公开(公告)号：US10418260B2

公开(公告)日：2019-09-17

申请号：US15690211

申请日：2017-08-29

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Terry Pederson ,  William Eugene Runstadler, Jr.

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677 ,  H01L21/687 ,  H01L21/768 ,  H01L21/56

Abstract: A system for fan out chip encapsulation processing is provided, wherein a plurality of microchips are encapsulated in molding compound, the system comprising: an atmospheric loading camber, configured to load substrates onto carriers in atmospheric environment; an entry loadlock arrangement configured to introduce the carriers into vacuum environment of the system; a degas chamber positioned downstream of the loadlock arrangement within the vacuum environment, the degas chamber comprising a heating element and a pumping arrangement to remove gases emitted from the molding compound; an etch chamber positioned downstream of the degas chamber and within the vacuum environment, the etch chamber comprising an ion beam generator and an ion neutralizer; a metal sputtering chamber positioned downstream of the etch chamber and inside the vacuum environment; and, an exit loadlock arrangement configured to remove carriers from the vacuum environment.

公开(公告)号：US20180061689A1

公开(公告)日：2018-03-01

申请号：US15690211

申请日：2017-08-29

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Terry Pederson ,  William Eugene Runstadler, JR.

IPC: H01L21/67 ,  H01L21/56 ,  H01L21/673 ,  H01L21/687 ,  H01L21/768

CPC classification number: H01L21/67201 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67017 ,  H01L21/67121 ,  H01L21/67173 ,  H01L21/67207 ,  H01L21/67303 ,  H01L21/67754 ,  H01L21/6776 ,  H01L21/68721 ,  H01L21/768 ,  H01L2224/96 ,  H01L2924/3511

Abstract: A system for fan out chip encapsulation processing is provided, wherein a plurality of microchips are encapsulated in molding compound, the system comprising: an atmospheric loading camber, configured to load substrates onto carriers in atmospheric environment; an entry loadlock arrangement configured to introduce the carriers into vacuum environment of the system; a degas chamber positioned downstream of the loadlock arrangement within the vacuum environment, the degas chamber comprising a heating element and a pumping arrangement to remove gases emitted from the molding compound; an etch chamber positioned downstream of the degas chamber and within the vacuum environment, the etch chamber comprising an ion beam generator and an ion neutralizer; a metal sputtering chamber positioned downstream of the etch chamber and inside the vacuum environment; and, an exit loadlock arrangement configured to remove carriers from the vacuum environment.

公开(公告)号：US20170062258A1

公开(公告)日：2017-03-02

申请号：US15284241

申请日：2016-10-03

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Aaron Zanetto ,  William Eugene Runstadler, JR. ,  Terry Pederson

IPC: H01L21/68 ,  H01L21/677 ,  H01L21/683

Abstract: A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.

Abstract translation: 一种用于在真空处理室中处理晶片的系统。 载体包括具有多个开口的框架，每个开口被配置为容纳一个晶片。 一种配置成在整个系统中传送多个载体的传送机构。 配置用于支撑晶片的多个晶片板。 一种用于将多个晶片板附接到每个载体的附接机构，其中每个晶片板附接到相应载体的下侧处的对应位置，使得位于晶片载体之一上的每个晶片是 定位在载体中的多个开口中的一个内。 掩模附着在载体中的多个开口中的一个的前侧上。 对准台在载体的开口下面支撑晶片板。 定位成同时对掩模和晶片进行成像的照相机。

公开(公告)号：US20130115764A1

公开(公告)日：2013-05-09

申请号：US13672652

申请日：2012-11-08

Applicant: Intevac, Inc.

