公开(公告)号：US07022412B2

公开(公告)日：2006-04-04

申请号：US10452291

申请日：2003-06-03

申请人： Hiroshi Yoshida ,  Toshiro Saito ,  Haruo Akahoshi

发明人： Hiroshi Yoshida ,  Toshiro Saito ,  Haruo Akahoshi

IPC分类号： B32B15/08 ,  B32B15/16 ,  H05K1/03 ,  H05K1/05

CPC分类号： B32B15/08 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/1696 ,  C23C18/2086 ,  C23C18/285 ,  C23C18/30 ,  H05K1/0346 ,  H05K1/036 ,  H05K3/181 ,  H05K3/184 ,  H05K3/38 ,  H05K3/387 ,  H05K3/4661 ,  H05K2203/0315 ,  H05K2203/1105 ,  Y10T428/24917 ,  Y10T428/31725 ,  Y10T428/31765

摘要： A member useful in a printed wiring board comprises a resin insulating layer, a metallic fine particle or catalyst layer, a metal oxide layer, and a metallic or electroless plating layer, wherein the resin insulating layer contains a resin containing an aromatic amide site such as an epoxy-terminated aromatic polyamide.

摘要翻译： 可用于印刷线路板的部件包括树脂绝缘层，金属微粒或催化剂层，金属氧化物层和金属或化学镀层，其中树脂绝缘层包含含有芳族酰胺位点的树脂，例如 环氧封端的芳族聚酰胺。

公开(公告)号：US20050271828A1

公开(公告)日：2005-12-08

申请号：US11185897

申请日：2005-07-21

申请人： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

发明人： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

IPC分类号： H05K3/18 ,  H01L21/48 ,  H05H1/00 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

CPC分类号： H01L21/4846 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/381 ,  H05K3/389 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/0793 ,  H05K2203/095 ,  Y10T29/49126 ,  H01L2224/0401

摘要： Provided is a wiring board and production method thereof, wherein production of wiring by a full additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.

摘要翻译： 本发明提供一种布线基板及其制造方法，其特征在于，通过全加法制造布线。 这对于在绝缘树脂基板上形成具有高粘附性的细铜布线非常有用。 使用耐碱性优异的树脂作为绝缘树脂基板，并且通过包含酰胺基的退化层和金属氧化物层，在绝缘树脂基板上形成铜布线，该金属氧化物层的还原电位比 铜。 退化层可以通过例如将酰胺基引入绝缘树脂基材的表面来提供。 铜可以通过包括无电镀的工艺形成。 绝缘树脂基板具有极好的耐热性和尺寸稳定性，并且所形成的结构可以提供高度封装的布线板。

公开(公告)号：US06495769B1

公开(公告)日：2002-12-17

申请号：US09536645

申请日：2000-03-28

申请人： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

发明人： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

IPC分类号： H05K103

CPC分类号： H01L21/4846 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/381 ,  H05K3/389 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/0793 ,  H05K2203/095 ,  Y10T29/49126 ,  H01L2224/0401

摘要： Provided is a wiring board and production method thereof, wherein production of wiring by a full additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.

摘要翻译： 本发明提供一种布线基板及其制造方法，其特征在于，通过全加法制造布线。 这对于在绝缘树脂基板上形成具有高粘附性的细铜布线非常有用。 使用耐碱性优异的树脂作为绝缘树脂基板，并且通过包含酰胺基的退化层和金属氧化物层，在绝缘树脂基板上形成铜布线，该金属氧化物层的还原电位比 铜。 退化层可以通过例如将酰胺基引入绝缘树脂基材的表面来提供。 铜可以通过包括无电镀的工艺形成。 绝缘树脂基板具有极好的耐热性和尺寸稳定性，并且所形成的结构可以提供高度封装的布线板。

公开(公告)号：US20120130050A1

公开(公告)日：2012-05-24

申请号：US13388671

申请日：2010-07-29

申请人： Yasuhiko Tada ,  Hiroshi Yoshida ,  Toshiro Saito ,  Masatoshi Narahara ,  Hiroaki Nakagawa

