摘要:
A MOS gate type semiconductor device, comprising an upper source wiring consisting of a plurality of upper source electrodes, an upper drain wiring provided on a semiconductor substrate and consisting of a plurality of upper drain electrodes formed in a comb-like arrangement such that the plurality of upper drain electrodes are engaged with the upper source electrodes, lower source electrodes provided at each of lower portions of adjacent pairs of the upper source electrodes and the upper drain electrodes such that the lower source electrodes are layered below the upper source electrodes and the upper drain electrodes, and lower drain electrodes provided at each of lower portions of adjacent pairs of the upper source electrodes and the upper drain electrodes electrode such that the lower drain electrodes are layered below the upper source electrodes and the upper drain electrodes, wherein the lower source electrodes are connected to the upper source electrodes and the source region, and are disposed so as to form a wave-like shape, and the lower drain electrodes are connected to the upper drain electrodes and the drain region, and are disposed so as to form a wave-like shape.
摘要:
A high-breakdown-voltage semiconductor device includes a high-resistance semiconductor layer, a drift layer of the first conductivity type selectively formed in the surface of the high-resistance semiconductor layer, a drain layer formed in the surface of the drift layer of the first conductivity type, base layers of the second conductivity type selectively formed in the surface of the high-resistance semiconductor layer, a plurality of island-shaped source layers of the first conductivity type formed in the surfaces of the base layers of the second conductivity type, a gate electrode formed on the base layers of the second conductivity type between the source layers of the first conductivity type and the drift layer of the first conductivity type and between adjacent source layers of the first conductivity type via a gate insulating film, a drain electrode which contacts the drain layer, and source electrodes which contact both the source layers of the first conductivity type and the base layers of the second conductivity type.
摘要:
A high breakdown voltage semiconductor device includes a semiconductor substrate, an insulating layer formed on the semiconductor substrate, an active layer formed on the insulating layer and made of a high resistance semiconductor of a first conductivity type, a first impurity region of the first conductivity type formed in the active layer, and a second impurity region of a second conductivity type formed in the active layer and spaced apart from the first impurity region by a predetermined distance. The first impurity region is formed of diffusion layers. The diffusion layers are superimposed one upon another and differ in diffusion depth or diffusion window width, or both.
摘要:
A semiconductor apparatus comprising a vertical type semiconductor device having a first conducting type semiconductor substrate, a drain layer formed on the surface of the semiconductor substrate, a drain electrode formed on the surface of the drain layer, a second conducting type base layer selectively formed on the surface of the semiconductor substrate opposite to the drain layer, a first conducting type source layer selectively formed on the surface of the second conducting type base layer, a source electrode formed on the first conducting type source layer and the second conducting type base layer, and a gate electrode formed in contact with the first conducting type source layer, the second conducting type base layer and the semiconductor substrate through a gate insulating film and a lateral semiconductor device having an insulating layer formed in a region of the surface of the semiconductor substrate different from the second conducting type base layer, and a polycrystalline semiconductor layer formed on the insulating layer and having a first conducting type region and a second conducting type region, wherein the first conducting type source layer of the vertical semiconductor device and the first conducting type region of the polycrystalline semiconductor layer are simultaneously formed.
摘要:
A semiconductor device includes a substrate, an insulating layer formed on the substrate, a base layer of a first conductivity type formed on the insulating layer, a drain layer of a second conductivity type selectively formed above the surface of the base layer of the first conductivity type, a drain electrode formed on and connected to the drain layer of the second conductivity type, a base layer of the second conductivity type selectively formed on the base layer of the first conductivity type, a source layer of the first conductivity type isolated from the base layer of the first conductivity type and selectively formed in the surface area of the base layer of the second conductivity type, a source electrode formed on and connected to the source layer of the first conductivity type and the base layer of the second conductivity type, and a gate electrode formed above a portion of the base layer of the second conductivity type which lies between the source layer of the first conductivity type and the base layer of the first conductivity type with a gate insulating film disposed therebetween.
