公开(公告)号：US20210185830A1

公开(公告)日：2021-06-17

申请号：US17187262

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： MD Altaf HOSSAIN ,  Scott A. GILBERT

IPC: H05K3/34 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48 ,  B23K31/02

Abstract: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

公开(公告)号：US20190230795A1

公开(公告)日：2019-07-25

申请号：US16372268

申请日：2019-04-01

Applicant: Intel Corporation

Inventor： MD Altaf HOSSAIN ,  Scott A. GILBERT

IPC: H05K3/34 ,  H01L21/48 ,  H05K1/11 ,  B23K31/02 ,  H01L23/498

Abstract: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

公开(公告)号：US20160181145A1

公开(公告)日：2016-06-23

申请号：US15057013

申请日：2016-02-29

Applicant: Intel Corporation

Inventor： MD Altaf Hossain ,  Scott A. GILBERT

IPC: H01L21/768 ,  H01L49/02 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76802 ,  H01L21/7687 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/5222 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/16 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/16 ,  H01L28/40 ,  H01L28/60 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H04M1/0266 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/09472 ,  H05K2201/10015 ,  H05K2201/10378 ,  Y02P70/611 ,  H01L2924/00

Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.

Abstract translation: 公开了一种包括安装在封装衬底的空腔内的电容器的封装结构。 封装结构可以另外包括安装到封装衬底的管芯侧表面的管芯，并且封装衬底的相对的焊盘侧表面可以安装到印刷电路板（PCB）。 电容器可以安装在形成在封装衬底的裸片侧表面或封装衬底的焊盘侧表面中的空腔内。 在腔内安装电容可能会降低封装的外形尺寸。 模具可以安装在形成在封装衬底的裸片侧表面中的空腔内。 将封装连接到PCB的焊球可以安装在形成在封装基板和PCB中的一个或两者中的一个或多个空腔内。