公开(公告)号：US07002831B2

公开(公告)日：2006-02-21

申请号：US10715448

申请日：2003-11-19

申请人： Hideyuki Matsuoka ,  Kenchi Ito ,  Takeshi Sakata ,  Kiyoo Itoh

发明人： Hideyuki Matsuoka ,  Kenchi Ito ,  Takeshi Sakata ,  Kiyoo Itoh

IPC分类号： G11C17/02

CPC分类号： G11C11/16

摘要： A memory cell in a so-called MRAM by utilizing a tunnel magnetic resistance in the prior art has raised problems that a magnetic field to be applied to a TMR element is essentially weak since a word line for write is disposed apart from the TMR element, that a large current is required at the time of a writing operation, and that electric power consumption is large. In order to solve the above-described problems experienced in the prior art, the present invention provides an MRAM memory cell structure and its fabricating method in which a word line for write is disposed near a TMR element and surrounds it in three directions.

摘要翻译： 通过利用现有技术中的隧道磁阻，在所谓的MRAM中的存储单元已经引起了由于用于写入的字线与TMR元件分开而被施加到TMR元件的磁场基本上是弱的问题， 在写入操作时需要大的电流，并且电力消耗大。 为了解决现有技术中遇到的上述问题，本发明提供了一种MRAM存储单元结构及其制造方法，其中用于写入的字线被设置在TMR元件附近并且在三个方向上包围它。

公开(公告)号：US06903966B2

公开(公告)日：2005-06-07

申请号：US10863748

申请日：2004-06-09

申请人： Takeshi Sakata ,  Satoru Hanzawa ,  Hideyuki Matsuoka ,  Katsuro Watanabe ,  Kenchi Ito

发明人： Takeshi Sakata ,  Satoru Hanzawa ,  Hideyuki Matsuoka ,  Katsuro Watanabe ,  Kenchi Ito

IPC分类号： G11C11/14 ,  G11C11/15 ,  G11C11/16 ,  H01L21/8246 ,  H01L27/105 ,  H01L27/22 ,  H01L43/08 ,  G11C11/00

CPC分类号： H01L27/226 ,  B82Y10/00 ,  G11C11/16

摘要： Disclosed are a fast, highly-integrated and highly-reliable magnetoresistive random access memory (MRAM) and a semiconductor device which uses the MRAM. The semiconductor device performs the read-out operation of the MRAM using memory cells for storing information by using a change in magnetoresistance of a magnetic tunnel junction (MTJ) element with a high S/N ratio. Each memory cell includes an MTJ element and a bipolar transistor. The read-out operation is carried out by selecting a word line, amplifying a current flowing in the MTJ element of a target memory cell by the bipolar transistor and outputting the amplified current to an associated read data line.

摘要翻译： 公开了一种快速，高度集成和高可靠性的磁阻随机存取存储器（MRAM）和使用MRAM的半导体器件。 半导体器件使用存储单元执行MRAM的读出操作，用于通过使用具有高S / N比的磁性隧道结（MTJ）元件的磁阻的变化来存储信息。 每个存储单元包括MTJ元件和双极晶体管。 通过选择字线，通过双极晶体管放大在目标存储单元的MTJ元件中流动的电流并将放大的电流输出到相关联的读取数据线来执行读出操作。

公开(公告)号：US06573586B2

公开(公告)日：2003-06-03

申请号：US10081537

申请日：2002-02-25

申请人： Takeshi Sakata ,  Satoru Hanzawa ,  Hideyuki Matsuoka ,  Katsuro Watanabe ,  Kenchi Ito

发明人： Takeshi Sakata ,  Satoru Hanzawa ,  Hideyuki Matsuoka ,  Katsuro Watanabe ,  Kenchi Ito

IPC分类号： H01L2900

CPC分类号： H01L27/226 ,  B82Y10/00 ,  G11C11/16

摘要： Disclosed are a fast, highly-integrated and highly-reliable magnetoresistive random access memory (MRAM) and a semiconductor device which uses the MRAM. The semiconductor device performs the read-out operation of the MRAM using memory cells for storing information by using a change in magnetoresistance of a magnetic tunnel junction (MTJ) element with a high S/N ratio. Each memory cell includes an MTJ element and a bipolar transistor. The read-out operation is carried out by selecting a word line, amplifying a current flowing in the MTJ element of a target memory cell by the bipolar transistor and outputting the amplified current to an associated read data line.

