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公开(公告)号：US20140117919A1
公开(公告)日：2014-05-01
申请号：US13980984
申请日：2012-10-25
摘要： A servo control device includes a follow-up control unit that controls a control target that drives a mechanical system by a motor, a command function unit that has input therein a phase signal θ indicating a phase of a cyclic operation performed by the control target, and that calculates a machine motion command according to the phase signal θ by a preset first function, a second derivative unit that uses a second function obtained by second-order differentiating the first function with respect to the phase signal to calculate a value of the second function according to the phase signal as a second-order differential base signal, a correction-value computation unit that computes a first command correction value for correcting the motor motion command by using a product of a square value of the phase velocity, the second-order differential base signal, and a first constant, and a correction-value addition unit that calculates the motor motion command based on an added value of the first command correction value and the machine motion command.
摘要翻译： 一种伺服控制装置，包括：跟随控制单元，其控制由马达驱动机械系统的控制对象;命令功能单元，其中输入有相位信号; 指示由控制对象执行的循环操作的相位，并且根据相位信号计算机器运动命令; 通过预设的第一功能，二阶导数单元使用通过相对于相位信号对第一函数进行二阶微分而获得的第二函数，以根据相位信号计算第二函数的值作为二阶差分基极 信号，校正值计算单元，其通过使用相速度，二阶差分基准信号和第一常数的平方值的乘积来计算用于校正马达运动命令的第一命令校正值，以及校正 - 值附加单元，其基于第一命令校正值和机器运动命令的相加值来计算马达运动命令。
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公开(公告)号：US08890460B2
公开(公告)日：2014-11-18
申请号：US13980984
申请日：2012-10-25
摘要： A servo control device includes a follow-up control unit that controls a control target that drives a mechanical system by a motor, a command function unit that has input therein a phase signal θ indicating a phase of a cyclic operation performed by the control target, and that calculates a machine motion command according to the phase signal θ by a preset first function, a second derivative unit that uses a second function obtained by second-order differentiating the first function with respect to the phase signal to calculate a value of the second function according to the phase signal as a second-order differential base signal, a correction-value computation unit that computes a first command correction value for correcting the motor motion command by using a product of a square value of the phase velocity, the second-order differential base signal, and a first constant, and a correction-value addition unit that calculates the motor motion command based on an added value of the first command correction value and the machine motion command.
摘要翻译： 一种伺服控制装置，包括：跟随控制单元，其控制由马达驱动机械系统的控制对象;命令功能单元，其中输入有相位信号; 指示由控制对象执行的循环操作的相位，并且根据相位信号计算机器运动命令; 通过预设的第一功能，二阶导数单元使用通过相对于相位信号对第一函数进行二阶微分而获得的第二函数，以根据相位信号计算第二函数的值作为二阶差分基极 信号，校正值计算单元，其通过使用相速度，二阶差分基准信号和第一常数的平方值的乘积来计算用于校正马达运动命令的第一命令校正值，以及校正 - 值附加单元，其基于第一命令校正值和机器运动命令的相加值来计算马达运动命令。
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公开(公告)号：US08882486B2
公开(公告)日：2014-11-11
申请号：US13496446
申请日：2011-08-01
CPC分类号： B29C45/76 , B29C45/77 , B29C2945/76006 , B29C2945/76257 , B29C2945/76381 , B29C2945/76598 , B29C2945/76859 , B29C2945/76933 , B29C2945/76936
摘要： To execute a stable pressure control, in a control device for an injection molding machine, a filling/pressure-keeping determining unit determines whether the injection molding machine is performing a pressure keeping operation, an elastic constant identifier acquires, when the filling/pressure-keeping determining unit determines that the pressure keeping operation is in progress, a pressure detection value and a position detection value as operation information of a motor and identifies an elastic constant K based on the acquired pressure detection value and the position detection value, and a pressure-control control-parameter setting unit calculates a proportional gain Ka of a pressure controller such that a product of the proportional gain Ka of the pressure controller and the elastic constant K is smaller than a speed control bandwidth ωsc of a speed controller, and sets the calculated proportional gain Ka to the pressure controller.
