公开(公告)号：US20230307313A1

公开(公告)日：2023-09-28

申请号：US17703400

申请日：2022-03-24

Applicant: Intel Corporation

Inventor： Carlton Hanna ,  Wolfgang Molzer ,  Stefan Reif ,  Georg Seidemann ,  Stephan Stoeckl ,  Pouya Talebbeydokhti

IPC: H01L23/373 ,  H01L23/367

CPC classification number: H01L23/3732 ,  H01L23/367

Abstract: A semiconductor package comprises a package substrate comprised of at least a first layer of dielectric material including a portion of diamond dust material. The diamond dust material is comprised of diamond dust particles. The semiconductor package includes at least one electrical connection coupled through layers of the package substrate.

公开(公告)号：US11233018B2

公开(公告)日：2022-01-25

申请号：US16788515

申请日：2020-02-12

Applicant: INTEL CORPORATION

Inventor： Sidharth Dalmia ,  Ana M. Yepes ,  Pouya Talebbeydokhti ,  Miroslav Baryakh ,  Omer Asaf

IPC: H01L23/34 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/552 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01Q21/06 ,  H01L25/065

Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.

公开(公告)号：US20230317705A1

公开(公告)日：2023-10-05

申请号：US17707366

申请日：2022-03-29

Applicant: Intel Corporation

Inventor： Carlton Hanna ,  Bernd Waidhas ,  Georg Seidemann ,  Stephan Stoeckl ,  Pouya Talebbeydokhti ,  Stefan Reif ,  Eduardo De Mesa ,  Abdallah Bacha ,  Mohan Prashanth Javare Gowda ,  Lizabeth Keser

IPC: H01L25/18 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H05K1/18

CPC classification number: H01L25/18 ,  H01L23/5384 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H05K1/181 ,  H01L2225/06572 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1094 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: An electronic system has a printed circuit board and a substrate. The substrate has two sides, a top and bottom. At least one memory unit is connected to the bottom side of the substrate and at least one processor is connected to the top side of the substrate. The memory is connected to the processor with interconnects that pass through the substrate.

公开(公告)号：US20230298953A1

公开(公告)日：2023-09-21

申请号：US17699139

申请日：2022-03-20

Applicant: Intel Corporation

Inventor： Pouya Talebbeydokhti ,  Mohan Prashanth Javare Gowda ,  Sonja Koller ,  Stephan Stoeckl ,  Thomas Wagner ,  Wolfgang Molzer

IPC: H01L23/053 ,  H01L23/00 ,  H01L25/10 ,  H01L23/06 ,  H01L23/10

CPC classification number: H01L23/053 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L23/06 ,  H01L23/10 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16237 ,  H01L2924/35121 ,  H01L2924/37001 ,  H01L2924/3511 ,  H01L2924/1611 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/16315 ,  H01L2924/1632

Abstract: Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a substrate; a lid surrounding an individual die, wherein the lid includes a planar portion and two or more sides extending from the planar portion, and wherein the individual die is electrically coupled to the substrate by interconnects; and a material surrounding the interconnects and coupling the two or more sides of the lid to the substrate.

公开(公告)号：US20230268291A1

公开(公告)日：2023-08-24

申请号：US17679189

申请日：2022-02-24

Applicant: Intel Corporation

Inventor： Mohan Prashanth Javare Gowda ,  Stephan Stoeckl ,  Sonja Koller ,  Wolfgang Molzer ,  Thomas Wagner ,  Pouya Talebbeydokhti

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/552

CPC classification number: H01L23/562 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/552

Abstract: Embodiments of a microelectronic assembly include a package substrate comprising: a first layer comprising a first plurality of mutually parallel channels of a first material; a second layer comprising columns of the first material; and a third layer comprising a second plurality of mutually parallel channels of the first material, the second plurality of mutually parallel channels being orthogonal to the first plurality of mutually parallel channels. The second layer is between the first layer and the third layer, at least some columns extend between and contact the first plurality of mutually parallel channels and the second plurality of mutually parallel channels, and at least a portion of the first layer, the second layer and the third layer comprises a second material different from the first material.

公开(公告)号：US20230268286A1

公开(公告)日：2023-08-24

申请号：US17679185

申请日：2022-02-24

Applicant: Intel Corporation

Inventor： Mohan Prashanth Javare Gowda ,  Stephan Stoeckl ,  Thomas Wagner ,  Sonja Koller ,  Wolfgang Molzer ,  Pouya Talebbeydokhti

IPC: H01L23/552 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L23/49822 ,  H01L23/49827

Abstract: Embodiments of a microelectronic assembly comprise a package substrate, including: a first layer comprising a first plurality of mutually parallel channels of a first material; a second layer comprising columns of the first material; and a third layer comprising a second plurality of mutually parallel channels of the first material. The second layer is between the first layer and the third layer, at least some columns extend between and contact the first plurality of mutually parallel channels and the second plurality of mutually parallel channels, and at least a portion of the first layer, the second layer, and the third layer comprises a second material different from the first material.

公开(公告)号：US10566298B2

公开(公告)日：2020-02-18

申请号：US16072262

申请日：2016-04-01

Applicant: INTEL CORPORATION

Inventor： Sidharth Dalmia ,  Ana M. Yepes ,  Pouya Talebbeydokhti ,  Miroslav Baryakh ,  Omer Asaf

IPC: H01L23/34 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/552 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01Q21/06

Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.