利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

114 条记录 (耗时 0.028 秒)

    Wiring board and production method thereof, and semiconductor apparatus
    2.
    发明申请
    Wiring board and production method thereof, and semiconductor apparatus 审中-公开
    接线板及其制造方法以及半导体装置

    公开(公告)号：US20050271828A1

    公开(公告)日：2005-12-08

    申请号：US11185897

    申请日：2005-07-21

    申请人： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

    发明人： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

    IPC分类号： H05K3/18 ,  H01L21/48 ,  H05H1/00 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

    CPC分类号： H01L21/4846 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/381 ,  H05K3/389 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/0793 ,  H05K2203/095 ,  Y10T29/49126 ,  H01L2224/0401

    摘要： Provided is a wiring board and production method thereof, wherein production of wiring by a full additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.

    摘要翻译： 本发明提供一种布线基板及其制造方法，其特征在于，通过全加法制造布线。 这对于在绝缘树脂基板上形成具有高粘附性的细铜布线非常有用。 使用耐碱性优异的树脂作为绝缘树脂基板，并且通过包含酰胺基的退化层和金属氧化物层，在绝缘树脂基板上形成铜布线，该金属氧化物层的还原电位比 铜。 退化层可以通过例如将酰胺基引入绝缘树脂基材的表面来提供。 铜可以通过包括无电镀的工艺形成。 绝缘树脂基板具有极好的耐热性和尺寸稳定性，并且所形成的结构可以提供高度封装的布线板。

    Wiring board and production method thereof, and semiconductor apparatus
    3.
    发明授权
    Wiring board and production method thereof, and semiconductor apparatus 失效
    接线板及其制造方法以及半导体装置

    公开(公告)号：US06495769B1

    公开(公告)日：2002-12-17

    申请号：US09536645

    申请日：2000-03-28

    申请人： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

    发明人： Toshiro Saito ,  Haruo Akahoshi ,  Takeyuki Itabashi

    IPC分类号： H05K103

    CPC分类号： H01L21/4846 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/381 ,  H05K3/389 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/0793 ,  H05K2203/095 ,  Y10T29/49126 ,  H01L2224/0401

    摘要： Provided is a wiring board and production method thereof, wherein production of wiring by a full additive method is achieved. This is extremely useful in forming fine copper wiring featuring a high adhesion on an insulating resin substrate. A resin having an excellent alkali resistance is used as the insulating resin substrate, and the copper wiring is formed on the insulating resin substrate through a degenerated layer containing amide group and a metallic oxide layer of a metal having a reduction potential more base than that of copper. The degenerated layer can be provided by, e.g., introduction of amide group into the surface of the insulating resin substrate. The copper can be formed by processes including electroless plating. The insulating resin substrate has superb heat resistance and dimensional stability, and the formed structure can provide a highly packed wiring board.

    摘要翻译： 本发明提供一种布线基板及其制造方法，其特征在于，通过全加法制造布线。 这对于在绝缘树脂基板上形成具有高粘附性的细铜布线非常有用。 使用耐碱性优异的树脂作为绝缘树脂基板，并且通过包含酰胺基的退化层和金属氧化物层，在绝缘树脂基板上形成铜布线，该金属氧化物层的还原电位比 铜。 退化层可以通过例如将酰胺基引入绝缘树脂基材的表面来提供。 铜可以通过包括无电镀的工艺形成。 绝缘树脂基板具有极好的耐热性和尺寸稳定性，并且所形成的结构可以提供高度封装的布线板。

    Wiring board and production method thereof
    6.
    发明申请
    Wiring board and production method thereof 审中-公开
    接线板及其制造方法

    公开(公告)号：US20060163725A1

    公开(公告)日：2006-07-27

    申请号：US11205175

    申请日：2005-08-17

    申请人： Toshio Haba ,  Hiroshi Yoshida ,  Haruo Akahoshi ,  Hitoshi Suzuki ,  Akira Chinda

    发明人： Toshio Haba ,  Hiroshi Yoshida ,  Haruo Akahoshi ,  Hitoshi Suzuki ,  Akira Chinda

    IPC分类号： H01L23/48 ,  H01L21/44

    CPC分类号： H05K3/241 ,  H01L21/4846 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/108 ,  H05K3/382 ,  H05K3/388 ,  H01L2924/00

    摘要： It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film.

