利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

129 条记录 (耗时 0.038 秒)

    Method of separating and collecting 18F in 18O water
    3.
    发明授权
    Method of separating and collecting 18F in 18O water 失效
    在18O水中分离收集18F的方法

    公开(公告)号：US06827838B2

    公开(公告)日：2004-12-07

    申请号：US10203488

    申请日：2002-08-09

    申请人： Toshio Hyodo ,  Yoshiko Itoh ,  Fuminori Saito ,  Yasuyuki Nagashima ,  Toshikazu Kurihara ,  Akira Goto ,  Masayuki Kase ,  Yasushige Yano ,  Katsumi Senoo

    发明人： Toshio Hyodo ,  Yoshiko Itoh ,  Fuminori Saito ,  Yasuyuki Nagashima ,  Toshikazu Kurihara ,  Akira Goto ,  Masayuki Kase ,  Yasushige Yano ,  Katsumi Senoo

    IPC分类号： C25C124

    CPC分类号： G21G1/001 ,  C01B5/02 ,  G21G2001/0015

    摘要： A method of separating and recovering 18F from 18O water at high purity and efficiency while maintaining the purity of the 18O water. By using a solid electrode (1) as an anode and a container (electrodeposition vessel) (2) made of platinum as a cathode, 18F in a solution (4) is electrodeposited on the solid electrode surface by applying a voltage. Then, by using the solid electrode (1) on which 18F is electrodeposited as a cathode and a container (recovery vessel) (5) holding pure water therein as an anode, 18F is recovered in the pure water by applying a voltage of opposite polarity to that of the electrodeposition. In this process, little 18O water is lost. The initial concentration of the 18O water is maintained even after the electrodeposition of 18F, so that the 18O water can be repeatedly used as an irradiation target for production of 18F.

    摘要翻译： 从18％O水中以高纯度和高效率分离和回收18 F的方法，同时保持18 W水的纯度。 通过使用固体电极（1）和由铂作为阴极的容器（电沉积容器）（2），将溶液（4）中的18 F通过施加电压电沉积在固体电极表面上。 然后，通过使用其中电沉积有18 F的固体电极（1）和作为阳极保持纯水的容器（回收容器）（5）），在纯水中回收18 F 施加与电沉积相反的极性电压。 在这个过程中，少量的18％的水会丢失。 即使在电沉积18 F之后，也保持了18 C的水的初始浓度，因此可以重复使用<18> O水作为生产18 F的照射目标。

    Resistance welding method
    4.
    发明授权
    Resistance welding method 有权

    公开(公告)号：US09676052B2

    公开(公告)日：2017-06-13

    申请号：US13375579

    申请日：2010-06-02

    申请人： Akira Goto ,  Yushi Aoki

    发明人： Akira Goto ,  Yushi Aoki

    IPC分类号： B23K11/00 ,  B23K11/31 ,  B23K11/11 ,  B23K11/36

    CPC分类号： B23K11/315 ,  B23K11/115 ,  B23K11/36

    摘要： A resistance welding method for welding a stack of three or more workpieces. The method includes the steps of holding a first welding tip in abutment against a first outermost workpiece, holding a second welding tip in abutment against a second outermost workpiece, and holding a pressing member in abutment against the first outermost workpiece. The method also includes the steps of gripping the stacked assembly with the first welding tip, the second welding tip, and the pressing member and passing an electric current between the first welding electrode and the second welding electrode.

    Package apparatus of power semiconductor device
    5.
    发明授权
    Package apparatus of power semiconductor device 有权
    功率半导体器件封装设备

    公开(公告)号：US08872313B2

    公开(公告)日：2014-10-28

    申请号：US13322336

    申请日：2009-05-26

    申请人： Takayuki Ushio ,  Yoshihisa Oguri ,  Akira Goto ,  Jyunya Kanazawa

    发明人： Takayuki Ushio ,  Yoshihisa Oguri ,  Akira Goto ,  Jyunya Kanazawa

    IPC分类号： B65D81/113 ,  B65D5/50 ,  B65D85/38

    CPC分类号： B65D5/5061 ,  B65D85/38

    摘要： A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals.