发明人： Yasuhiko Tada ,  Hiroshi Yoshida ,  Toshiro Saito ,  Masatoshi Narahara ,  Hiroaki Nakagawa

IPC分类号： C07K17/14 ,  C07K1/04

CPC分类号： G01N33/54353 ,  A61K2039/625 ,  G01N33/543 ,  G01N33/54393

摘要： This invention provides a biomolecule modifying substrate comprising biomolecules selectively fixed to given regions thereon. The biomolecule modifying substrate comprises: a substrate at least comprising a first surface and a second surface; a first linker molecule comprising a hydrocarbon chain and a functional group capable of selectively binding to the first surface at one end of the hydrocarbon chain, which is bound to the first surface via such functional group; a second linker molecule comprising a reactive group capable of binding to the hydrocarbon chain of the first linker molecule, which is bound to the first linker molecule via a bond between the reactive group and the hydrocarbon chain; and a biomolecule bound thereto via the second linker molecule.

摘要翻译： 本发明提供一种生物分子修饰底物，其包含选择性地固定在其上给定区域上的生物分子。 生物分子修饰基质包括：至少包含第一表面和第二表面的基底; 第一连接分子，其包含烃链和能够选择性地结合到烃链一端的第一表面的官能团，其通过该官能团与第一表面结合; 第二连接分子，其包含能够结合第一连接分子的烃链的反应性基团，其通过反应性基团和烃链之间的键与第一连接分子结合; 和通过第二连接分子与其结合的生物分子。

公开(公告)号：US09040251B2

公开(公告)日：2015-05-26

申请号：US13388671

申请日：2010-07-29

申请人： Yasuhiko Tada ,  Hiroshi Yoshida ,  Toshiro Saito ,  Masatoshi Narahara ,  Hiroaki Nakagawa

发明人： Yasuhiko Tada ,  Hiroshi Yoshida ,  Toshiro Saito ,  Masatoshi Narahara ,  Hiroaki Nakagawa

IPC分类号： G01N33/53 ,  C07K1/04 ,  G01N33/551 ,  G01N33/543 ,  A61K39/00

CPC分类号： G01N33/54353 ,  A61K2039/625 ,  G01N33/543 ,  G01N33/54393

摘要： This invention provides a biomolecule modifying substrate comprising biomolecules selectively fixed to given regions thereon. The biomolecule modifying substrate comprises: a substrate at least comprising a first surface and a second surface; a first linker molecule comprising a hydrocarbon chain and a functional group capable of selectively binding to the first surface at one end of the hydrocarbon chain, which is bound to the first surface via such functional group; a second linker molecule comprising a reactive group capable of binding to the hydrocarbon chain of the first linker molecule, which is bound to the first linker molecule via a bond between the reactive group and the hydrocarbon chain; and a biomolecule bound thereto via the second linker molecule.

摘要翻译： 本发明提供一种生物分子修饰底物，其包含选择性地固定在其上给定区域上的生物分子。 生物分子修饰基质包括：至少包含第一表面和第二表面的基底; 第一连接分子，其包含烃链和能够选择性地结合到烃链一端的第一表面的官能团，其通过该官能团与第一表面结合; 第二连接分子，其包含能够结合第一连接分子的烃链的反应性基团，其通过反应性基团和烃链之间的键与第一连接分子结合; 和通过第二连接分子与其结合的生物分子。

公开(公告)号：US20130053280A1

公开(公告)日：2013-02-28

申请号：US13697019

申请日：2011-05-09

申请人： Koshin Hamasaki ,  Toshiro Saito

发明人： Koshin Hamasaki ,  Toshiro Saito

IPC分类号： C40B60/12 ,  C40B40/10 ,  C40B50/14 ,  C40B40/06

CPC分类号： C12Q1/6806 ,  C12Q1/6834 ,  G01N21/05 ,  G01N21/554 ,  G01N21/648 ,  G01N33/54346 ,  C12Q2565/518 ,  C12Q2565/507 ,  C12Q2563/155

