PLATING BATH AND METHOD
    1.
    发明申请
    PLATING BATH AND METHOD 有权
    浴室和方法

    公开(公告)号:US20130206602A1

    公开(公告)日:2013-08-15

    申请号:US13370181

    申请日:2012-02-09

    IPC分类号: C25D3/56

    摘要: Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity.

    摘要翻译: 公开了具有某些氧化胺表面活性剂的锡 - 银合金电镀浴和使用这些浴电沉积含锡银层的方法。 这种电镀浴可用于提供具有减小的空隙形成和改进的管芯内均匀性的锡 - 银焊料沉积物。

    HIGHLY CRYSTALLINE ELECTRICALLY CONDUCTING ORGANIC MATERIALS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME
    6.
    发明申请
    HIGHLY CRYSTALLINE ELECTRICALLY CONDUCTING ORGANIC MATERIALS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME 审中-公开
    高结晶电导电有机材料及其制造方法及其制品

    公开(公告)号:US20150171331A1

    公开(公告)日:2015-06-18

    申请号:US14109032

    申请日:2013-12-17

    CPC分类号: H01L51/0036 H01L51/0558

    摘要: Disclosed herein is a composition comprising a regioregular oligothiophene, a regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene] and/or a benzothiophene; where the regioregular oligothiophene, the regioregular poly[2,5-bis(3-alkylthiophen-2-yl)thieno(3,2-b)thiophene] and the benzothiophene each have a number average molecular weight of less than or equal to 475 grams per mole; where the composition is melted and then annealed at a temperature between a melting point and a glass transition temperature of the composition; the composition having a charge mobility that is greater than a comparative composition that is either not annealed or annealed at the same temperature between the melting point and the glass transition temperature but without being subjected to prior melting.

    摘要翻译: 本文公开了一种组合物,其包含区域性低聚噻吩,区域规模聚[2,5-双(3-烷基噻吩-2-基)噻吩并(3,2-b)噻吩]和/或苯并噻吩; 其中区域性低聚噻吩,区域规模聚[2,5-双(3-烷基噻吩-2-基)噻吩并(3,2-b)噻吩]和苯并噻吩各自的数均分子量小于或等于475 克/摩尔 其中组合物熔融,然后在组合物的熔点和玻璃化转变温度之间的温度下退火; 所述组合物的电荷迁移率大于在熔点和玻璃化转变温度之间的相同温度下未进行退火或退火但不进行先前熔融的比较组合物。