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公开(公告)号：US20140132450A1
公开(公告)日：2014-05-15
申请号：US14136898
申请日：2013-12-20
发明人： Ping-Yu Chen , Brian A. Floyd , Jie-Wei Lai , Arun S. Natarajan , Sean T. Nicolson , Scott K. Reynolds , Ming-Da Tsai , Alberto Valdes-Garcia , Jing-Hong C. Zhan
IPC分类号： H01Q3/26
CPC分类号： H01Q3/2694 , H01Q3/267
摘要： A phased-array receiver that may be effectively implemented on a silicon substrate. A receiver includes multiple radio frequency (RF) front-ends, each configured to receive a signal with a given delay relative to the others such that the gain of the received signal is highest in a given direction. The receiver also includes a power combination network configured to accept an RF signal from each of the RF front-ends and to pass a combined RF signal to a down-conversion element, where the power distribution network includes a combination of active and passive components. Each RF front-end includes a phase shifter configured to delay the signal in accordance with the given direction and a variable amplifier configured to adjust the gain of the signal.
摘要翻译： 可以有效地在硅衬底上实现的相控阵接收器。 接收机包括多个射频（RF）前端，每个被配置为接收相对于其它的给定延迟的信号，使得接收信号的增益在给定方向上最高。 接收机还包括配置成接收来自每个RF前端的RF信号并将组合的RF信号传递到下变频元件的功率组合网络，其中配电网络包括有源和无源组件的组合。 每个RF前端包括被配置为根据给定方向延迟信号的移相器和配置成调整信号增益的可变放大器。
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公开(公告)号：US09257746B2
公开(公告)日：2016-02-09
申请号：US14136898
申请日：2013-12-20
发明人： Ping-Yu Chen , Brian A. Floyd , Jie-Wei Lai , Arun S. Natarajan , Sean T. Nicolson , Scott K. Reynolds , Ming-Da Tsai , Alberto Valdes-Garcia , Jing-Hong C. Zhan
IPC分类号： H01Q3/26
CPC分类号： H01Q3/2694 , H01Q3/267
摘要： A phased-array receiver that may be effectively implemented on a silicon substrate. A receiver includes multiple radio frequency (RF) front-ends, each configured to receive a signal with a given delay relative to the others such that the gain of the received signal is highest in a given direction. The receiver also includes a power combination network configured to accept an RF signal from each of the RF front-ends and to pass a combined RF signal to a down-conversion element, where the power distribution network includes a combination of active and passive components. Each RF front-end includes a phase shifter configured to delay the signal in accordance with the given direction and a variable amplifier configured to adjust the gain of the signal.
摘要翻译： 可以有效地在硅衬底上实现的相控阵接收器。 接收机包括多个射频（RF）前端，每个被配置为接收相对于其它的给定延迟的信号，使得接收信号的增益在给定方向上最高。 接收机还包括配置成接收来自每个RF前端的RF信号并将组合的RF信号传递到下变频元件的功率组合网络，其中配电网络包括有源和无源组件的组合。 每个RF前端包括被配置为根据给定方向延迟信号的移相器和配置成调整信号增益的可变放大器。
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公开(公告)号：US09692106B2
公开(公告)日：2017-06-27
申请号：US14725845
申请日：2015-05-29
IPC分类号： H01Q1/22 , H01Q1/36 , H01L21/50 , H01L23/522 , H01L21/302 , H01L21/48 , H01L23/66
CPC分类号： H01Q15/142 , H01L21/302 , H01L21/486 , H01L21/50 , H01L23/5227 , H01L23/66 , H01L25/50 , H01L2223/6677 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/16225 , H01Q1/2283 , H01Q1/36 , H01Q1/38 , H01Q9/0407
摘要： Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.
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公开(公告)号：US09577600B2
公开(公告)日：2017-02-21
申请号：US13739599
申请日：2013-01-11
摘要： Methods and systems for phase shifting include a hybrid quadrature coupler having an input, an output, and two termination loads. Each termination load includes multiple terminations, each termination having a varactor; and one or more transmission lines separating the terminations. A control module is configured to determine a phase shift and gain to apply to the input and to independently control a capacitance of each varactor such that the output of the hybrid quadrature coupler is shifted by the determined phase shift relative to the input with the determined gain.
