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公开(公告)号：US06707021B2
公开(公告)日：2004-03-16
申请号：US10098317
申请日：2002-03-18
IPC分类号： G01J132
CPC分类号： B23K26/0652 , B23K26/032 , B23K26/0604 , B23K26/0613 , B23K26/0624 , B23K26/067 , B23K26/53 , C03B33/0222
摘要： The transparent medium processing device comprises: a light control section 2 for performing variable control for the status of the laser beam emitted from the light source section 1, and a light status measurement section 4 for measuring the status of the laser beam inside the processing target TG. The light control section is adjusted based on the output of the light status measurement section so that the status of the laser beam inside the processing target becomes a desired status. Since the status of the laser beam inside the processing target, which is made of such a transparent medium as glass, is measured by the light status measurement section, and is fed back to the light control section, laser processing can be executed while maintaining an optimum status at a processing point inside the processing target.
摘要翻译： 透明介质处理装置包括：用于对从光源部分1发射的激光束的状态执行可变控制的光控制部分2和用于测量处理目标内的激光束状态的光状态测量部分4 TG。 基于光状态测量部的输出调整光控制部，使得处理对象内的激光束的状态成为期望状态。 由于由玻璃制的透明介质构成的处理对象内部的激光束的状态由光状态测量部测量，并被反馈到光控制部，因此可以在维持 处理目标内处理点的最佳状态。
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2.发明授权公开(公告)号：US08049138B2
公开(公告)日：2011-11-01
申请号：US10832375
申请日：2004-04-27
IPC分类号： B23K26/00
CPC分类号： G11B7/125 , B23K26/009 , B23K26/066 , B23K26/18 , B29C33/3857 , B29C64/129 , B81B2203/033 , B81B2203/0392 , B81C1/00103 , B81C99/009 , B81C2201/0143 , G02B5/1857 , G03H2001/0478 , G11B7/261 , Y10S428/913 , Y10T428/12389 , Y10T428/12396 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/31623
摘要： An apparatus for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method includes depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.
摘要翻译： 公开了一种用于处理具有微细三维形状和平滑表面的三维结构的装置，其中三维结构可用于光学装置。 该方法包括在平坦基底上沉积用于吸收激光的薄层; 在薄层上沉积透明层以吸收激光; 并照射通过透明层的工艺激光; 其中将工艺激光的脉冲注入能量设定为与能够在工艺激光的入射方向上的前面暴露薄层的表面的最大脉冲注入能量相同或更小，并设定 与能够沿着工艺激光的入射方向去除后方的透明层的最小脉冲注入能量相同或者更大。
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公开(公告)号：US07067198B2
公开(公告)日：2006-06-27
申请号：US10747404
申请日：2003-12-30
CPC分类号： G11B7/125 , B23K26/009 , B23K26/066 , B23K26/18 , B29C33/3857 , B29C64/129 , B81B2203/033 , B81B2203/0392 , B81C1/00103 , B81C99/009 , B81C2201/0143 , G02B5/1857 , G03H2001/0478 , G11B7/261 , Y10S428/913 , Y10T428/12389 , Y10T428/12396 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/31623
摘要： Disclosed is a method for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device.The process method comprises the steps of depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.
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4.发明申请公开(公告)号：US20050244622A1
公开(公告)日：2005-11-03
申请号：US11174471
申请日：2005-07-06
IPC分类号： B81C1/00 , B23K26/00 , B23K26/06 , B23K26/073 , B23K26/18 , B23K26/38 , C03C17/00 , C03C17/06 , C03C23/00 , H05K1/03 , H05K3/00 , H05K3/02 , B32B15/00
CPC分类号： C03C23/0025 , B23K26/0624 , B23K26/0734 , C03C17/002 , C03C17/06 , C03C2217/25 , C03C2218/328 , C03C2218/355 , H05K1/0306 , H05K3/0029 , H05K3/027 , Y10T428/24917
摘要： A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is formed on a surface of glass substrate, into which laser beam for processing is made incident, the laser beam for processing is irradiated from a surface of metal thin film, and matter is directly removed by irradiation of laser beam onto the processing object in order to form a region finer than an irradiation region of laser beam for processing on the processing object.
