摘要:
A data write current from a pinned layer to a free layer is larger than a data write current from the free layer to the pinned layer. A data read current is smaller in value than the data write current. In the case where a difference in data read current between a high-resistance state and a low-resistance state is relatively small, a sense amplifier is connected so that the data read current flows from the pinned layer to the free layer, namely from a source line to a bit line.
摘要:
Resistance elements are inserted into a main power supply line and a main ground line so that offset differential amplifiers receive voltages developed across the same. The differential amplifiers control transistors connected to a sub power supply line and a sub ground line. Thus, a leakage current flowing from the sub power supply line to the main ground line and that flowing from the main power supply line to the sub ground line are regularly kept constant. Consequently, it is possible to prevent an operation delay in an initial stage of a standby state while keeping an effect of reducing a subthreshold leakage current in a semiconductor circuit device having a hierarchical power supply structure.
摘要:
During data reading, a sense enable signal is activated to start charging of a data line prior to formation of a current path including the data line and a selected memory cell in accordance with row and column selecting operations. Charging of the data line is completed early so that it is possible to reduce a time required from start of the data reading to such a state that a passing current difference between the data lines reaches a level corresponding to storage data of the selected memory cell, and the data reading can be performed fast.
摘要:
An access transistor in an MTJ memory cell, which is one of transistors connected to a read current path, is fabricated with a semiconductor layer formed on an insulating film on a semiconductor substrate SUB, and includes impurity regions, a gate region and a body region. That is, the access transistor is fabricated with an SOI (Silicon On Insulator) structure in order to reduce an off-leak current.
摘要:
A plurality of test target chips on a test target wafer are simultaneously and electrically coupled to a plurality of chips on a test wafer via a wafer contactor. Each chip on the test wafer has a test circuit for conducting an operation test on each chip on the test target wafer. Since the test circuit is in a one-to-one relationship with respect to the test target chip, and is arranged on the test wafer other than the test target wafer, the many chips can be simultaneously tested in parallel during the wafer test without increasing an area of the test target chips.
摘要:
A tunneling magneto-resistance element of each MTJ (magnetic tunnel junction) memory cell is connected between a bit line and a strap. Each strap is shared by a plurality of tunneling magneto-resistance elements that are located adjacent to each other in the row direction in the same sub array. Each access transistor is connected between a corresponding strap and a ground voltage, and turned ON/OFF in response to a corresponding word line. Since data read operation can be conducted with the structure that does not have an access transistor for every tunneling magneto-resistance element, the array area can be reduced.
摘要:
A random logic circuit comprises an input portion for inputting data; a first latch portion for receiving the data outputted from the input portion, and holding and outputting the data; a second latch portion for receiving the data outputted from the first latch portion, and holding and outputting the data; an output portion for receiving the data outputted from the second latch portion and outputting the data to a logic circuit; and a prevention circuit for preventing generation of a sub-threshold leak current in sleep mode between the first latch portion and the second latch portion.
摘要:
Pads are alignedly arranged in a central region of a semiconductor chip and are also arranged at an outer peripheral portion of the central portion of the chip. A pad at the outer peripheral portion is electrically connected to a die pad mounting the chip thereon with an insulative material interposed therebetween. A potential supplied to the pad positioned at the outer peripheral portion can be stabilized by parasitic capacitance of the die pad, and a potential of the die pad can be externally monitored easily by removing away a portion of mold resin after resin sealing. Further, due to a cress shaped arrangement of the pads, a voltage down converter can be arranged in line with the pads and at outer periphery of the chip without area penalty. In testing operation, a switching circuit switches a function of a pad to another pad so that cross-shapedly arranged pads are equivalently arranged in a line.
摘要:
A random logic circuit comprises an input portion for inputting data; a first latch portion for receiving the data outputted from the input portion, and holding and outputting the data; a second latch portion for receiving the data outputted from the first latch portion, and holding and outputting the data; an output portion for receiving the data outputted from the second latch portion and outputting the data to a logic circuit; and a prevention circuit for preventing generation of a sub-threshold leak current in sleep mode between the first latch portion and the second latch portion.
摘要:
In a synchronous semiconductor memory device of the present invention, a main word driver and a sub decode driver have a function to take in a row decode signal in response to activation of a bank and to maintain the state of the row decode signal. Accordingly, of the circuits associated with row selection, a row pre-decoder, a row decoder and a row system control circuit can operate under a hierarchical power supply structure.