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1.发明申请INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HIGH-DENSITY SMALL FOOTPRINT SYSTEM-IN-PACKAGE 有权集成电路封装系统，包括高密度小封装系统的封装公开(公告)号：US20070096282A1
公开(公告)日：2007-05-03
申请号：US11163771
申请日：2005-10-29
申请人： IL Kwon Shim , Tsz Yin Ho , Dario S. Filoteo , Seng Guan Chow
发明人： IL Kwon Shim , Tsz Yin Ho , Dario S. Filoteo , Seng Guan Chow
IPC分类号： H01L23/02
CPC分类号： H01L24/83 , H01L23/49811 , H01L23/64 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/16 , H01L25/162 , H01L25/50 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/4824 , H01L2224/48247 , H01L2224/49175 , H01L2224/73257 , H01L2224/73265 , H01L2224/83136 , H01L2224/83192 , H01L2224/8385 , H01L2224/85 , H01L2924/00014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/19107 , H05K1/141 , H05K3/321 , H05K3/3436 , H05K3/3457 , H05K2201/10515 , H05K2201/10992 , H05K2203/0278 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are provided on the substrate, the solder separators having flattened tops at a predetermined height above the substrate. A die is supported on the solder separators above the substrate.
摘要翻译： 提供了一种集成电路封装系统，其包括具有基板的高密度小尺寸封装体系。 无源元件安装在基板上。 焊料分离器设置在基板上，焊料分离器在基板上方的预定高度处具有平坦的顶部。 在基板上方的焊料分离器上支撑管芯。
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2.发明授权Integrated circuit package system including high-density small footprint system-in-package 有权集成电路封装系统，包括高密度小型封装系统公开(公告)号：US07622325B2
公开(公告)日：2009-11-24
申请号：US11163771
申请日：2005-10-29
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L23/49811 , H01L23/64 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/16 , H01L25/162 , H01L25/50 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/4824 , H01L2224/48247 , H01L2224/49175 , H01L2224/73257 , H01L2224/73265 , H01L2224/83136 , H01L2224/83192 , H01L2224/8385 , H01L2224/85 , H01L2924/00014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/19107 , H05K1/141 , H05K3/321 , H05K3/3436 , H05K3/3457 , H05K2201/10515 , H05K2201/10992 , H05K2203/0278 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are provided on the substrate, the solder separators having flattened tops at a predetermined height above the substrate. A die is supported on the solder separators above the substrate.
摘要翻译： 提供了一种集成电路封装系统，其包括具有基板的高密度小尺寸封装体系。 无源元件安装在基板上。 焊料分离器设置在基板上，焊料分离器在基板上方的预定高度处具有平坦的顶部。 在基板上方的焊料分离器上支撑管芯。
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公开(公告)号：US07445955B2
公开(公告)日：2008-11-04
申请号：US11160837
申请日：2005-07-12
CPC分类号： H01L25/0655 , H01L21/50 , H01L23/13 , H01L23/36 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/15321 , H01L2924/181 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
摘要翻译： 一种用于制造多芯片组件封装的方法，包括：提供第一散热器，其定位成用于释放来自封装的热量，并提供靠近第一散热器定位的第二散热器。 散热器热耦合并且彼此电隔离。 第一半导体器件被附接到第一散热器，与第一散热器进行热和电通信并与第二散热器电绝缘。 第二半导体器件与第二散热器热连接并与之电气连通，并与第一散热器电绝缘。
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公开(公告)号：US07928564B2
公开(公告)日：2011-04-19
申请号：US12237276
申请日：2008-09-24
IPC分类号： H01L23/34
CPC分类号： H01L25/0655 , H01L21/50 , H01L23/13 , H01L23/36 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/15321 , H01L2924/181 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
摘要翻译： 一种用于制造多芯片组件封装的方法，包括：提供第一散热器，其定位成用于释放来自封装的热量，并提供靠近第一散热器定位的第二散热器。 散热器热耦合并且彼此电隔离。 第一半导体器件被附接到第一散热器，与第一散热器进行热和电通信并与第二散热器电绝缘。 第二半导体器件与第二散热器热连接并与之电气连通，并与第一散热器电绝缘。
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公开(公告)号：US20090014866A1
公开(公告)日：2009-01-15
申请号：US12237276
申请日：2008-09-24
IPC分类号： H01L23/34
CPC分类号： H01L25/0655 , H01L21/50 , H01L23/13 , H01L23/36 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/15321 , H01L2924/181 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
摘要翻译： 一种用于制造多芯片组件封装的方法，包括：提供第一散热器，其定位成用于释放来自封装的热量，并提供靠近第一散热器定位的第二散热器。 散热器热耦合并且彼此电隔离。 第一半导体器件被附接到第一散热器，与第一散热器进行热和电通信并与第二散热器电绝缘。 第二半导体器件与第二散热器热连接并与之电气连通，并与第一散热器电绝缘。
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公开(公告)号：US06943057B1
公开(公告)日：2005-09-13
申请号：US10931654
申请日：2004-08-31
IPC分类号： H01L21/44
CPC分类号： H01L25/0655 , H01L21/50 , H01L23/13 , H01L23/36 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/15321 , H01L2924/181 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
摘要翻译： 一种用于制造多芯片组件封装的方法，包括：提供第一散热器，其定位成用于释放来自封装的热量，并提供靠近第一散热器定位的第二散热器。 散热器热耦合并且彼此电隔离。 第一半导体器件被附接到第一散热器，与第一散热器进行热和电通信并与第二散热器电绝缘。 第二半导体器件与第二散热器热连接并与之电气连通，并与第一散热器电绝缘。
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公开(公告)号：US20110248411A1
公开(公告)日：2011-10-13
申请号：US13166417
申请日：2011-06-22
IPC分类号： H01L23/48
CPC分类号： H01L25/105 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2225/107 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package in package system includes: a base integrated circuit package with a base lead substantially coplanar with a base die paddle and having a portion with a substantially planar base surface; an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface; a package-stacking layer over the base integrated circuit package; and the extended-lead integrated circuit package over the base integrated circuit package including: an end portion of the extended lead, directly on the package-stacking layer, and the extended lead exposed by and extending away from the bottom of the side of an extended-lead encapsulation and bending downwards toward the direction of the package stacking layer with the substantially planar lead-end surface coplanar with the substantially planar base surface.