摘要翻译： 将用于处理的激光束照射在处理对象上的激光加工方法，并且用于处理的激光束直接去除处理对象的一部分。 处理对象由玻璃基板制成，在玻璃基板的表面上形成对激光束进行高吸收处理的金属薄膜，在该表面上形成有用于加工的激光束入射的激光束，从表面照射 的金属薄膜，并且通过将激光束照射到处理对象上直接去除物质，以便形成比用于处理对象处理的激光束的照射区域更细的区域。
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公开(公告)号：US06949215B2
公开(公告)日：2005-09-27
申请号：US10369723
申请日：2003-02-21
IPC分类号： B81C1/00 , B23K26/00 , B23K26/06 , B23K26/073 , B23K26/18 , B23K26/38 , C03C17/00 , C03C17/06 , C03C23/00 , H05K1/03 , H05K3/00 , H05K3/02 , H01S3/00
CPC分类号： C03C23/0025 , B23K26/0624 , B23K26/0734 , C03C17/002 , C03C17/06 , C03C2217/25 , C03C2218/328 , C03C2218/355 , H05K1/0306 , H05K3/0029 , H05K3/027 , Y10T428/24917
摘要： A laser processing method capable of performing fine and highly accurate processing by low energy is obtained.The invention relates to the laser processing method where laser beam for processing (4) is irradiated on a processing object (2) and the laser beam for processing (4) directly removes a part of the processing object (2). The processing object (2) is made of a glass substrate, metal thin film (3) having high absorption to laser beam for processing (4) is formed on a surface of glass substrate, into which laser beam for processing (4) is made incident, the laser beam for processing (4) is irradiated from a surface of metal thin film (3), and matter is directly removed by irradiation of laser beam onto the processing object (2) in order to form a region finer than an irradiation region of laser beam for processing (4) on the processing object (2).
摘要翻译： 可以获得能够通过低能量进行精细且高精度的处理的激光加工方法。 本发明涉及激光加工方法，其中用于处理（4）的激光束照射在处理对象（2）上，激光束用于处理（4）直接去除处理对象（2）的一部分。 处理对象（2）由玻璃基板制成，在玻璃基板的表面上形成对激光束进行加工的吸收率高的金属薄膜（3）（4），其中加工有激光束（4） 事件中，从金属薄膜（3）的表面照射用于处理的激光束（4），并且通过将激光束照射到处理对象（2）上直接去除物质，以形成比照射更精细的区域 用于在处理对象（2）上处理（4）的激光束的区域。
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公开(公告)号：US06822221B2
公开(公告)日：2004-11-23
申请号：US10058086
申请日：2002-01-29
IPC分类号： H05H302
摘要： A method for cooling atoms, having a plurality of magnetic sublevels, involves a laser. Specifically, multiple polarized coherent light sources of a predetermined wavelength are sequentially emitted to atoms to move the electrons of the atoms to a lower magnetic sublevels, hence cooling the atoms. The sequentially emitted laser light can be applied at predetermined time intervals, whereby it becomes possible to laser-cool a variety of atoms including semiconductor atoms, such as silicon and germanium.
摘要翻译： 用于冷却具有多个磁性子层的原子的方法包括激光。 具体地，将预定波长的多个偏振相干光源顺序地发射到原子，以将原子的电子移动到较低的磁性子电平，从而冷却原子。 可以以预定的时间间隔施加顺序发射的激光，由此可以激光冷却包括诸如硅和锗的半导体原子的各种原子。
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7.发明授权公开(公告)号：US07482052B2
公开(公告)日：2009-01-27
申请号：US11174471
申请日：2005-07-06
IPC分类号： B32B3/00
CPC分类号： C03C23/0025 , B23K26/0624 , B23K26/0734 , C03C17/002 , C03C17/06 , C03C2217/25 , C03C2218/328 , C03C2218/355 , H05K1/0306 , H05K3/0029 , H05K3/027 , Y10T428/24917
摘要： A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is formed on a surface of glass substrate, into which laser beam for processing is made incident, the laser beam for processing is irradiated from a surface of metal thin film, and matter is directly removed by irradiation of laser beam onto the processing object in order to form a region finer than an irradiation region of laser beam for processing on the processing object.
