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公开(公告)号：US20250021854A1
公开(公告)日：2025-01-16
申请号：US18582734
申请日：2024-02-21
Applicant: Hitachi, Ltd.
Inventor： Takanobu TSUNODA , Tomonori SEKIGUCHI
IPC: G06N10/20
Abstract: It is possible to implement a control device for a quantum bit array having high practical utility, that can efficiently hold, with a small number of bits, control parameters necessary for quantum operation in the quantum bit array in which a plurality of quantum bits are arranged. There is provided a control device that controls quantum operation in a quantum bit array in which a plurality of quantum bits are arranged one-dimensionally or two-dimensionally. The control device includes a command memory that stores a plurality of control commands and a parameter memory that stores part or all of control parameters accompanying the control commands. A command format of the control commands includes one or more parameter specifying fields to specify either an immediate value of a control parameter or reference to the control parameter stored in the parameter memory.
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公开(公告)号：US20190250062A1
公开(公告)日：2019-08-15
申请号：US16133125
申请日：2018-09-17
Applicant: HITACHI, LTD.
Inventor： Hiroaki FURUICHI , Hiroyuki OOTA , Tomonori SEKIGUCHI
Abstract: A sensor terminal includes: a vibration sensor; an L-shaped attachment main body portion on which the vibration sensor is mounted and that is detachably attached to a truncated quadrangular pyramid structure portion of a valve cap attached to an opening/closing shaft portion of a water regulating valve provided in a water service pipe; side surface magnets that are provided in the attachment main body portion; and an upper surface magnet that is attached to a lower surface of a base on which the vibration sensor is mounted. Further, the truncated quadrangular pyramid structure portion includes a quadrangular upper surface and four side surfaces, and the attachment main body portion of the sensor terminal is fixed using magnet to each of the upper surface of the truncated quadrangular pyramid structure portion and at least one side surface among the four side surfaces.
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公开(公告)号：US20180370793A1
公开(公告)日：2018-12-27
申请号：US15918502
申请日：2018-03-12
Applicant: Hitachi, Ltd.
Inventor： Masaharu KINOSHITA , Atsushi ISOBE , Kazuo ONO , Noriyuki SAKUMA , Tomonori SEKIGUCHI , Keiji WATANABE
Abstract: A manufacturing method of a MEMS sensor includes a step of, by irradiating a first hole formed in a second layer on a semiconductor substrate with a focused ion beam for a first predetermined time, forming a first sealing film, which seals the first hole, on the first hole, and a step of, by irradiating a second hole formed in the second layer with a focused ion beam for a second predetermined time, forming a second sealing film, which seals the second hole, on the second hole. At this time, each of the first predetermined time and the second predetermined time is a time in which thermal equilibrium of the second layer is maintainable, and the step of forming the first sealing film and the step of forming the second sealing film are performed repeatedly.
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公开(公告)号：US20180017958A1
公开(公告)日：2018-01-18
申请号：US15593747
申请日：2017-05-12
Applicant: HITACHI, LTD.
Inventor： Masaharu KINOSHITA , Nobuyuki SUGII , Tomonori SEKIGUCHI , Shuntaro MACHIDA , Tetsufumi KAWAMURA
IPC: G05B19/4099
CPC classification number: G05B19/4099 , G05B19/41865 , G05B2219/31342 , G05B2219/35008 , G05B2219/35499 , G05B2219/45031 , Y02P90/20 , Y02P90/26 , Y02P90/265
Abstract: A manufacturing device inputs design information including three-dimensional structure data, generates a manufacturing process flow, and displays the manufacturing process flow on a screen for a user to check, modify, and confirm the flow based on design information and setting information. A process method includes a first process method of a direct modeling method having an FIB method and a second process method of a semiconductor manufacturing process method which is a non-FIB method. The manufacturing device generates a plurality of manufacturing process flows by a combination of cases where each of the process methods is applied to each of the regions of the three-dimensional data. The manufacturing process flow includes a process device, the process method, a control parameter value, a process time, and a total process time for each of process steps. An output unit outputs a manufacturing process flow having, for example, the shortest total process time.
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公开(公告)号：US20170018471A1
公开(公告)日：2017-01-19
申请号：US15182657
申请日：2016-06-15
Applicant: Hitachi, Ltd.
Inventor： Takanori AONO , Tomonori SEKIGUCHI , Takashi SHIOTA , Yuudai KAMADA , Atsushi ISOBE
IPC: H01L23/053 , G01L9/02 , G01P15/18 , G01P3/44 , H01L23/498 , B81B7/00
CPC classification number: G01L9/02 , B81B7/0048 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2207/07 , G01C19/5783 , G01L9/12 , G01P1/006 , G01P1/023 , H01L23/057 , H01L23/49838 , H01L23/49861 , H01L2224/16225
Abstract: To provide a physical quantity sensor in which the influence of deformation of a package substrate on the measuring accuracy of a sensor element can be suppressed. A physical quantity sensor includes a sensor element that detects a predetermined physical quantity and outputs an electrical signal, a plurality of lead portions that are connected to the sensor element, and a package substrate that accommodates the sensor element and the plurality of lead portions. The plurality of lead portions are connected at proximal end sides thereof to the package substrate side, and connected at distal end sides thereof to the sensor element side, and the plurality of lead portions support the sensor element in such a manner that the sensor element does not contact the package substrate and that the transmission of deformation of the package substrate side to the sensor element is suppressed.
