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公开(公告)号：US20170152592A1
公开(公告)日：2017-06-01
申请号：US15432815
申请日：2017-02-14
Applicant: Intevac, Inc.
Inventor： David Fang Wei Chen , David Ward Brown , Charles Liu , Samuel D. Harkness, IV
CPC classification number: C23C14/0057 , C23C14/0605 , C23C14/3464 , C23C14/35 , C23C14/562 , H01J37/3426
Abstract: A physical vapor deposition (PVD) chamber for depositing a transparent and clear hydrogenated carbon, e.g., hydrogenated diamond-like carbon, film. A chamber body is configured for maintaining vacuum condition therein, the chamber body having an aperture on its sidewall. A plasma cage having an orifice is attached to the sidewall, such that the orifice overlaps the aperture. Two sputtering targets are situated on cathodes inside the plasma cage and are oriented opposite each other and configured to sustain plasma there-between and confined inside the plasma cage. The plasma inside the cage sputters material from the targets, which then passes through the orifice and aperture and lands on the substrate. The substrate is moved continuously in a pass-by fashion during the process.
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公开(公告)号：US20140102888A1
公开(公告)日：2014-04-17
申请号：US14046720
申请日：2013-10-04
Applicant: Intevac, Inc.
Inventor： Samuel D. Harkness, IV , Terry Bluck , Michael A. Russak , Quang N. Tran , David Ward Brown
IPC: C23C14/35
CPC classification number: C23C14/35 , C23C14/352 , H01J37/3405 , H01J37/3417 , H01J37/345
Abstract: A deposition system is provided, where conductive targets of similar composition are situated opposing each other. The system is aligned parallel with a substrate, which is located outside the resulting plasma that is largely confined between the two cathodes. A “plasma cage” is formed wherein the carbon atoms collide with accelerating electrons and get highly ionized. The electrons are trapped inside the plasma cage, while the ionized carbon atoms are deposited on the surface of the substrate. Since the electrons are confined to the plasma cage, no substrate damage or heating occurs. Additionally, argon atoms, which are used to ignite and sustain the plasma and to sputter carbon atoms from the target, do not reach the substrate, so as to avoid damaging the substrate.
Abstract translation: 提供了一种沉积系统，其中具有相似组成的导电靶位于彼此相对的位置。 该系统与衬底平行排列，衬底位于所得到的等离子体的外部，其主要被限制在两个阴极之间。 形成“等离子体笼”，其中碳原子与加速电子碰撞并被高度电离。 电子被捕获在等离子体笼内，而电离的碳原子沉积在衬底的表面上。 由于电子被限制在等离子体笼中，所以不会发生衬底损坏或加热。 另外，用于点燃和维持等离子体并从靶溅射碳原子的氩原子不会到达衬底，以避免损坏衬底。
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3.发明申请METHOD TO PRODUCE HIGHLY TRANSPARENT HYDROGENATED CARBON PROTECTIVE COATING FOR TRANSPARENT SUBSTRATES 有权生产用于透明基板的高透明加氢碳保护涂层的方法公开(公告)号：US20140008214A1
公开(公告)日：2014-01-09
申请号：US13935993
申请日：2013-07-05
Applicant: Intevac, Inc.
Inventor： David Fang Wei Chen , David Ward Brown , Charles Liu , Samuel D. Harkness, IV
IPC: C23C14/34
CPC classification number: C23C14/0057 , C23C14/0605 , C23C14/3464 , C23C14/35 , C23C14/562 , H01J37/3426
Abstract: A physical vapor deposition (PVD) chamber for depositing a transparent and clear hydrogenated carbon, e.g., hydrogenated diamond-like carbon, film. A chamber body is configured for maintaining vacuum condition therein, the chamber body having an aperture on its sidewall. A plasma cage having an orifice is attached to the sidewall, such that the orifice overlaps the aperture. Two sputtering targets are situated on cathodes inside the plasma cage and are oriented opposite each other and configured to sustain plasma there-between and confined inside the plasma cage. The plasma inside the cage sputters material from the targets, which then passes through the orifice and aperture and lands on the substrate. The substrate is moved continuously in a pass-by fashion during the process.