摘要:
A high breakdown voltage semiconductor device comprising a semiconductor substrate, an insulating layer formed on the semiconductor substrate, an active layer formed on the insulating layer and made of a high resistance semiconductor of a first conductivity type, a first impurity region of the first conductivity type formed in the active layer, and a second impurity region of a second conductivity type formed in the active layer and spaced apart from the first impurity region by a predetermined distance. The first impurity region is formed of diffusion layers. The diffusion layers are superimposed one upon another and differ in diffusion depth or diffusion window width, or both.
摘要:
A high breakdown voltage semiconductor apparatus comprises a substrate having an insulating layer formed thereon, a high resistance semiconductor layer of a first conductivity type formed on said insulating layer, a base region of the first conductivity type formed selectively in a surface region of the high resistance semiconductor layer, a drift region of a second conductivity type formed selectively in the surface region of the high resistance semiconductor layer so as not to reach the insulating layer, a source region of the second conductivity type formed in the base region, a drain region formed in the drift region, a gate electrode formed on a region between the source region and the drift region, with a gate insulating film interposed between the gate electrode and the region between the source region and the drift region, a source electrode provided in contact with the base region and the source region, a drain electrode provided in contact with the drain region. The dosage of impurities in the high resistance semiconductor layer is 2.times.10.sup.12 cm.sup.-2 to 3.times.10.sup.12 cm.sup.-2 and the dosage of impurities in the drift layer is 1.times.10.sup.12 cm.sup.-2 to 2.times.10.sup.12 cm.sup.-2.
摘要翻译:一种高耐压电压半导体装置,包括:在其上形成有绝缘层的基板,形成在所述绝缘层上的第一导电类型的高电阻半导体层,所述第一导电类型的基极区选择性地形成在所述高电阻的表面区域中 半导体层,选择性地形成在高电阻半导体层的表面区域中以便不到达绝缘层的第二导电类型的漂移区域,形成在基极区域中的第二导电类型的源极区域,形成的漏极区域 在漂移区域中,形成在源极区域和漂移区域之间的区域上的栅电极,栅极绝缘膜插入在栅极电极和源极区域与漂移区域之间的区域中,源极电极与 所述基极区域和所述源极区域,设置成与所述漏极区域接触的漏极电极。 高电阻半导体层中的杂质用量为2×10 12 cm -2至3×10 12 cm -2,漂移层中的杂质用量为1×10 12 cm -2至2×10 12 cm -2。
摘要:
A semiconductor device includes a substrate having a conductor; a semiconductor chip disposed on the substrate and electrically connected to the conductor; a tubular electrode having one end electrically connected to the conductor; and a sealing resin sealing the substrate, the semiconductor chip and the electrode. The electrode is configured to be extendable and contractible in the stacking direction in which the substrate and the semiconductor chip are stacked in the state before sealing of the sealing resin. The edge of the other end of the electrode is exposed from the sealing resin. The electrode has a hollow space opened at the edge of the other end. Therefore, a semiconductor device reduced in size and a method of manufacturing this semiconductor device can be provided.
摘要:
An information processing apparatus that executes information display processing is disclosed. The apparatus includes: a display unit that executes information display; and a data processing unit that executes a control of the information display of the display unit and data processing based on a user input. The data processing unit displays an image browsing screen, which corresponds to image data stored in a storage unit, on the display unit and executes display of a map at the position, which corresponds to position information included in attribute information of a selected image, on the basis of a user's input of image selection information and map display request.
摘要:
A lattice pallet 13 having a large number of supporters for placing a plate 14 is installed to a table 12 so as to be freely fittable and removable. Bringing in of the plate 14 is performed by the method of raising the lattice pallet 13 with a crane with the plate 14 already having been loaded upon the lattice pallet 13 in a different location, transporting them over the table 12, and lowering them down onto the table 12. Directly after cutting has been completed, the lattice pallet 12 is raised and separated from the table 12 with the manufactured product and the left over material carried upon it and is taken away to a different location, and another lattice pallet 13 with another plate 14 mounted upon it is brought in with the crane upon the table 12, and the task of cutting this other plate 14 is commenced.