公开(公告)号：US06771535B2

公开(公告)日：2004-08-03

申请号：US10412423

申请日：2003-04-14

申请人： Takeshi Sakata ,  Satoru Hanzawa ,  Hideyuki Matsuoka ,  Katsuro Watanabe ,  Kenchi Ito

发明人： Takeshi Sakata ,  Satoru Hanzawa ,  Hideyuki Matsuoka ,  Katsuro Watanabe ,  Kenchi Ito

IPC分类号： G11C1100

CPC分类号： H01L27/226 ,  B82Y10/00 ,  G11C11/16

摘要： Disclosed are a fast, highly-integrated and highly-reliable magnetoresistive random access memory (MRAM) and a semiconductor device which uses the MRAM. The semiconductor device performs the read-out operation of the MRAM using memory cells for storing information by using a change in magnetoresistance of a magnetic tunnel junction (MTJ) element with a high S/N ratio. Each memory cell includes an MTJ element and a bipolar transistor. The read-out operation is carried out by selecting a word line, amplifying a current flowing in the MTJ element of a target memory cell by the bipolar transistor and outputting the-amplified current to an associated read data line.

摘要翻译： 公开了一种快速，高度集成和高可靠性的磁阻随机存取存储器（MRAM）和使用MRAM的半导体器件。 半导体器件使用存储单元执行MRAM的读出操作，用于通过使用具有高S / N比的磁性隧道结（MTJ）元件的磁阻的变化来存储信息。 每个存储单元包括MTJ元件和双极晶体管。 通过选择字线，通过双极晶体管放大在目标存储单元的MTJ元件中流动的电流并将放大的电流输出到相关联的读取数据线来执行读出操作。

公开(公告)号：US20060148135A1

公开(公告)日：2006-07-06

申请号：US11368603

申请日：2006-03-07

申请人： Hideyuki Matsuoka ,  Kiyoo Itoh ,  Motoyasu Terao ,  Satoru Hanzawa ,  Takeshi Sakata

发明人： Hideyuki Matsuoka ,  Kiyoo Itoh ,  Motoyasu Terao ,  Satoru Hanzawa ,  Takeshi Sakata

IPC分类号： H01L21/50

CPC分类号： H01L27/2454 ,  G11C13/0004 ,  G11C2213/79 ,  H01L27/2463 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/144

摘要： A semiconductor memory cell and forming method thereof utilizes a vertical select transistor to eliminate the problem of a large cell surface area in memory cells of the related art utilizing phase changes. A memory cell with a smaller surface area than the DRAM device of the related art is achieved by the present invention. Besides low power consumption during read operation, the invention also provides phase change memory having low power consumption even during write operation. Phase change memory also has stable read-out operation.

公开(公告)号：US20050045933A1

公开(公告)日：2005-03-03

申请号：US10914223

申请日：2004-08-10

申请人： Shinichiro Kimura ,  Toshiaki Yamanaka ,  Kiyoo Itoh ,  Takeshi Sakata ,  Tomonori Sekiguchi ,  Hideyuki Matsuoka

发明人： Shinichiro Kimura ,  Toshiaki Yamanaka ,  Kiyoo Itoh ,  Takeshi Sakata ,  Tomonori Sekiguchi ,  Hideyuki Matsuoka

IPC分类号： H01L21/02 ,  H01L21/8242 ,  H01L21/8246 ,  H01L27/108 ,  H01L27/115 ,  H01L29/76 ,  H01L29/94 ,  H01L31/119

CPC分类号： H01L27/10852 ,  H01L27/108 ,  H01L27/10814 ,  H01L27/10817 ,  H01L27/10882 ,  H01L27/10885 ,  H01L27/10894 ,  H01L27/10897 ,  H01L27/11502 ,  H01L27/11507 ,  H01L28/90

摘要： A capacitor consisting of a storage electrode (19), a capacitor dielectric film (20) and a plate electrode (21) is formed in a trench formed through dielectric films (6, 8, 10 and 12) stacked on a semiconductor substrate (1) and buried wiring layers (9 and 11) are formed under the capacitor. As the capacitor is formed not in the semiconductor substrate but over it, there is room in area in which the capacitor can be formed and the difficultly of forming wiring is reduced by using the wiring layers (9 and 11) for a global word line and a selector line. As the upper face of an dielectric film (32) which is in contact with the lower face of wiring (34) in a peripheral circuit area is extended into a memory cell area and is in contact with the side of the capacitor (33), step height between the peripheral circuit area and the memory cell area is remarkably reduced.

