分类号: G11C19/00

    CPC分类号: G11C19/00

    摘要: A shift register circuit comprises a series circuit comprising a plurality of first clocked gate inverters and inverters which are alternately connected in series, where a first one of the first clocked gate inverters is adapted to receive an input pulse signal, an output line connected to an output of each of the inverters for outputting an output pulse signal, and a second clocked gate inverter connected to the output of each of the inverters for outputting an output pulse signal. The first clocked gate inverters operate responsive to a first clock signal, and the second clocked gate inverters operate responsive to a second clock signal which is different from the first clock signal.

    摘要翻译: 移位寄存器电路包括串联电路,其包括串联交替连接的多个第一时钟门控反相器和反相器,其中第一时钟门控反相器中的第一个适于接收输入脉冲信号,输出线连接到 输出用于输出输出脉冲信号的每个反相器的输出;以及连接到每个反相器的输出的第二时钟控制反相器,用于输出输出脉冲信号。 第一时钟门反相器响应于第一时钟信号而工作,并且第二时钟门控反相器响应于与第一时钟信号不同的第二时钟信号而工作。

    PLASMA PROCESSING SYSTEM, PLASMA MEASUREMENT SYSTEM, PLASMA MEASUREMENT METHOD, AND PLASMA CONTROL SYSTEM
    6.
    发明申请
    PLASMA PROCESSING SYSTEM, PLASMA MEASUREMENT SYSTEM, PLASMA MEASUREMENT METHOD, AND PLASMA CONTROL SYSTEM 失效
    等离子体处理系统,等离子体测量系统,等离子体测量方法和等离子体控制系统

    公开(公告)号:US20080241016A1

    公开(公告)日:2008-10-02

    申请号:US12058323

    申请日:2008-03-28

    IPC分类号: B01J19/12

    摘要: A microwave plasma processing system 10 includes: a processing chamber 100 in which a desired process is applied to a target object using a plasma; a susceptor 106 (stage) in the processing chamber 100 to support the target object; a high-frequency power supply 112 supplying high-frequency electric power to the susceptor 106; a capacitor 108a provided to the susceptor 106; and a measurement device 20 measuring voltages at the pair of plates of the capacitor 108a when high-frequency electric power is supplied from the high-frequency power supply 112 to the susceptor 106.

    摘要翻译: 微波等离子体处理系统10包括:处理室100,其中使用等离子体将期望的处理应用于目标物体; 处理室100中的基座106(阶段)以支撑目标物体; 向基座106供给高频电力的高频电源112; 设置在基座106上的电容器108a; 以及测量装置20,当从高频电源112向基座106提供高频电力时,测量电容器108a的一对板的电压。

    SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS, AND DISPLAY UNIT
    7.
    发明申请
    SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS, AND DISPLAY UNIT 审中-公开
    半导体制造方法,半导体制造装置和显示单元

    公开(公告)号:US20090050895A1

    公开(公告)日:2009-02-26

    申请号:US12195508

    申请日:2008-08-21

    摘要: In a semiconductor manufacturing method that manufactures a coplanar type thin film transistor, a microcrystalline film 10 that will become a channel region is formed on a glass substrate S, a sacrificial silicon oxide 20 film is formed on the microcrystalline film 10, and, in a state in which a surface boundary of the microcrystalline film 10 is protected by the sacrificial silicon oxide film 20, a doped silicon film 30 is built up that will become a source region and a drain region. A photoresist R film is applied on the doped silicon film 30 and planarized. With the sacrificial silicon oxide film 20 in an uncovered state, etching is performed until the microcrystalline film 10 and the doped silicon film 30 reside in approximately the same plane.