摘要： Disclosed is a technique for binding microparticles to patterned bonding pads of a metal (e.g., gold) formed on a support. The microparticles each carry a nucleic acid synthetase or DNA probe immobilized thereon for capturing a nucleic acid sample fragment. The technique involves forming, on a support surface, a film having a thickness equivalent to that of the bonding pads; controlling the size of microparticles with respect to the size of bonding pads; and thereby immobilizing microparticles each bearing a single nucleic acid sample fragment to the bonding pads in a one-to-one manner in a grid form. This allows high-density regular alignment and immobilization of many types of nucleic acid fragment samples on a support and enables high-throughput analysis of nucleic acid samples. Typically, immobilization of microparticles at 1-micrometer intervals easily provides a high density of 106 nucleic acid fragments per square millimeter.

公开(公告)号：US08228505B2

公开(公告)日：2012-07-24

申请号：US12233184

申请日：2008-09-18

申请人： Masatoshi Narahara ,  Satoshi Takahashi ,  Toshiro Saito

发明人： Masatoshi Narahara ,  Satoshi Takahashi ,  Toshiro Saito

IPC分类号： G01N21/55

CPC分类号： G01N21/648 ,  G01N21/6428

摘要： An object of the present invention relates to detecting a target substance with high contrast. The invention relates to analysis of a target substance using a light-transmitting substrate and a metal for inducing plasmon resonance, and further using a low refractive index layer with an opening portion, which forms an interface with the substrate, and which has a lower refractive index than the substrate. Light emitted from a substrate side is totally reflected at the interface to irradiate the metal arranged in the opening portion with evanescent light. Light generated from the target substance by plasmon resonance of the evanescent light is detected. According to the invention, the radiation of evanescent light to a material other than the target substance can be reduced, and thereby light emission from the martial other than the target substance, e.g., a molecule floating around the target substance, can be reduced.

摘要翻译： 本发明的目的是检测具有高对比度的目标物质。 本发明涉及使用透光基板和用于诱导等离子体共振的金属的目标物质的分析，并且还使用具有与基板形成界面的开口部分的低折射率层，并且具有较低的折射率 指数比底物。 从基板侧发射的光在界面处被全反射，以照射具有ev逝光的开口部中的金属。 检测由目标物质通过ev逝光的等离子体共振产生的光。 根据本发明，可以减少对目标物质以外的材料的ev逝光的照射，从而可以减少来自目标物质以外的武器例如悬浮在目标物质周围的分子的发光。

公开(公告)号：US20110281320A1

公开(公告)日：2011-11-17

申请号：US13147117

申请日：2010-01-18

申请人： Toshiro Saito ,  Kazumichi Imai

发明人： Toshiro Saito ,  Kazumichi Imai

IPC分类号： C12N11/14 ,  C12M1/34 ,  C07H21/00 ,  C12M1/40 ,  C12N11/00

CPC分类号： C12Q1/6816 ,  C12Q2565/50 ,  C12Q2563/143

摘要： An object of the present invention is to regularly align microparticles, on each of which a nucleic acid synthetase or a DNA probe capable of capturing a nucleic acid sample fragment is immobilized, on a support so as to improve throughput of nucleic acid analysis. The present invention relates to a method comprising immobilizing a nucleic acid synthetase, a DNA probe, or the like in advance to a microparticle, forming a pattern of metal pads each having a diameter smaller than the microparticle diameter with gold or the like on a support, and allowing a microparticle to be bound to the pads via a chemical bond. In addition, when the surfaces of microparticles are electrically charged, a pattern of metal pads each having a diameter equivalent to or larger than the microparticle diameter is formed with gold or the like on a support and a microparticle is allowed to be bound to the pads via a chemical bond. According to the present invention, many types of nucleic acid fragment samples can be regularly aligned at a high density and immobilized on a support. This allows high throughput analysis of nucleic acid samples. For example, if microparticles are immobilized at 1-micron pitches, a high density of 106 nucleic acid fragments/emm2 can be readily achieved.