摘要翻译： 在由半导体衬底（1）上层叠的电介质膜（6,8,10和12）形成的沟槽中形成由存储电极（19），电容器电介质膜（20）和平板电极（21）构成的电容器 ）和埋入布线层（9和11）形成在电容器下面。 由于电容器不是形成在半导体衬底中而是在其上形成，所以存在可以形成电容器的区域的空间，并且通过使用全局字线的布线层（9和11）难以形成布线， 选择线。 由于在周边电路区域与布线（34）的下表面接触的电介质膜（32）的上表面延伸到存储单元区域并与电容器（33）的一侧接触， 外围电路区域和存储单元区域之间的台阶高度显着降低。

公开(公告)号：US07196368B2

公开(公告)日：2007-03-27

申请号：US10914223

申请日：2004-08-10

申请人： Shinichiro Kimura ,  Toshiaki Yamanaka ,  Kiyoo Itoh ,  Takeshi Sakata ,  Tomonori Sekiguchi ,  Hideyuki Matsuoka

发明人： Shinichiro Kimura ,  Toshiaki Yamanaka ,  Kiyoo Itoh ,  Takeshi Sakata ,  Tomonori Sekiguchi ,  Hideyuki Matsuoka

IPC分类号： H01L27/108 ,  H01L29/76 ,  H01L29/94 ,  H01L31/119

CPC分类号： H01L27/10852 ,  H01L27/108 ,  H01L27/10814 ,  H01L27/10817 ,  H01L27/10882 ,  H01L27/10885 ,  H01L27/10894 ,  H01L27/10897 ,  H01L27/11502 ,  H01L27/11507 ,  H01L28/90

摘要： A capacitor consisting of a storage electrode (19), a capacitor dielectric film (20) and a plate electrode (21) is formed in a trench formed through dielectric films (6, 8, 10 and 12) stacked on a semiconductor substrate (1) and buried wiring layers (9 and 11) are formed under the capacitor. As the capacitor is formed not in the semiconductor substrate but over it, there is room in area in which the capacitor can be formed and the difficultly of forming wiring is reduced by using the wiring layers (9 and 11) for a global word line and a selector line. As the upper face of an dielectric film (32) which is in contact with the lower face of wiring (34) in a peripheral circuit area is extended into a memory cell area and is in contact with the side of the capacitor (33), step height between the peripheral circuit area and the memory cell area is remarkably reduced.

摘要翻译： 在由半导体衬底（1）上层叠的电介质膜（6,8,10和12）形成的沟槽中形成由存储电极（19），电容器电介质膜（20）和平板电极（21）构成的电容器 ）和埋入布线层（9和11）形成在电容器下面。 由于电容器不是形成在半导体衬底中而是在其上形成，所以存在可以形成电容器的区域的空间，并且通过使用全局字线的布线层（9和11）难以形成布线， 选择线。 由于在周边电路区域与布线（34）的下表面接触的电介质膜（32）的上表面延伸到存储单元区域并与电容器（33）的一侧接触， 外围电路区域和存储单元区域之间的台阶高度显着降低。

公开(公告)号：US06946704B2

公开(公告)日：2005-09-20

申请号：US10808510

申请日：2004-03-25

申请人： Hideyuki Matsuoka ,  Kiyoo Itoh ,  Motoyasu Terao ,  Satoru Hanzawa ,  Takeshi Sakata

发明人： Hideyuki Matsuoka ,  Kiyoo Itoh ,  Motoyasu Terao ,  Satoru Hanzawa ,  Takeshi Sakata

IPC分类号： G11C13/00 ,  H01L27/10 ,  H01L27/105 ,  H01L27/24 ,  H01L45/00 ,  H01L29/26

CPC分类号： H01L27/2454 ,  G11C13/0004 ,  G11C2213/79 ,  H01L27/2463 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/144

摘要： A semiconductor memory cell and forming method thereof utilizes a vertical select transistor to eliminate the problem of a large cell surface area in memory cells of the related art utilizing phase changes. A memory cell with a smaller surface area than the DRAM device of the related art is achieved by the present invention. Besides low power consumption during read operation, the invention also provides phase change memory having low power consumption even during write operation. Phase change memory also has stable read-out operation.