摘要翻译： 将用于处理的激光束照射在处理对象上的激光加工方法，并且用于处理的激光束直接去除处理对象的一部分。 处理对象由玻璃基板制成，在玻璃基板的表面上形成对激光束进行高吸收处理的金属薄膜，在该表面上形成有用于加工的激光束入射的激光束，从表面照射 的金属薄膜，并且通过将激光束照射到处理对象上直接去除物质，以便形成比用于处理对象处理的激光束的照射区域更细的区域。
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8.发明授权公开(公告)号：US06803540B2
公开(公告)日：2004-10-12
申请号：US10321635
申请日：2002-12-18
IPC分类号： B23D900
CPC分类号： G11B7/125 , B23K26/009 , B23K26/066 , B23K26/18 , B29C33/3857 , B29C64/129 , B81B2203/033 , B81B2203/0392 , B81C1/00103 , B81C99/009 , B81C2201/0143 , G02B5/1857 , G03H2001/0478 , G11B7/261 , Y10S428/913 , Y10T428/12389 , Y10T428/12396 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/31623
摘要： Disclosed is a method for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method comprises the steps of depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.
摘要翻译： 公开了一种处理具有微细三维形状的三维结构的方法，并且公开了三维结构可用于光学装置的光滑表面。该方法包括以下步骤： 激光在平坦基板上的吸收; 在薄层上沉积透明层以吸收激光; 并照射通过透明层的工艺激光; 其中将工艺激光的脉冲注入能量设定为与能够在工艺激光的入射方向上的前面暴露薄层的表面的最大脉冲注入能量相同或更小，并设定 与能够沿着工艺激光的入射方向去除后方的透明层的最小脉冲注入能量相同或者更大。
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公开(公告)号：US20060091122A1
公开(公告)日：2006-05-04
申请号：US10514648
申请日：2003-05-15
申请人： Koji Sugioka , Ya Cheng , Katsumi Midorikawa , Kazuhiko Shihoyama
发明人： Koji Sugioka , Ya Cheng , Katsumi Midorikawa , Kazuhiko Shihoyama
IPC分类号： B23K26/36 , B23K26/067
CPC分类号： C03C23/0025 , B23K26/0608 , B23K26/0613 , B23K26/0619 , B23K26/0624 , B23K26/0676 , B23K26/361 , B23K26/55
摘要： A shape with a substantially perfect sphere, or a cross-sectional shape with a substantially perfect circle in a direction parallel to an advance direction of a femtosecond laser light beam, is obtained as a processed shape such as a modified shape of a worked shape. Rays of femtosecond laser light (L1, L2) are entered into lenses (16, 20), respectively, and the rays of laser light are focused inside a transparent material (100) by the lenses such that each of the optical axes of the rays has a predetermined angle. The light focus positions of the rays of femtosecond laser light are superposed inside the transparent material and the inside of the material is processed.
摘要翻译： 获得具有基本上完美的球体的形状，或者在与飞秒激光的前进方向平行的方向上具有大致正圆的横截面形状作为加工形状的修改形状。 飞秒激光（L 1，L 2）的光线分别进入到透镜（16,20）中，激光束被透镜聚焦在透明材料（100）内，使得每个光轴 光线具有预定的角度。 飞秒激光的光的聚焦位置叠加在透明材料的内部，材料的内部被加工。
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公开(公告)号：US20060124618A1
公开(公告)日：2006-06-15
申请号：US10514649
申请日：2003-05-15
申请人： Koji Sugioka , Ya Cheng , Katsumi Midorikawa
发明人： Koji Sugioka , Ya Cheng , Katsumi Midorikawa
CPC分类号： C03C23/0025 , B23K26/0624 , B23K26/066 , B23K26/53 , B23K26/55 , C03C4/04
摘要： A shape with a substantially perfect circle is obtained as a processed shape such as a modified shape or a worked shape at a light focus point in a cross-section in a direction parallel to an advance direction of a femtosecond laser light beam. A section in a direction perpendicular to an advance direction of a laser light beam emitted from a femtosecond laser (10) is formed in a predetermined shaped. The laser light of which sectional shape in the direction perpendicular to the advance direction is formed in the predetermined shape is entered into a lens (14). The light is focused by the lens inside a transparent material (100) and processes the inside of the transparent material.
摘要翻译： 在平行于飞秒激光的前进方向的截面的光聚焦点处获得具有基本上圆形的形状作为加工形状，例如改性形状或加工形状。 在与飞秒激光（10）发射的激光的前进方向垂直的方向上形成有规定形状的部分。 形成在与前进方向正交的方向上的截面形状的激光形成为规定的形状，被输入到透镜（14）中。 光线被透镜聚焦在透明材料（100）内并处理透明材料的内部。
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