摘要翻译： 为了执行稳定的压力控制，在注射成型机的控制装置中，填充/保压确定单元确定注射成型机是否进行压力保持操作，弹性常数标识符获取当填充/压力 - 保持确定单元确定压力保持操作正在进行，压力检测值和位置检测值作为电动机的操作信息，并且基于获取的压力检测值和位置检测值来识别弹性常数K，并且压力 控制控制参数设定单元计算压力控制器的比例增益Ka，使得压力控制器的比例增益Ka与弹性常数K的乘积小于速度控制器的速度控制带宽ωsc，并将 计算比例增益Ka到压力控制器。
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公开(公告)号：US20130032961A1
公开(公告)日：2013-02-07
申请号：US13496446
申请日：2011-08-01
CPC分类号： B29C45/76 , B29C45/77 , B29C2945/76006 , B29C2945/76257 , B29C2945/76381 , B29C2945/76598 , B29C2945/76859 , B29C2945/76933 , B29C2945/76936
摘要： To execute a stable pressure control, in a control device for an injection molding machine, a filling/pressure-keeping determining unit determines whether the injection molding machine is performing a pressure keeping operation, an elastic constant identifier acquires, when the filling/pressure-keeping determining unit determines that the pressure keeping operation is in progress, a pressure detection value and a position detection value as operation information of a motor and identifies an elastic constant K based on the acquired pressure detection value and the position detection value, and a pressure-control control-parameter setting unit calculates a proportional gain Ka of a pressure controller such that a product of the proportional gain Ka of the pressure controller and the elastic constant K is smaller than a speed control bandwidth ωsc of a speed controller, and sets the calculated proportional gain Ka to the pressure controller.
摘要翻译： 为了执行稳定的压力控制，在注射成型机的控制装置中，填充/保压确定单元确定注射成型机是否进行压力保持操作，弹性常数标识符获取当填充/压力 - 保持确定单元确定压力保持操作正在进行，压力检测值和位置检测值作为电动机的操作信息，并且基于获取的压力检测值和位置检测值来识别弹性常数K，并且压力 控制控制参数设定单元计算压力控制器的比例增益Ka，使得压力控制器的比例增益Ka与弹性常数K的乘积小于速度控制器的速度控制带宽ωsc，并将 计算比例增益Ka到压力控制器。
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公开(公告)号：US20140144337A1
公开(公告)日：2014-05-29
申请号：US14234746
申请日：2012-06-20
申请人： Yasuhisa Koike , Kimio Nishimura , Hiroharu Takeuchi , Kunitomo Ishiguro , Kiyoshi Hasegawa , Yoshinori Izawa
发明人： Yasuhisa Koike , Kimio Nishimura , Hiroharu Takeuchi , Kunitomo Ishiguro , Kiyoshi Hasegawa , Yoshinori Izawa
IPC分类号： B30B15/00
CPC分类号： B30B15/0082 , B26F1/38 , B26F3/002 , B28D1/222 , B28D7/02 , B30B13/00 , H01F41/0253 , H02K15/03
摘要： A field-pole magnet manufacturing apparatus manufactures magnet pieces that constitute a field-pole magnet arranged in a rotary electric machine by fracturing the magnet. This manufacturing apparatus includes: a support unit on which the magnet is placed; a fracture unit that is arranged opposite to the support unit across the magnet and is configured to fracture the magnet by pressing the magnet while in contact with the magnet; and a powder removal unit that is configured to remove crush powder produced by fracture of the magnet.