摘要翻译： 封装系统中的集成电路封装包括：基本集成电路封装，其具有基本共面的基极引线，并且具有基本平坦的基底表面的部分; 具有延伸引线的延伸引线集成电路封装，其具有基本平坦的前端表面的部分; 基底集成电路封装上的封装堆叠层; 以及在基底集成电路封装上的延伸引线集成电路封装，包括：延伸引线的端部，直接在封装堆叠层上，以及延伸的引线，其从延伸的侧面的底部暴露并远离其底部 包装并朝向包装堆叠层的方向向下弯曲，其中基本上平面的前端表面与基本平坦的基面共面。
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公开(公告)号：US08164172B2
公开(公告)日：2012-04-24
申请号：US13166417
申请日：2011-06-22
IPC分类号： H01L23/02
CPC分类号： H01L25/105 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2225/107 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package in package system includes: a base integrated circuit package with a base lead substantially coplanar with a base die paddle and having a portion with a substantially planar base surface; an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface; a package-stacking layer over the base integrated circuit package; and the extended-lead integrated circuit package over the base integrated circuit package including: an end portion of the extended lead, directly on the package-stacking layer, and the extended lead exposed by and extending away from the bottom of the side of an extended-lead encapsulation and bending downwards toward the direction of the package stacking layer with the substantially planar lead-end surface coplanar with the substantially planar base surface.
摘要翻译： 封装系统中的集成电路封装包括：基本集成电路封装，其具有基本共面的基极引线，并且具有基本平坦的基底表面的部分; 具有延伸引线的延伸引线集成电路封装，其具有基本平坦的前端表面的部分; 基底集成电路封装上的封装堆叠层; 以及在基底集成电路封装上的延伸引线集成电路封装，包括：延伸引线的端部，直接在封装堆叠层上，以及延伸的引线，其从延伸的侧面的底部暴露并远离其底部 包装并朝向包装堆叠层的方向向下弯曲，其中基本上平面的前端表面与基本平坦的基面共面。
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公开(公告)号：US07981702B2
公开(公告)日：2011-07-19
申请号：US11276647
申请日：2006-03-08
CPC分类号： H01L25/105 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2225/107 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit package in package system including forming a base integrated circuit package with a base lead having a portion with a substantially planar base surface, forming an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface, and stacking the extended-lead integrated circuit package over the base integrated circuit package with the substantially planar lead-end surface coplanar with the substantially planar base surface.
摘要翻译： 一种封装系统中的集成电路封装，包括形成具有基部引线的基极集成电路封装，所述基极引线具有基本平坦的基面的部分，形成具有延伸引线的延伸引线集成电路封装，所述延伸引线具有基本平坦的引线端 表面，并且在基本集成电路封装上堆叠延伸引线集成电路封装，其中基本平坦的引出端表面与基本平坦的基面共面。
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公开(公告)号：US07619314B2
公开(公告)日：2009-11-17
申请号：US11869738
申请日：2007-10-09
申请人： Dario S. Filoteo, Jr. , Tsz Yin Ho
发明人： Dario S. Filoteo, Jr. , Tsz Yin Ho
CPC分类号： H01L23/49575 , H01L23/3135 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16 , H01L2224/16245 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes providing a leadframe, forming an aperture within the leadframe, mounting an integrated circuit package over or under the aperture, and mounting a die over the integrated circuit package with the die located within the aperture.
摘要翻译： 集成电路封装系统包括提供引线框架，在引线框架内形成孔，在孔上方或下方安装集成电路封装，以及将模具安装在集成电路封装之上，并且模具位于孔内。
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