Abstract translation: 用于沉积透明且透明的氢化碳（例如氢化金刚石样碳）的物理气相沉积（PVD）室。 室主体被构造成用于在其中维持真空条件，腔体在其侧壁上具有孔。 具有孔口的等离子体保持架附接到侧壁，使得孔口与孔口重叠。 两个溅射靶位于等离子体笼内部的阴极上，并且彼此相对定向，并且被配置为在等离子体笼内保持等离子体并限制在其间。 笼内的等离子体从靶中溅出材料，然后其通过孔口和孔径并落在基底上。 在处理过程中，基板以传递方式连续移动。
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公开(公告)号：US09896758B2
公开(公告)日：2018-02-20
申请号：US15432815
申请日：2017-02-14
Applicant: Intevac, Inc.
Inventor： David Fang Wei Chen , David Ward Brown , Charles Liu , Samuel D. Harkness, IV
CPC classification number: C23C14/0057 , C23C14/0605 , C23C14/3464 , C23C14/35 , C23C14/562 , H01J37/3426
Abstract: A physical vapor deposition (PVD) chamber for depositing a transparent and clear hydrogenated carbon, e.g., hydrogenated diamond-like carbon, film. A chamber body is configured for maintaining vacuum condition therein, the chamber body having an aperture on its sidewall. A plasma cage having an orifice is attached to the sidewall, such that the orifice overlaps the aperture. Two sputtering targets are situated on cathodes inside the plasma cage and are oriented opposite each other and configured to sustain plasma there-between and confined inside the plasma cage. The plasma inside the cage sputters material from the targets, which then passes through the orifice and aperture and lands on the substrate. The substrate is moved continuously in a pass-by fashion during the process.
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公开(公告)号：US09605340B2
公开(公告)日：2017-03-28
申请号：US13935993
申请日：2013-07-05
Applicant: Intevac, Inc.
Inventor： David Fang Wei Chen , David Ward Brown , Charles Liu , Samuel D. Harkness, IV
CPC classification number: C23C14/0057 , C23C14/0605 , C23C14/3464 , C23C14/35 , C23C14/562 , H01J37/3426
Abstract: A physical vapor deposition (PVD) chamber for depositing a transparent and clear hydrogenated carbon, e.g., hydrogenated diamond-like carbon, film. A chamber body is configured for maintaining vacuum condition therein, the chamber body having an aperture on its sidewall. A plasma cage having an orifice is attached to the sidewall, such that the orifice overlaps the aperture. Two sputtering targets are situated on cathodes inside the plasma cage and are oriented opposite each other and configured to sustain plasma there-between and confined inside the plasma cage. The plasma inside the cage sputters material from the targets, which then passes through the orifice and aperture and lands on the substrate. The substrate is moved continuously in a pass-by fashion during the process.
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Patent Agency Ranking
公开(公告)号：US20160268110A1
公开(公告)日：2016-09-15
申请号：US15138154
申请日：2016-04-25
Applicant: INTEVAC, INC.
Inventor： David Ward Brown , Vinay Shah , Terry Pederson , Terry Bluck
CPC classification number: H01J37/3455 , C23C14/35 , C23C14/56 , H01J37/32779 , H01J37/32899 , H01J37/3405 , H01J37/3417 , H01J37/3452
Abstract: A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behinds the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone.
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7.发明申请COATING FOR GLASS WITH IMPROVED SCRATCH/WEAR RESISTANCE AND OLEOPHOBIC PROPERTIES 审中-公开用于玻璃的涂层，具有改进的切割/耐磨性和耐油性公开(公告)号：US20160023941A1
公开(公告)日：2016-01-28
申请号：US14805418
申请日：2015-07-21
Applicant: Intevac, Inc.
Inventor： David Ward Brown , Charles Liu , Jun Xie
CPC classification number: B08B17/065 , C03C17/42 , C03C23/006 , C03C2217/734 , C03C2217/76 , C03C2217/78 , C03C2218/31 , C23C14/0036 , C23C14/024 , C23C14/34
Abstract: A protective coating on a front surface of a glass, by forming a diamond-like coating over the front surface of the glass; performing passive sputtering to form a protective layer directly on the diamond-like coating; performing reactive sputtering to form an adhesion layer directly on the protective layer; forming an anti-finger print layer directly over the adhesion layer.
