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719 条记录 (耗时 0.027 秒)

    Metal structure and method of its production
    2.
    发明授权
    Metal structure and method of its production 有权
    金属结构及其生产方法

    公开(公告)号：US07922887B2

    公开(公告)日：2011-04-12

    申请号：US11340570

    申请日：2006-01-27

    申请人： Toshio Haba ,  Hiroshi Yoshida ,  Haruo Akahoshi ,  Hitoshi Suzuki

    发明人： Toshio Haba ,  Hiroshi Yoshida ,  Haruo Akahoshi ,  Hitoshi Suzuki

    IPC分类号： C25D5/16 ,  C25D5/02

    CPC分类号： C25D3/38 ,  C25D5/02 ,  C25D5/56

    摘要： The present invention provides a method for producing a metal structure comprising a substrate and a metal film formed on the substrate; comprising the steps of providing surface having irregularities made of a electrical conductor in the area of the substrate where the metal body or film is to be formed; and preferentially forming the metal body or film by electroplating in the area provided with the conductive surface having irregularities. The plating bath may preferably contain an additive compound such as a cyanine dye which is capable of suppressing the plating reaction, and which loses such plating-suppressing effect with the progress of the plating reaction. The metal film can be produced by electroplating in the area provided with the surface having irregularities.

    摘要翻译： 本发明提供一种金属结构体的制造方法，该金属结构体包括在基板上形成的基板和金属膜; 包括以下步骤：在要形成金属体或膜的基板的区域中提供具有由电导体制成的凹凸的表面; 并且优选地在设置有具有不规则性的导电表面的区域中通过电镀形成金属体或膜。 电镀浴可以优选含有能够抑制电镀反应的花青染料等添加剂化合物，并且随着电镀反应的进行而失去这种电镀抑制效果。 金属膜可以通过在具有不规则的表面的区域中进行电镀而制造。

    Fine Metal Structure, Process for Producing the Same, Fine Metal Mold and Device
    3.
    发明申请
    Fine Metal Structure, Process for Producing the Same, Fine Metal Mold and Device 失效
    精细金属结构，制造方法，精细金属模具和装置

    公开(公告)号：US20100310773A1

    公开(公告)日：2010-12-09

    申请号：US12859802

    申请日：2010-08-20

    申请人： Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

    发明人： Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

    IPC分类号： B05D3/10

    CPC分类号： B29C33/3842 ,  B29C33/424 ,  B81B2203/0361 ,  B81C1/00111 ,  B81C1/00206 ,  B81C99/0085 ,  B81C99/009 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1657 ,  C23C18/1689 ,  C23C18/208 ,  C23C18/42 ,  G03F7/0002 ,  H01J1/304 ,  H01J9/025 ,  Y10T428/12389 ,  Y10T428/12993

    摘要： A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.

    摘要翻译： 精细的金属结构，其表面具有高强度，高精度和大纵横比的微喷射体; 以及没有缺陷的金属微细结构的制造方法。 提供了具有微喷射体的表面的细金属结构，其特征在于，微喷射体具有10纳米至10微米的最小厚度或最小直径，并且微喷射体的最小厚度或最小直径（D）与高度 的微喷射体（H）H / D大于1.还提供了一种制造精细金属结构的方法，其特征在于，在其表面上提供具有细凹凸图案的基板，将分子无电镀催化剂 然后进行无电解电镀，从而形成具有凹凸图案的金属层，并将金属层与基板分离，从而获得配备有经过上述凹凸图案的反转传送的表面的精细金属结构。

    Wiring board and production method thereof
    7.
    发明申请
    Wiring board and production method thereof 审中-公开
    接线板及其制造方法

    公开(公告)号：US20060163725A1

    公开(公告)日：2006-07-27

    申请号：US11205175

    申请日：2005-08-17

    申请人： Toshio Haba ,  Hiroshi Yoshida ,  Haruo Akahoshi ,  Hitoshi Suzuki ,  Akira Chinda

    发明人： Toshio Haba ,  Hiroshi Yoshida ,  Haruo Akahoshi ,  Hitoshi Suzuki ,  Akira Chinda

    IPC分类号： H01L23/48 ,  H01L21/44

    CPC分类号： H05K3/241 ,  H01L21/4846 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/108 ,  H05K3/382 ,  H05K3/388 ,  H01L2924/00

    摘要： It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film.

    摘要翻译： 本发明的目的是提供一种具有受控形状的高密度布线而不用抗蚀剂膜掩蔽的布线板及其制造方法。 在本发明中，在绝缘基板上具有铜布线的布线基板的制造方法包括以下步骤：在绝缘基板上形成金属籽晶层，金属种子层的粗糙化部分在铜布线或 形成凸起，并且通过电镀在具有粗糙形状的金属种子层的部分上形成铜或铜的合金的电镀膜。 在镀浴中加入抑制电镀反应的物质，在绝缘性基材的表面与电镀膜的一侧之间形成90度以下的角度。