Abstract translation: 提供能够抑制封装基板的变形对传感器元件的测量精度的影响的物理量传感器。 物理量传感器包括检测预定物理量并输出电信号的传感器元件，连接到传感器元件的多个引线部分和容纳传感器元件和多个引线部分的封装基板。 多个引线部分在其近端侧连接到封装基板侧，并且在其远端侧连接到传感器元件侧，并且多个引线部分以传感器元件的方式支撑传感器元件 不接触封装基板，并且抑制封装基板侧向传感器元件的变形的传输。
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Patent Agency Ranking
公开(公告)号：US20200278463A1
公开(公告)日：2020-09-03
申请号：US16646197
申请日：2017-10-25
Applicant: HITACHI, LTD.
Inventor： Akira MAEKI , Shiro MAZAWA , Tatsuyuki SAITO , Takao SAKURAI , Tomonori SEKIGUCHI
Abstract: An internal structure detection system includes: two kinds of sensors with different operating principles for receiving reflected waves of vibration applied to an inspection target in an investigation area; and a processing apparatus that detects an internal structure of the inspection target by using the sensor data received by the two kinds of sensors. The two kinds of sensors are deployed in the investigation area with different densities, in a distributed manner.
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公开(公告)号：US20180252744A1
公开(公告)日：2018-09-06
申请号：US15671340
申请日：2017-08-08
Applicant: HITACHI, LTD.
Inventor： Yuudai KAMADA , Atsushi ISOBE , Noriyuki SAKUMA , Chisaki TAKUBO , Tomonori SEKIGUCHI
IPC: G01P15/125 , B81B3/00 , G01P15/08 , G01P15/18 , H01H1/00
CPC classification number: G01P15/125 , B81B3/0051 , B81B2201/0235 , G01P15/0802 , G01P15/18 , G01P2015/0871 , H01H1/0036 , H01H36/0006
Abstract: Provided is an acceleration sensor having a large mass in a movable portion, and realizing high impact resistance. An acceleration sensor element 10a includes an upper substrate 20, a lower substrate 21 spaced apart from the upper substrate 20, and an intermediate substrate 19 provided between the upper substrate 20 and the lower substrate 21. Each of a first movable portion 16, a second movable portion 17, a frame portion 12, a fixed portion 13, and a spring portion 14 constituting the intermediate substrate 19 is configured with two layers of an upper layer and a lower layer, and a stopper portion 18 is provided at one end of the frame portion 12. A distance 31 between an end portion of the first movable portion 16 or the second movable portion 17 and an end portion of the stopper portion 18 in the upper layer and a distance 32 between an end portion of the first movable portion 16 or the second movable portion 17 and an end portion of the stopper portion 18 in the lower layer are different from each other.
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公开(公告)号：US20190162752A1
公开(公告)日：2019-05-30
申请号：US16127268
申请日：2018-09-11
Applicant: Hitachi, Ltd.
Inventor： Atsushi ISOBE , Yuudai KAMADA , Chisaki TAKUBO , Noriyuki SAKUMA , Tomonori SEKIGUCHI
IPC: G01P15/125 , G01P15/08 , G01P15/18 , G01H11/06
Abstract: In an acceleration sensor detecting a vibration acceleration by using torsion of a beam joining a fixed portion and a membrane, a spring constant of the beam is decreased while an increase in a chip size due to extension of the beam is prevented, so that an acceleration sensor that is highly sensitive and small in a size is provided with a low price. A sensor of a capacitance detecting type includes a membrane having a stacking structure formed of two or more layers and a plurality of beams capable of twisting so that the membrane is movable in a detecting direction, a first beam of the plurality of beams is formed of the same layer as either an upper or a lower layer of the membrane, and a second beam thereof is formed of the same layer as either an upper or a lower layer of the movable portion.
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公开(公告)号：US20180346321A1
公开(公告)日：2018-12-06
申请号：US15912604
申请日：2018-03-06
Applicant: HITACHI, LTD.
Inventor： Chisaki TAKUBO , Atsushi ISOBE , Noriyuki SAKUMA , Yuudai KAMADA , Tomonori SEKIGUCHI
IPC: B81B7/02 , B81C1/00 , G01P15/125
Abstract: An object of the invention is to provide a MEMS device that is easy to set a cavity inner pressure to a desired value by utilizing normally-used MEMS device manufacturing processes and process materials without increase in the number of processes of manufacturing the MEMS device. In order to solve the problem, as a typical MEMS device of the present invention, a MEMS device having a cavity includes an insulating film containing hydrogen in vicinity of the cavity and a hydrogen barrier film covering the insulating film.
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公开(公告)号：US20180246239A1
公开(公告)日：2018-08-30
申请号：US15753989
申请日：2016-02-15
Applicant: Hitachi, Ltd.
Inventor： Akira MAEKI , Tomonori SEKIGUCHI
CPC classification number: G01V1/303 , G01K3/04 , G01P15/125 , G01V1/003 , G01V1/16 , G01V11/00 , G06K19/0717 , G06N5/003
Abstract: An exploration system includes an artificial seismic source, sensor terminals, an environmental sensor, and a computer, wherein each of a plurality of sensor terminals is provided with a velocity or acceleration sensor which detects vibration generated by the artificial seismic source, and an identifier which is unique to the velocity or acceleration sensor; the environmental sensor detects an external environment which influences the velocity or acceleration sensor; and the computer stores a deterioration model which possibly indicates, as a degree of deterioration, performance deterioration of the velocity or acceleration sensor by providing information about the external environment as a variable, associates, with the identifier, the information about the external environment detected by the environmental sensor, stores the information about the external environment as a usage history, and determines a deterioration state of the velocity or acceleration sensor or the sensor terminal on the basis of the deterioration model.
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