Abstract translation: 通过在玻璃的前表面上形成类似金刚石的涂层，在玻璃前表面上形成保护涂层; 进行钝化溅射，直接在金刚石状涂层上形成保护层; 进行反应溅射，直接在保护层上形成粘附层; 在粘合层上直接形成防指纹层。
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公开(公告)号：US20150235824A1
公开(公告)日：2015-08-20
申请号：US14290917
申请日：2014-05-29
Applicant: Intevac, Inc.
Inventor： David Ward Brown , Terry Bluck
IPC: H01J37/34
CPC classification number: H01J37/3455 , C23C14/35 , C23C14/56 , G11B5/851 , H01F41/183 , H01J37/3405 , H01J37/3408 , H01J37/3417 , H01J37/3426 , H01J37/3435 , H01J37/3452 , H01J37/347
Abstract: A system for depositing material from a target onto substrates, comprising a processing chamber; a sputtering target having length L and having highly magnetic sputtering material provided on front surface thereof a magnet assembly operable to reciprocally scan across the length L in close proximity to rear surface of the target and the magnet assembly comprises: a back plate made of magnetic material; a first group of magnets arranged in a single line central to the back plate and having a first pole positioned to face the rear surface of the target; and, a second group of magnets provided around periphery of the back plate so as to surround the first group of magnets, the second group of magnets having a second pole, opposite the first pole, positioned to face the rear surface of the target.
Abstract translation: 一种用于将材料从靶材沉积到基材上的系统，包括处理室; 具有长度为L并且具有高磁性溅射材料的溅射靶，其前表面设置有磁体组件，该磁体组件可操作以在紧邻靶的后表面和磁体组件之间的长度L上往复扫描，包括：由磁性材料制成的背板 ; 第一组磁体，其布置在与所述背板中心的单线中，并且具有定位成面对所述目标的后表面的第一极; 以及围绕所述第一组磁体设置在所述背板的周围的第二组磁体，所述第二组磁体具有与所述第一极相对的第二极，所述第二极定位成面对所述靶的后表面。
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公开(公告)号：US20160133445A9
公开(公告)日：2016-05-12
申请号：US14290917
申请日：2014-05-29
Applicant: Intevac, Inc.
Inventor： David Ward Brown , Terry Bluck
IPC: H01J37/34
CPC classification number: H01J37/3455 , C23C14/35 , C23C14/56 , G11B5/851 , H01F41/183 , H01J37/3405 , H01J37/3408 , H01J37/3417 , H01J37/3426 , H01J37/3435 , H01J37/3452 , H01J37/347
Abstract: A system for depositing material from a target onto substrates, comprising a processing chamber; a sputtering target having length L and having highly magnetic sputtering material provided on front surface thereof a magnet assembly operable to reciprocally scan across the length L in close proximity to rear surface of the target and the magnet assembly comprises: a back plate made of magnetic material; a first group of magnets arranged in a single line central to the back plate and having a first pole positioned to face the rear surface of the target; and, a second group of magnets provided around periphery of the back plate so as to surround the first group of magnets, the second group of magnets having a second pole, opposite the first pole, positioned to face the rear surface of the target.
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公开(公告)号：US20130112546A1
公开(公告)日：2013-05-09
申请号：US13667976
申请日：2012-11-02
Applicant: INTEVAC, INC.
Inventor： David Ward Brown , Vinay Shah , Terry Pederson , Terry Bluck
IPC: C23C14/35
CPC classification number: H01J37/3455 , C23C14/35 , C23C14/56 , H01J37/32779 , H01J37/32899 , H01J37/3405 , H01J37/3417 , H01J37/3452
Abstract: A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behinds the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone.
Abstract translation: 一种溅射系统，具有具有入口和出口的处理室和位于处理室的壁上的溅射靶。 可移动磁体布置位于溅射靶的后面并在靶后方往复滑动。 输送机以恒定速度连续输送基板通过溅射靶，使得在任何给定时间，几个基板在前缘和后缘之间面对目标。 可移动磁铁装置以比传送带的恒定速度快至少几倍的速度滑动。 旋转区域被限定在目标的前缘和后缘之后，其中磁体装置在进入旋转区域时减速，并且当其在转动区域内反转滑动方向时加速。
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