摘要翻译： 场磁极制造装置通过压碎磁体来制造构成旋转电机中的场极磁铁的磁体片。 该制造装置包括：放置有磁体的支撑单元; 断裂单元，其与所述支撑单元相对地布置在所述磁体上，并且被构造成通过在与所述磁体接触的同时按压所述磁体而使所述磁体断裂; 以及粉碎去除单元，其构造成去除由所述磁体断裂产生的粉碎粉末。
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公开(公告)号：US08705698B2
公开(公告)日：2014-04-22
申请号：US13027881
申请日：2011-02-15
IPC分类号： H05G1/62 , G01N23/201 , G06K9/78 , G06K9/82
CPC分类号： G01N23/223 , G01N2223/076 , G06T7/001 , G06T2207/10061 , G06T2207/10121 , G06T2207/30148
摘要： Provided are an X-ray analyzer and a mapping method for an X-ray analysis which, in a inspection for a harmful substance contained in, for example, a material or a composite electronic component, enable determination as to whether a sample is normal or abnormal to be performed visually based on an image obtained by the X-ray mapping analysis. In the X-ray analyzer, an X-ray mapping image of a sample which is confirmed to be normal in advance is obtained as a reference mapping image. A mapping analysis is performed on a inspection sample. A difference from the reference mapping image is obtained for each pixel, to thereby display a difference mapping image. A region in which the amount of specific element is larger than a reference amount is displayed with high brightness, and hence an abnormal portion may be easily found.
摘要翻译： 提供了一种X射线分析仪和用于X射线分析的映射方法，其在包含在例如材料或复合电子部件中的有害物质的检查中能够确定样品是正常还是 基于通过X射线映射分析获得的图像，可视化地进行异常。 在X射线分析装置中，作为基准对照图像，获得确认为正常的样本的X射线映射图像。 对检查样品进行映射分析。 对于每个像素获得与参考映射图像的差异，从而显示差异映射图像。 特定元素的量大于基准量的区域以高亮度显示，因此可能容易发现异常部分。
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7.发明申请公开(公告)号：US20120234584A1
公开(公告)日：2012-09-20
申请号：US13394688
申请日：2010-09-06
CPC分类号： H05K3/244 , H01L21/4857 , H01L2924/00013 , H01L2924/0002 , H05K3/062 , H05K3/108 , H05K3/4644 , H05K3/4652 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： It is an object of the invention to provide a method for producing a substrate for mounting a semiconductor chip, that can reduce bridging and allows excellent wire bondability and solder connection reliability to be obtained, even when forming fine-pitch wirings. The method for producing a substrate for mounting a semiconductor chip according to the invention comprises a resist-forming step in which a resist is formed on the first copper layer of a stack comprising an inner board with an inner layer circuit on the surface and a first copper layer formed on the inner board separated by an insulating layer at the sections other than those that are to constitute a conductor circuit, a conductor circuit-forming step in which a second copper layer is formed by electrolytic copper plating on the first copper layer to obtain a conductor circuit, a nickel layer-forming step in which a nickel layer is formed by electrolytic nickel plating on at least part of the conductor circuit, a resist removal step in which the resist is removed, an etching step in which the first copper layer is removed by etching, and a gold layer-forming step in which a gold layer is formed by electroless gold plating on at least part of the conductor circuit.
摘要翻译： 本发明的目的是提供一种用于制造用于安装半导体芯片的基板的方法，即使在形成精细间距布线时也能够减少桥接并且能够获得优异的引线接合性和焊接连接可靠性。 根据本发明的用于制造用于安装半导体芯片的基板的方法包括抗蚀剂形成步骤，其中在包括在内表层电路的内板上的第一铜层上形成抗蚀剂，并且第一 铜层，其形成在内板上，除了构成导体电路的部分之外的绝缘层分隔开;导体电路形成步骤，其中通过在第一铜层上的电解铜电镀形成第二铜层， 获得导体电路，镍层形成步骤，其中在导体电路的至少一部分上通过电解镀镍形成镍层，去除抗蚀剂的抗蚀剂去除步骤，其中第一铜 通过蚀刻去除层，以及金层形成步骤，其中在导体电路的至少一部分上通过无电镀金形成金层。
