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    Interface device for thermally coupling an integrated circuit to a heat sink
    6.
    发明授权
    Interface device for thermally coupling an integrated circuit to a heat sink 失效
    将集成电路热耦合到热端口的接口装置

    公开(公告)号：US5151777A

    公开(公告)日：1992-09-29

    申请号：US422395

    申请日：1989-10-16

    申请人： Timur Akin ,  Bruce A. Myers ,  William M. Maki ,  Ponnusamy Palanisamy

    发明人： Timur Akin ,  Bruce A. Myers ,  William M. Maki ,  Ponnusamy Palanisamy

    IPC分类号： H05K7/20 ,  H01L23/373

    CPC分类号： H01L23/3735 ,  H01L2224/32225 ,  Y10T428/12486

    摘要： An interface device for thermally coupling an integrated circuit to a heat sink having a first material characterized by high thermal conductivity such as copper, where the copper completely surrounds a plurality of inner core regions. The plurality of inner core regions contain a low coefficient of thermal expansion material and are primarily disposed in the copper material in the region directly under the integrated circuit. The low expansion regions retard thermal expansion of the interface device during exposure to variations in the temperature, yet there are continuous paths of copper provided between the integrated circuit and heat sink to promote efficient heat transfer between the silicon chip to the heat sink through the high conductivity copper. In addition, high thermal resistance layers are provided for dielectric isolation between an integrated circuit chip and heat sink, when necessary, using this invention. This interface device is characterized by enhanced thermal dissipation yet provides a compatible coefficient of thermal expansion with the silicon integrated circuit and underlying heat sink.

    Controlled adhesion conductor
    8.
    发明授权
    Controlled adhesion conductor 失效
    受控粘合导体

    公开(公告)号：US5121298A

    公开(公告)日：1992-06-09

    申请号：US552046

    申请日：1990-07-13

    申请人： Dwadasi H. R. Sarma ,  Ponnusamy Palanisamy ,  John A. Hearn ,  Dwight L. Schwarz

    发明人： Dwadasi H. R. Sarma ,  Ponnusamy Palanisamy ,  John A. Hearn ,  Dwight L. Schwarz

    IPC分类号： H01B1/16 ,  H01B1/22 ,  H05K1/09

    CPC分类号： H05K1/092 ,  H01B1/16 ,  H01B1/22

    摘要： Compositions useful for printing controllable adhesion conductive patterns on a printed circuit board include finely divided copper powder, a screening agent and a binder. The binder is designed to provide controllable adhesion of the copper layer formed after sintering to the substrate so that the layer can lift off the substrate in response to thermal stress. Additionally, the binder serves to promote good cohesion between the copper particles to provide good mechanical strength to the copper layer so that it can tolerate lift off without fracture.

    摘要翻译： 用于在印刷电路板上印刷可控制粘合导电图案的组合物包括细碎的铜粉，筛选剂和粘合剂。 粘合剂被设计成提供在烧结之后形成的铜层对基材的可控的粘附性，使得该层可以响应于热应力而离开基底。 此外，粘合剂用于促进铜颗粒之间的良好的内聚力，以向铜层提供良好的机械强度，使得其能够耐受脱落而不会断裂。

    Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
    9.
    再颁专利
    Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board 有权
    在设备和电路板之间的大面积上的面积阵列电互连的低成本电路板材料和工艺

    公开(公告)号：USRE42542E1

    公开(公告)日：2011-07-12

    申请号：US11900009

    申请日：2007-09-06

    申请人： Ponnusamy Palanisamy

    发明人： Ponnusamy Palanisamy

    IPC分类号： H01L21/44

    CPC分类号： H01L27/3288 ,  G02F1/133382 ,  G02F1/13452 ,  H01L27/3293 ,  H01L51/524 ,  H01L51/529 ,  H01L2251/5338 ,  H05K1/0203 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/363 ,  Y10T29/49144 ,  Y10T29/49151 ,  Y10T29/49155

    摘要： An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.

    摘要翻译： 电子设备和耦合柔性电路板及其制造方法。 电子设备通过多个Z互连耦合到柔性电路板。 电子设备包括具有耦合到其上的电子部件的基板。 衬底还具有耦合到其背表面的多个器件电触点，其电耦合到电子部件。 柔性电路板包括具有前表面和后表面的柔性基板和耦合到柔性基板的前表面的多个电路板电触点。 多个电路板电触点对应于多个器件电触头。 每个Z-互连电气和机械耦合到一个设备电接触和相应的电路板电接触。