    摘要翻译： 封装装置用于封装包括形成的基板，模制在基板上的模具部件和从模具部件延伸到与基板相对的一侧预定长度的电极端子的功率半导体器件; 包括：保持单元，其具有插入槽并且用于保持功率半导体器件，插入槽各自为开口，功率半导体器件可以沿着与电极的延伸方向垂直的方向插入到其中，开口的边缘形成 与模具部件和基板接触; 以及容纳盒，其包含保持单元。 插入槽被提供到保持单元，使得插入的功率半导体器件的电极端子的延伸方向上的插入槽之间的间隔大于电极端子的延伸长度。

    LIQUID DISCHARGE HEAD
    8.
    发明申请
    LIQUID DISCHARGE HEAD 有权
    液体放电头

    公开(公告)号：US20120229554A1

    公开(公告)日：2012-09-13

    申请号：US13414064

    申请日：2012-03-07

    申请人： Akira Goto

    发明人： Akira Goto

    IPC分类号： B41J2/17

    CPC分类号： B41J2/162 ,  B41J2/14024 ,  B41J2/1433 ,  B41J2/1623

    摘要： A liquid discharge head includes a recording element substrate having a discharge-port surface having a discharge port discharging a liquid, side surfaces on sides of the discharge-port surface, and a back surface of the discharge-port surface having an opening of an ink supplying port supplying ink to the discharge port; a supporting member having a depression accommodating the recording element substrate, the depression including a supporting part disposed at a bottom surface of the depression and supporting the recording element substrate with an adhesive and an opening of an ink channel communicating with the ink supplying port; and an electric wiring substrate disposed on a surface of the supporting member having the depression and having an electric connecting part connecting with a side of the discharge-port surface of the recording element substrate.

    摘要翻译： 液体排出头包括具有排出口的排出口表面的记录元件基底，排出口排出液体，排出口表面侧面的侧表面和具有墨水开口的排出口表面的后表面 向排出口供给墨水供给口; 具有容纳所述记录元件基板的凹部的支撑部件，所述凹部包括设置在所述凹部的底面的支撑部，并且用粘合剂支撑所述记录元件基板，并且与所述供墨口连通的墨水通道的开口; 以及布置在具有所述凹部的所述支撑构件的表面上并具有与所述记录元件基板的所述排出口表面的一侧连接的电连接部的电布线基板。

    Resistance welding method and resistance welding apparatus
    9.
    发明授权
    Resistance welding method and resistance welding apparatus 有权
    电阻焊接方法和电阻焊接装置

    公开(公告)号：US08253056B2

    公开(公告)日：2012-08-28

    申请号：US12749771

    申请日：2010-03-30

    申请人： Akira Goto

    发明人： Akira Goto

    IPC分类号： B23K11/00

    CPC分类号： B23K11/115 ,  B23K11/0026 ,  B23K11/30

    摘要： A resistance welding apparatus includes a welding gun having a first electrode tip serving as a first welding electrode, a second electrode tip serving as a second welding electrode, and a current branching electrode. The current branching electrode has an annular shape and is disposed in surrounding relation to the first electrode tip. The first electrode tip and the current branching electrode abut against a thinnest workpiece disposed on an outermost side of a stacked assembly that is resistance-welded by the resistance welding apparatus, and have opposite polarities to each other. When an electric current is passed from the first electrode tip to the second electrode tip and through the stacked assembly, a branched electric current flows from the first electrode tip to the current branching electrode.

    摘要翻译： 电阻焊接装置包括具有作为第一焊接电极的第一电极端头，作为第二焊接电极的第二电极端子和电流分支电极的焊枪。 当前的分支电极具有环形形状并且围绕第一电极尖端设置。 第一电极端和电流分支电极抵靠设置在由电阻焊接装置进行电阻焊接的层叠组件的最外侧的最薄的工件，并且彼此具有相反的极性。 当电流从第一电极尖端通过第二电极尖端并通过堆叠组件时，分支电流从第一电极尖端流到电流分支电极。