摘要翻译： 本发明的一个目的是在载体上规则地将微粒（其中每一个核酸合成酶或能够捕获核酸样品片段的DNA探针）定位在载体上，以便提高核酸分析的生产能力。 本发明涉及一种将核酸合成酶，DNA探针等预先固定在微粒上的方法，在支撑体上形成具有小于微粒径的直径的金属垫的图案 ，并且允许微粒通过化学键与焊盘结合。 此外，当微粒表面带电时，在支撑体上形成金等等于或大于微粒直径的金属垫的图案，并且允许微粒结合到垫 通过化学键。 根据本发明，许多类型的核酸片段样品可以高密度地定期排列并固定在载体上。 这允许核酸样品的高通量分析。 例如，如果微粒以1微米间距固定，则可以容易地实现高密度的106个核酸片段/ emm2。

公开(公告)号：US20090023202A1

公开(公告)日：2009-01-22

申请号：US12173472

申请日：2008-07-15

申请人： Masatoshi Narahara ,  Toshiro Saito ,  Satoshi Takahashi

发明人： Masatoshi Narahara ,  Toshiro Saito ,  Satoshi Takahashi

IPC分类号： C12M1/34

CPC分类号： G01N21/648 ,  G01N21/6428 ,  G01N21/6452 ,  G01N2021/058 ,  G01N2021/6439 ,  Y10S435/808

摘要： The present invention relates to a nucleic acid analysis device for analysis of nucleic acid in a sample through fluorometry, in which a localized surface plasmon by light irradiation, and in which a nucleic acid probe or a nucleic acid synthase for the analysis of the nucleic acid in the sample is disposed in a region of generation of the surface plasmon. The present invention allows the fluorescence intensifying effect of the surface plasmon to be produced efficiently and also enables the immobilization of a DNA probe or the nucleic acid synthase in a region on which the fluorescence intensifying effect is exerted, thus making it possible to carry out a measurement on the base elongation reaction without having to remove the unreacted substrate with the fluorescent molecule.

摘要翻译： 本发明涉及用于通过荧光测定分析样品中的核酸的核酸分析装置，其中通过光照射进行局部表面等离子体激光，并且其中用于核酸分析的核酸探针或核酸合酶 在样品中放置在产生表面等离子体的区域中。 本发明允许有效地产生表面等离子体激元的荧光增强效果，并且还能够在发挥荧光增强效果的区域中固定DNA探针或核酸合酶，从而可以进行 基本伸长反应的测量，而不用荧光分子去除未反应的底物。

公开(公告)号：US4869659A

公开(公告)日：1989-09-26

申请号：US211535

申请日：1988-05-25

申请人： Seiya Sakai ,  Mitsuo Suzuki ,  Toshiro Saito

发明人： Seiya Sakai ,  Mitsuo Suzuki ,  Toshiro Saito

IPC分类号： B29C45/76

CPC分类号： B29C45/7653

摘要： A toggle-type die-fastening apparatus has a movable platen that carries one mold part and is supported by and guided along a plurality of tie bars whose one ends are fixed to a fixed platen on which another mold part is mounted. The other ends of the tie bars are supported by a toggle support, and a toggle mechanism is disposed between the toggle support and the movable platen for pressing the mold part carried by the movable platen against the mold part mounted on the fixed platen. A die-fastening force adjusting nut is threaded onto the end portion of each tie bar that is closer to the toggle support so as to bear the reaction of the die-fastening force generated by the toggle mechanism. An adjusting cylinder is formed in this portion, and it is connected to a hydraulic circuit so that the pressure within each of the cylinders is controlled by a pressure adjusting valve in such a manner as to correspond to a die-fastening force set by a setting device. Therefore, the die-fastening forces of all the tie bars can be made the same, thereby eliminating any imbalance between the die-fastening forces of the tie bars caused by changes in thermal balance during the operation of the molding machine.