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8.发明授权Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board 有权粘合辅助剂金属箔，印刷线路板和印刷线路板的制造方法公开(公告)号：US07862889B2
公开(公告)日：2011-01-04
申请号：US12613222
申请日：2009-11-05
申请人： Kenji Takai , Norio Moriike , Kenichi Kamiyama , Takako Watanabe , Shin Takanezawa , Koji Morita , Katsuyuki Masuda , Kiyoshi Hasegawa
发明人： Kenji Takai , Norio Moriike , Kenichi Kamiyama , Takako Watanabe , Shin Takanezawa , Koji Morita , Katsuyuki Masuda , Kiyoshi Hasegawa
CPC分类号： H05K3/4655 , H05K3/108 , H05K3/28 , H05K3/386 , H05K3/389 , H05K3/4652 , H05K2201/0133 , H05K2201/0154 , H05K2201/0195 , H05K2201/0212 , H05K2201/0358 , H05K2203/0759 , Y10T428/12431 , Y10T428/24917 , Y10T428/2804 , Y10T428/287 , Y10T428/31681
摘要： The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
摘要翻译： 本发明涉及一种粘合促进剂金属箔，其包含含有环氧树脂作为金属上不可或缺的成分的粘合助剂层，其中粘合助剂层的厚度为0.1〜10μm。 本发明还涉及作为具有多层的多层布线基板的印刷布线板，其中在绝缘层之间形成粘附辅助剂层。
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公开(公告)号：US07794306B2
公开(公告)日：2010-09-14
申请号：US10772429
申请日：2004-02-06
申请人： Tomohiro Kondo , Masahiko Iizumi , Masahiro Omata , Kiyoshi Hasegawa , Takashi Ogino , Takafumi Watanabe , Yoshiyuki Chida , Yasushi Matsushita , Kazuo Takeda
发明人： Tomohiro Kondo , Masahiko Iizumi , Masahiro Omata , Kiyoshi Hasegawa , Takashi Ogino , Takafumi Watanabe , Yoshiyuki Chida , Yasushi Matsushita , Kazuo Takeda
IPC分类号： B24B1/30
摘要： An apparatus and method for surface finishing a workpiece is disclosed as including a workpiece supporting mechanism supporting a workpiece having a target shaped periphery with a given width to be surface finished and a tool holder holding a surface finish tool in abutting contact with the target shaped periphery of the workpiece. A pressure applying mechanism is operative to apply a pressure force to the surface finish tool through the tool holder to cause the surface finish tool to be held in pressured contact with the target shaped periphery, with the pressure force exhibiting a given distribution pattern depending upon an axial direction of the workpiece. A drive mechanism rotates the workpiece to allow the surface finish tool to surface finish the target shaped periphery into a given geometrical profile, variably contoured along an axis of the workpiece depending on the given pressure distribution pattern.
摘要翻译： 公开了一种用于表面处理工件的装置和方法，包括：工件支撑机构，其支撑具有待表面加工的给定宽度的目标形状周边的工件;以及保持表面加工工具以与目标形状周边抵接的工具架 的工件。 压力施加机构可操作以通过工具保持器向表面加工工具施加压力，以使表面精加工工具与目标形状的周边保持压力接触，其中压力显示给定的分布图案，这取决于 工件的轴向。 驱动机构使工件旋转以允许表面光洁度工具将目标形状的周边表面光洁成给定的几何轮廓，根据给定的压力分布图案沿着工件的轴线可变地轮廓。
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10.发明申请FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOARD, AND PRODUCTION METHOD THEREOF 有权树脂层，印刷线路板上金属层的形成方法及其生产方法公开(公告)号：US20100044086A1
公开(公告)日：2010-02-25
申请号：US12614267
申请日：2009-11-06
CPC分类号： H05K3/386 , C23C18/1608 , C23C18/1653 , C23C18/2093 , C23C18/31 , C25D5/022 , H05K3/108 , H05K3/244 , H05K3/427 , H05K3/4644 , H05K3/4652 , H05K2201/0154 , H05K2201/0355 , H05K2203/072 , Y10S428/901 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T428/12472 , Y10T428/12493 , Y10T428/12507 , Y10T428/12514 , Y10T428/12535 , Y10T428/24917
摘要： A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.
摘要翻译： 一种具有导体电路的印刷电路板，其特征在于，具有与绝缘层相邻的铜层和无电镀金，其特征在于，所述绝缘层的平均表面粗糙度（Rz）为20μm以下。 根据本发明，没有在树脂上沉积镀金的缺陷，并且实现精确的精细布线形成。
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