Inventor： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

IPC: H01L21/677 ,  H01L21/265

CPC classification number: H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

Abstract translation: 用于处理衬底的系统具有真空外壳和位于处理真空外壳内的处理区中的晶片的处理室。 提供两个轨道组件，一个在处理区域的每一侧。 两个卡盘阵列，每个在一个导轨组件上，使得每个卡盘阵列悬挂在一个导轨组件上并支撑多个卡盘。 轨道组件联接到升降机构，其将轨道放置在用于处理的上部位置，并且在较低位置处返回用于装载新晶片的卡盘组件。 拾取头组件将晶片从传送器装载到卡盘组件上。 拾取头具有从晶片的前侧拾取晶片的多个静电卡盘。 处理卡盘中的冷却通道用于产生气垫，以在由拾取头传送时帮助对准晶片。

公开(公告)号：US10679883B2

公开(公告)日：2020-06-09

申请号：US15284241

申请日：2016-10-03

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Aaron Zanetto ,  William Eugene Runstadler, Jr. ,  Terry Pederson

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/677 ,  H01L31/18 ,  C23C16/04 ,  H01L21/673 ,  C23C14/04 ,  C23C16/458 ,  C23C14/50

Abstract: A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.

公开(公告)号：US09875922B2

公开(公告)日：2018-01-23

申请号：US15099523

申请日：2016-04-14

Applicant: Intevac, Inc.

Inventor： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/265 ,  H01L21/68 ,  H01L31/18 ,  H02N13/00

CPC classification number: H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

公开(公告)号：US20160268110A1

公开(公告)日：2016-09-15

申请号：US15138154

申请日：2016-04-25

Applicant: INTEVAC, INC.

Inventor： David Ward Brown ,  Vinay Shah ,  Terry Pederson ,  Terry Bluck

IPC: H01J37/34 ,  C23C14/56 ,  H01J37/32 ,  C23C14/35

CPC classification number: H01J37/3455 ,  C23C14/35 ,  C23C14/56 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3452

Abstract: A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behinds the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone.

公开(公告)号：US20160233122A1

公开(公告)日：2016-08-11

申请号：US15099523

申请日：2016-04-14

Applicant: Intevac, Inc.

Inventor： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

IPC: H01L21/683 ,  H02N13/00

CPC classification number: H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

公开(公告)号：US09324598B2

公开(公告)日：2016-04-26

申请号：US13672652

申请日：2012-11-08

Applicant: INTEVAC, INC.

Inventor： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

IPC: H01L21/677 ,  H01L21/265 ,  H01L21/68 ,  H01L31/18 ,  H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

Abstract translation: 用于处理衬底的系统具有真空外壳和位于处理真空外壳内的处理区中的晶片的处理室。 提供两个轨道组件，一个在处理区域的每一侧。 两个卡盘阵列，每个在一个导轨组件上，使得每个卡盘阵列悬挂在一个导轨组件上并支撑多个卡盘。 轨道组件联接到升降机构，其将轨道放置在用于处理的上部位置，并且在较低位置处返回用于装载新晶片的卡盘组件。 拾取头组件将晶片从传送器装载到卡盘组件上。 拾取头具有从晶片的前侧拾取晶片的多个静电卡盘。 处理卡盘中的冷却通道用于产生气垫，以在由拾取头传送时帮助对准晶片。

公开(公告)号：US20130112546A1

公开(公告)日：2013-05-09

申请号：US13667976

申请日：2012-11-02

Applicant: INTEVAC, INC.

Inventor： David Ward Brown ,  Vinay Shah ,  Terry Pederson ,  Terry Bluck

IPC: C23C14/35

CPC classification number: H01J37/3455 ,  C23C14/35 ,  C23C14/56 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3452

Abstract: A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behinds the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone.

Abstract translation: 一种溅射系统，具有具有入口和出口的处理室和位于处理室的壁上的溅射靶。 可移动磁体布置位于溅射靶的后面并在靶后方往复滑动。 输送机以恒定速度连续输送基板通过溅射靶，使得在任何给定时间，几个基板在前缘和后缘之间面对目标。 可移动磁铁装置以比传送带的恒定速度快至少几倍的速度滑动。 旋转区域被限定在目标的前缘和后缘之后，其中磁体装置在进入旋转区域时减速，并且当其在转动区域内反转滑动方向时加速。