    摘要翻译: 在制造共面型薄膜晶体管的半导体制造方法中,在玻璃基板S上形成成为沟道区的微晶膜10,在微晶膜10上形成牺牲氧化硅20膜,在 由牺牲氧化硅膜20保护微晶膜10的表面边界的状态,构成将成为源极区域和漏极区域的掺杂硅膜30。 将光致抗蚀剂R膜施加在掺杂硅膜30上并平坦化。 在牺牲氧化硅膜20处于未覆盖状态下,进行蚀刻直到微晶膜10和掺杂硅膜30位于大致相同的平面中。

    Microwave plasma processing method, microwave plasma processing apparatus, and its plasma head
    8.
    发明申请
    Microwave plasma processing method, microwave plasma processing apparatus, and its plasma head 审中-公开
    微波等离子体处理方法,微波等离子体处理装置及其等离子体头

    公开(公告)号:US20070054064A1

    公开(公告)日:2007-03-08

    申请号:US10566241

    申请日:2004-12-24

    IPC分类号: H05H1/24 C23C16/00

    摘要: A microwave plasma processing method and, in which a linear plasma is produced by means of a microwave, and an object to be processed is subjected to processing under atmospheric pressure or under a pressure near atmospheric pressure when the object is moved, while a surface of the object is maintained at a horizontal position with respect to the linear plasma. A plasma head has an H-plane slot antenna, and slots are arranged alternately on both sides of a centerline of a waveguide at a pitch of λg/2 (λg: wavelength of the microwave with the waveguide). A uniforming line having a distance of n·λg/2 from the slots to an emission end of the plasma head is provided (n: an integral number).

    摘要翻译: 微波等离子体处理方法,其中通过微波产生线性等离子体和待处理物体在大气压力下或当物体移动时在大气压附近的压力下进行处理,同时 物体相对于线性等离子体保持在水平位置。 等离子体头具有H平面缝隙天线,并且以波兰的间距(lambdag:具有波导的微波的波长)交替地布置在波导的中心线的两侧。 提供了从槽到发射端等离子体头的距离为n.lambdag / 2的均匀线(n:整数)。

    MOCVD system
    9.
    发明授权
    MOCVD system 有权
    MOCVD系统

    公开(公告)号:US06319327B1

    公开(公告)日:2001-11-20

    申请号:US09624488

    申请日:2000-07-24

    IPC分类号: C23C1600

    摘要: Disclosed is an MOCVD system for forming a tantalum oxide film on a semiconductor wafer, while using pentoethoxytantalum as a liquid raw material. In the system, a raw material tank is connected to a vaporizing unit through an upstream main line with a flow control unit. The vaporizing unit is connected to the process chamber of a film-forming unit through a downstream main line. A partition wall is arranged to surround the entire system so as to isolate it from the other space in the clean room. The raw material tank, the flow control unit, and part of the upstream main line therebetween are accommodated in a constant temperature and heat insulating box all together and are kept at a temperature of from 25 to 35° C.

    摘要翻译: 公开了一种用于在半导体晶片上形成氧化钽膜的MOCVD系统,同时使用五乙氧基钽作为液体原料。 在该系统中,原料罐通过具有流量控制单元的上游主管线连接到蒸发单元。 蒸发单元通过下游主管线连接到成膜单元的处理室。 分隔壁布置成围绕整个系统,以将其与洁净室中的其他空间隔离。 原料罐,流量控制单元及其上游主管的一部分在一起保持在恒温隔热箱中,并保持在25〜35℃的温度。

    Plasma processing system, plasma measurement system, plasma measurement method, and plasma control system
    10.
    发明授权
    Plasma processing system, plasma measurement system, plasma measurement method, and plasma control system 失效
    等离子体处理系统,等离子体测量系统,等离子体测量方法和等离子体控制系统

    公开(公告)号:US08241457B2

    公开(公告)日:2012-08-14

    申请号:US12058323

    申请日:2008-03-28

    IPC分类号: H01L21/00 C23C16/00 C23C14/00

    摘要: A microwave plasma processing system 10 includes: a processing chamber 100 in which a desired process is applied to a target object using a plasma; a susceptor 106 (stage) in the processing chamber 100 to support the target object; a high-frequency power supply 112 supplying high-frequency electric power to the susceptor 106; a capacitor 108a provided to the susceptor 106; and a measurement device 20 measuring voltages at the pair of plates of the capacitor 108a when high-frequency electric power is supplied from the high-frequency power supply 112 to the susceptor 106.

    摘要翻译: 微波等离子体处理系统10包括:处理室100,其中使用等离子体将期望的处理应用于目标物体; 处理室100中的基座106(阶段)以支撑目标物体; 向基座106供给高频电力的高频电源112; 设置在基座106上的电容器108a; 以及测量装置20,当从高频电源112向基座106提供高频电力时,测量电容器108a的一对板的电压。