摘要翻译： 半导体存储单元及其形成方法利用垂直选择晶体管来消除利用相位变化的现有技术的存储单元中的大的单元表面积的问题。 通过本发明实现了具有比现有技术的DRAM器件更小的表面积的存储单元。 除了读取操作中的低功耗之外，本发明还提供即使在写入操作期间具有低功耗的相变存储器。 相变存储器也具有稳定的读出操作。

公开(公告)号：US06798005B2

公开(公告)日：2004-09-28

申请号：US10206215

申请日：2002-07-29

申请人： Shinichiro Kimura ,  Toshiaki Yamanaka ,  Kiyoo Itoh ,  Takeshi Sakata ,  Tomonori Sekiguchi ,  Hideyuki Matsuoka

发明人： Shinichiro Kimura ,  Toshiaki Yamanaka ,  Kiyoo Itoh ,  Takeshi Sakata ,  Tomonori Sekiguchi ,  Hideyuki Matsuoka

IPC分类号： H01L27108

CPC分类号： H01L27/10852 ,  H01L27/108 ,  H01L27/10814 ,  H01L27/10817 ,  H01L27/10882 ,  H01L27/10885 ,  H01L27/10894 ,  H01L27/10897 ,  H01L27/11502 ,  H01L27/11507 ,  H01L28/90

摘要： A capacitor consisting of a storage electrode (19), a capacitor dielectric film (20) and a plate electrode (21) is formed in a trench formed through dielectric films (6, 8, 10 and 12) stacked on a semiconductor substrate (1) and buried wiring layers (9 and 11) are formed under the capacitor. As the capacitor is formed not in the semiconductor substrate but over it, there is room in area in which the capacitor can be formed and the difficulty of forming wiring is reduced by using the wiring layers (9 and 11) for a global word line and a selector line. As the upper face of an dielectric film (32) which is in contact with the lower face of wiring (34) in a peripheral circuit area is extended into a memory cell area and is in contact with the side of the capacitor (33), step height between the peripheral circuit area and the memory cell area is remarkably reduced.

摘要翻译： 在由半导体衬底（1）上层叠的电介质膜（6,8,10和12）形成的沟槽中形成由存储电极（19），电容器电介质膜（20）和平板电极（21）构成的电容器 ）和埋入布线层（9和11）形成在电容器下面。 由于电容器不是形成在半导体衬底中而是在其上形成，因此通过使用用于全局字线的布线层（9和11），可以形成电容器并且难以形成布线的难度减小， 随着在外围电路区域中与布线（34）的下表面接触的电介质膜（32）的上表面延伸到存储单元区域中并与电容器的侧面接触 （33），外围电路区域和存储单元区域之间的台阶高度显着降低。

公开(公告)号：US06576510B2

公开(公告)日：2003-06-10

申请号：US09826088

申请日：2001-04-05

申请人： Toshiaki Yamanaka ,  Shin' ichiro Kimura ,  Hideyuki Matsuoka ,  Tomonori Sekiguchi ,  Takeshi Sakata ,  Kiyoo Itoh

发明人： Toshiaki Yamanaka ,  Shin' ichiro Kimura ,  Hideyuki Matsuoka ,  Tomonori Sekiguchi ,  Takeshi Sakata ,  Kiyoo Itoh

IPC分类号： H01L218242

CPC分类号： H01L27/10894 ,  H01L21/32053 ,  H01L21/32134 ,  H01L21/76802 ,  H01L21/76831 ,  H01L21/76877 ,  H01L21/76895 ,  H01L23/535 ,  H01L27/10814 ,  H01L27/10855 ,  H01L27/10888 ,  H01L28/60 ,  H01L28/90 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to the present invention, an overlay margin is secured for matching a wiring electrode 11 with a storage electrode 15 of a capacitor at their point of contact and the required area for a memory cell can be decreased by placing the plug electrode 11 of titanium nitride in the active region of a semiconductor substrate or over the gate electrode, reducing the size of the opening for passing the storage electrode 15 of the capacitor of a stacked structure, and decreasing the line width of a wiring electrode 13. By the common use of the above-mentioned plug electrodes in a CMISFET region in the peripheral circuit and in a memory cell of a static RAM, their circuit layouts can be made compact.

摘要翻译： 根据本发明，确保了覆盖边缘，用于使布线电极11与电容器的接触点处的存储电极15匹配，并且可以通过将氮化钛的插头电极11放置在存储单元的所需区域 在半导体基板的有源区域或栅电极的上方，减小用于使层叠结构的电容器的存储电极15通过的开口的尺寸，并且减小布线电极13的线宽。通过共同使用 外围电路中的CMISFET区域和静态RAM的存储单元中的上述插头电极，可以使其电路布局紧凑。