摘要翻译： 用于相移的方法和系统包括具有输入，输出和两个终端负载的混合正交耦合器。 每个终端负载包括多个终端，每个终端具有变容二极管; 以及分离终端的一条或多条传输线。 控制模块被配置为确定应用于输入的相移和增益，并且独立地控制每个变容二极管的电容，使得混合正交耦合器的输出相对于具有所确定的增益的输入相移所确定的相移 。
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公开(公告)号：US20150077192A1
公开(公告)日：2015-03-19
申请号：US14050452
申请日：2013-10-10
IPC分类号： H03B5/12
CPC分类号： H03B5/1206 , H03B5/1215 , H03B5/1228 , H03B5/124
摘要： There is provided an integrated electronic circuit. The integrated electronic circuit includes a voltage controlled oscillator and a frequency doubler connected to the voltage controlled oscillator. A frequency doubling input of the frequency doubler is load isolated from an output of the voltage controlled oscillator.
摘要翻译： 提供了集成的电子电路。 集成电子电路包括压控振荡器和连接到压控振荡器的倍频器。 倍频器的倍频输入与压控振荡器的输出隔离。
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6.发明授权公开(公告)号：US10168477B2
公开(公告)日：2019-01-01
申请号：US15354193
申请日：2016-11-17
发明人： Aydin Babakhani , Steven A. Cordes , Jean-Olivier Plouchart , Scott K. Reynolds , Peter J. Sorce , Robert E. Trzcinski
IPC分类号： H01L31/0232 , H01S5/183 , G02B6/13 , H01L31/18 , H01L27/144 , H01S5/022 , H01S5/02 , G02B6/42 , H01S5/10 , G02B6/12 , G02B6/124 , G02B6/30
摘要： According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.
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公开(公告)号：US09917659B2
公开(公告)日：2018-03-13
申请号：US15173034
申请日：2016-06-03
CPC分类号： H04B17/102 , H03F3/24 , H04B1/0475 , H04B1/48 , H04B2001/0408 , H04L25/0278
摘要： Transmit/receive switches and methods for radio control include connecting a first reactive impedance in parallel with a power amplifier on a transmit path during reception to neutralize a reactive impedance of the power amplifier and to prevent received signals from entering the transmit path. The first reactive impedance is disconnected during transmission.
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公开(公告)号：US20180069309A1
公开(公告)日：2018-03-08
申请号：US15596672
申请日：2017-05-16
发明人： Daniel J. Friedman , Joakim Hallin , Yahya Mesgarpour Tousi , Örjan Renström , Leonard Rexberg , Scott K. Reynolds , Bodhisatwa Sadhu , Stefan Sahl , Jan-Erik Thillberg , Alberto Valdes Garcia
摘要： A method and system of a configurable phased array transceiver are provided. A first beamforming unit is configured to provide a first beam. A second beamforming unit is configured to provide a second beam. A first bi-directional power controller is configured to combine or to split the first beam and the second beam. Each beamforming unit comprises a plurality of radio frequency (RF) front-ends, each front-end being configured to transmit and receive RF signals. Each beam is independently configurable to operate in a transmit (TX) or a receive (RX) mode.
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9.发明申请公开(公告)号：US20170192172A1
公开(公告)日：2017-07-06
申请号：US15466966
申请日：2017-03-23
发明人： Aydin Babakhani , Steven A. Cordes , Jean-Olivier Plouchart , Scott K. Reynolds , Peter J. Sorce , Robert E. Trzcinski
IPC分类号： G02B6/13 , G02B6/30 , G02B6/124 , G02B6/12 , H01L27/144
CPC分类号： G02B6/13 , G02B6/12004 , G02B6/124 , G02B6/30 , G02B6/42 , G02B2006/12121 , H01L27/1446 , H01L31/02327 , H01L31/18 , H01L2224/16225 , H01S5/021 , H01S5/02248 , H01S5/1071 , H01S5/183
摘要： According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.
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公开(公告)号：US09190951B2
公开(公告)日：2015-11-17
申请号：US14050452
申请日：2013-10-10
CPC分类号： H03B5/1206 , H03B5/1215 , H03B5/1228 , H03B5/124
摘要： There is provided an integrated electronic circuit. The integrated electronic circuit includes a voltage controlled oscillator and a frequency doubler connected to the voltage controlled oscillator. A frequency doubling input of the frequency doubler is load isolated from an output of the voltage controlled oscillator.
摘要翻译： 提供了集成的电子电路。 集成电子电路包括压控振荡器和连接到压控振荡器的倍频器。 倍频器的倍频输入与压控振荡器的输出隔离。
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