    摘要翻译： 本发明的目的是提供一种具有受控形状的高密度布线而不用抗蚀剂膜掩蔽的布线板及其制造方法。 在本发明中，在绝缘基板上具有铜布线的布线基板的制造方法包括以下步骤：在绝缘基板上形成金属籽晶层，金属种子层的粗糙化部分在铜布线或 形成凸起，并且通过电镀在具有粗糙形状的金属种子层的部分上形成铜或铜的合金的电镀膜。 在镀浴中加入抑制电镀反应的物质，在绝缘性基材的表面与电镀膜的一侧之间形成90度以下的角度。

    Fine metal structure, process for producing the same, fine metal mold and device
    9.
    发明授权
    Fine metal structure, process for producing the same, fine metal mold and device 失效
    精细金属结构，制造方法，精细金属模具及装置

    公开(公告)号：US08741380B2

    公开(公告)日：2014-06-03

    申请号：US12859802

    申请日：2010-08-20

    申请人： Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

    发明人： Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

    IPC分类号： A61M5/00 ,  A61M5/32

    CPC分类号： B29C33/3842 ,  B29C33/424 ,  B81B2203/0361 ,  B81C1/00111 ,  B81C1/00206 ,  B81C99/0085 ,  B81C99/009 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1657 ,  C23C18/1689 ,  C23C18/208 ,  C23C18/42 ,  G03F7/0002 ,  H01J1/304 ,  H01J9/025 ,  Y10T428/12389 ,  Y10T428/12993

    摘要： A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.

    摘要翻译： 精细的金属结构，其表面具有高强度，高精度和大纵横比的微喷射体; 以及没有缺陷的金属微细结构的制造方法。 提供了具有微喷射体的表面的细金属结构，其特征在于，微喷射体具有10纳米至10微米的最小厚度或最小直径，并且微喷射体的最小厚度或最小直径（D）与高度 的微喷射体（H）H / D大于1.还提供了一种制造精细金属结构的方法，其特征在于，在其表面上提供具有细凹凸图案的基板，将分子无电镀催化剂 然后进行无电解电镀，从而形成具有凹凸图案的金属层，并将金属层与基板分离，从而获得配备有经过上述凹凸图案的反转传送的表面的精细金属结构。

    Wiring Board and Production Method Thereof
    10.
    发明申请
    Wiring Board and Production Method Thereof 审中-公开
    接线板及其生产方法

    公开(公告)号：US20080251387A1

    公开(公告)日：2008-10-16

    申请号：US12137582

    申请日：2008-06-12

    申请人： Toshio Haba ,  Hiroshi Yoshida ,  Haruo Akahoshi ,  Hitoshi Suzuki ,  Akira Chinda

    发明人： Toshio Haba ,  Hiroshi Yoshida ,  Haruo Akahoshi ,  Hitoshi Suzuki ,  Akira Chinda

    IPC分类号： C25D5/02 ,  C25D7/00

    CPC分类号： H05K3/241 ,  H01L21/4846 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/108 ,  H05K3/382 ,  H05K3/388 ,  H01L2924/00

    摘要： It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film.

    摘要翻译： 本发明的目的是提供一种具有受控形状的高密度布线而不用抗蚀剂膜掩蔽的布线板及其制造方法。 在本发明中，在绝缘基板上具有铜布线的布线基板的制造方法包括以下步骤：在绝缘基板上形成金属籽晶层，金属种子层的粗糙化部分在铜布线或 形成凸起，并且通过电镀在具有粗糙形状的金属种子层的部分上形成铜或铜的合金的电镀膜。 在镀浴中加入抑制电镀反应的物质，在绝缘性基材的表面与电镀膜的一侧之间形成90度以下的角度。