摘要:
Disclosed is a lithium secondary battery comprising a cathode, an anode, an electrolyte and a separator, wherein the anode comprises an anode active material having a specific surface area of 3 m2/g or less, and the electrolyte comprises 0.1˜6 parts by weight of a propane sultone-based compound based on 100 parts by weight of the electrolyte. The lithium secondary battery solves the problem of performance degradation caused by the use of an increased amount of a propane sultone-based compound required to form a SEI film on the surface of an anode upon the first charge cycle. Also, the lithium secondary battery can provide improved cycle characteristics and high-temperature storage characteristics.
摘要:
Disclosed is an electrolyte for a battery, which comprises: (a) an electrolyte salt; (b) a solvent for electrolyte; and (c) a compound represented by the following formula 1: wherein R is a halogen atom, or a halogen-substituted or non-substituted C1˜C10 alkyl group or alkenyl group. An electrode comprising a passivation layer partially or totally formed on a surface thereof, wherein the passivation layer comprises a compound represented by the following Formula 1 or a chemical reaction product thereof, and a secondary battery using the electrolyte and/or the electrode are also disclosed. The compound can improve the initial charge/discharge efficiency and cycle life characteristics of a secondary battery, and can inhibit a battery from swelling under high-temperature storage conditions.
摘要:
Disclosed is an electrolyte for batteries, which comprises: (a) an electrolyte salt; (b) an electrolyte solvent; and (c) a sulfonate-based compound containing at least one electron withdrawing group (EWG) selected from the group consisting of a cyano group (—CN), an isocyanate group (—NCO), a thiocyanate group (—SCN) and an isothiocyanate group (—NCS). An electrode comprising the sulfonate-based compound or a chemical reaction product thereof, partially or totally formed on the surface thereof, and an electrochemical device comprising the electrolyte and/or the electrode are also disclosed. The electrochemical device using the sulfonate-based compound containing a cyano group, an isocyanate group, a thiocyanate group and/or an isothiocyanate group as an additive for electrolytes can provide significantly improved high-temperature lifespan characteristics.
摘要:
A semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device includes a semiconductor substrate in which PMOS transistor regions and NMOS transistor regions are formed, a PMOS transistor including P-type source and drain regions and a gate electrode, and an NMOS transistor formed on an Si channel region between N-type source and drain regions. The PMOS transistor is formed in each PMOS transistor region, and the gate electrode is formed on a high-dielectric gate insulating film formed on an SiGe channel region between the P-type source and drain regions. Further, the NMOS transistor includes a high-dielectric gate insulating film and a gate electrode formed on the gate insulating film, and the NMOS transistor is formed in each NMOS transistor region.
摘要:
Semiconductor devices are fabricated using a plasma process with a non-silane gas that includes deuterium, and which may result in improved device reliability and/or other improved device operational characteristics. One such method can include forming a gate oxide layer on a transistor region, which is defined on a substrate, and forming a gate electrode on the gate oxide layer. An etch stop layer is formed on the gate oxide layer and the gate electrode. A plasma process is performed on the interface between the gate oxide layer and the substrate using a non-silane treatment gas including deuterium. An interlayer dielectric layer is formed on the etch stop layer. A bottom metal line is formed on the interlayer dielectric layer.
摘要:
A method of forming an integrated circuit includes selectively forming active channel regions for NMOS and PMOS transistors on a substrate parallel to a crystal orientation thereof and selectively forming source/drain regions of the NMOS transistors with Carbon (C) impurities therein.
摘要:
Disclosed are processes and techniques for fabricating semiconductor substrates for the manufacture of semiconductor devices, particularly CMOS devices, that include selectively formed, high quality single crystal or monocrystalline surface regions exhibiting different crystal orientations. At least one of the surface regions will incorporate at least one faceted epitaxial semiconductor structure having surfaces that exhibit a crystal orientation different than the semiconductor region on which the faceted epitaxial semiconductor structure is formed. According, the crystal orientation in the channel regions of the NMOS and/or PMOS devices may be configured to improve the relative performance of at least one of the devices and allow corresponding redesign of the semiconductor devices fabricated using such a process.
摘要:
In methods of selectively forming an epitaxial semiconductor layer on a single crystalline semiconductor and semiconductor devices fabricated using the same, a single crystalline epitaxial semiconductor layer and a non-single crystalline epitaxial semiconductor layer are formed on a single crystalline semiconductor and a non-single crystalline semiconductor pattern respectively, using a main semiconductor source gas and a main etching gas. The non-single crystalline epitaxial semiconductor layer is removed using a selective etching gas. The main gases and the selective etching gas are alternately and repeatedly supplied at least two times to selectively form an elevated single crystalline epitaxial semiconductor layer having a desired thickness only on the single crystalline semiconductor. The selective etching gas suppresses formation of an epitaxial semiconductor layer on the non-single crystalline semiconductor pattern.
摘要:
Methods of fabricating semiconductor integrated circuit devices are provided. A substrate is provided with gate patterns formed on first and second regions. Spaces between gate patterns on the first region are narrower than spaces between gate patterns on the second region. Source/drain trenches are formed in the substrate on opposite sides of the gate patterns on the first and second regions. A first silicon-germanium (SiGe) epitaxial layer is formed that partially fills the source/drain trenches using a first silicon source gas. A second SiGe epitaxial layer is formed directly on the first SiGe epitaxial layer to further fill the source/drain trenches using a second silicon source gas that is different from the first silicon source gas.
摘要:
A semiconductor device having a locally buried insulation layer and a method of manufacturing a semiconductor device having the same are provided, in which a gate electrode is formed on a substrate, and oxygen ions are implanted into an active region to form a locally buried insulation layer. An impurity layer is formed on the locally buried insulation layer to form a source/drain. A silicide layer is formed on the source/drain and on the gate electrode. The locally buried insulation layer can prevent junction leakage, decrease junction capacitance and prevent a critical voltage of an MOS transistor from increasing due to body bias, thereby to improve characteristics of the device.