摘要:
An image sensor that has a pixel array using an isolation structure between pixels that reduce electrical cross-talk is disclosed. The pixel array is formed on a substrate that has a thin (less than 5 microns) epitaxial layer. The isolation structure uses a deep p-well to surround a shallow trench isolation. The deep p-well is formed using an implant energy of typically over 700 keV.
摘要:
An integrated circuit system includes a first device wafer that has a first semiconductor layer proximate to a first metal layer including a first conductor disposed within a first metal layer oxide. A second device wafer that has a second semiconductor layer proximate to a second metal layer including a second conductor disposed within a second metal layer oxide is also included. A frontside of the first metal layer oxide is bonded to a frontside of the second metal layer oxide at an oxide bonding interface between the first metal layer oxide and the second metal layer oxide. A conductive path couples the first conductor to the second conductor with conductive material formed in a cavity etched between the first conductor and the second conductor and etched through the oxide bonding interface and through the second semiconductor layer from a backside of the second device wafer.
摘要:
An integrated circuit system includes a first device wafer having a first semiconductor layer proximate to a first metal layer including a first conductor disposed within a first metal layer oxide. A second device wafer having a second semiconductor layer proximate to a second metal layer including a second conductor is disposed within a second metal layer oxide. A frontside of the first device wafer is bonded to a frontside of the second device wafer at a bonding interface. A conductive path couples the first conductor to the second conductor through the bonding interface. A first metal EMI shield is disposed in one of the first metal oxide layer and second metal layer oxide layer. The first EMI shield is included in a metal layer of said one of the first metal oxide layer and the second metal layer oxide layer nearest to the bonding interface.
摘要:
An integrated circuit system includes a first device wafer having a first semiconductor layer proximate to a first metal layer including a first conductor disposed within a first metal layer oxide. A second device wafer having a second semiconductor layer proximate to a second metal layer including a second conductor is disposed within a second metal layer oxide. A frontside of the first device wafer is bonded to a frontside of the second device wafer at a bonding interface. A conductive path couples the first conductor to the second conductor through the bonding interface. A first metal EMI shield is disposed in one of the first metal oxide layer and second metal layer oxide layer. The first EMI shield is included in a metal layer of said one of the first metal oxide layer and the second metal layer oxide layer nearest to the bonding interface.
摘要:
A CMOS image sensor that has reduced transistor count is disclosed. The individual pixels are formed by a photodiode and a transfer transistor. An output node receives the signal from the photodiode via the transfer transistor. The output node is shared between multiple pixels. Further, a reset transistor is coupled between a selectable low voltage rail Vss or a high voltage reference Vref and the output node. The gate of an output transistor is then coupled to the output node. Both the reset transistor and output transistors are shared between multiple pixels. Further, the pixels have a mirror symmetry about the output transistor or output node.
摘要:
A backside illuminated imaging sensor pixel includes a photodiode region, a pixel circuitry region, and a storage capacitor. The photodiode region is disposed within a semiconductor die for accumulating an image charge. The pixel circuitry region is disposed on the semiconductor die between a frontside of the semiconductor die and the photodiode region. The pixel circuitry region overlaps at least a portion of the photodiode region. The storage capacitor is included within the pixel circuitry region overlapping the photodiode region and is selectively coupled to the photodiode region to temporarily store image charges accumulated thereon.
摘要:
The active pixel includes a photodiode, a reset transistor, and a pixel output transistor. The photodiode is substantially covered with a protective structure, thus protecting the entire surface of the photodiode from damage. This substantially eliminates potential leakage current sources, which result in dark current. The protective structure has a photodiode contact formed therein to electrically connect the photodiode to the pixel output transistor.
摘要:
The image sensor includes a first group and a second group of column readout circuits for reading out pixel signals from said pixels. The total number of column readout circuits in each group is substantially less than the number of columns in the image sensor pixel array. Further included is a multiplexer bus system having selection switches for selectively switching pixel signals from a block of pixels in a column as input into the first group of column readout circuits. The multiplexer bus system also selectively switches pixel signals from another block of pixels in a column as input into a second group of column readout circuits. However, when the first group of column readout circuits is reading and storing said pixel signals, the second group of column readout circuits is transferring out the processed signals. Thus, the first and second groups work alternately.
摘要:
The active pixel includes a photodiode, a reset transistor, and a pixel output transistor. The photodiode is substantially covered with a protective structure, thus protecting the entire surface of the photodiode from damage. This substantially eliminates potential leakage current sources, which result in dark current. The protective structure has a photodiode contact formed therein to electrically connect the photodiode to the pixel output transistor.
摘要:
The present invention is directed to an analog delay line for a color CMOS image sensor which is compatible with MOS fabrication technology. The invention allows for the simultaneous reading of pixel signals from two rows of pixels so that combinations of signals from pixels in different rows may be obtained. The delay line includes a set of storage capacitors on which the pixel signals are stored, and a means for writing the signals from the pixels onto the capacitors in sequence. The stored analog pixel signals may then be read out from the delay line at the appropriate time so that they may be combined with pixel signals from adjacent pixels in different rows. In one embodiment, two delay lines are used, so that pixel signals from a current row can be written into one delay line, while the pixel signals from a previous row are being read out from the other delay line. In another embodiment, a single delay line is used in combination with a single pixel delay circuit. When the single pixel delay circuit is used, the pixel signals from a previous row are read out from the delay line and temporarily stored in the single pixel delay circuit, one at a time, shortly after which the pixel signals from the next row are written into the delay line. The pixel signals from the single pixel delay circuit are then read out at the same time that the pixel signals from the next row are being read in, so that signals from adjacent pixels in adjacent rows are available to the processing circuitry at the same time.