公开(公告)号：US06572755B2

公开(公告)日：2003-06-03

申请号：US09832657

申请日：2001-04-11

申请人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

发明人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

IPC分类号： C25B900

CPC分类号： C25D17/001 ,  B23H5/08 ,  C25D5/06 ,  C25D5/22 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/6723

摘要： An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.

公开(公告)号：US20060081460A1

公开(公告)日：2006-04-20

申请号：US11164270

申请日：2005-11-16

申请人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

发明人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

IPC分类号： C25D17/00 ,  C25B9/00

CPC分类号： B24B37/20 ,  B23H5/08 ,  B24B37/12 ,  C25F3/02 ,  C25F7/00 ,  H01L21/32125 ,  H01L21/7684

摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

摘要翻译： 用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。 压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。 至少一个电导体位于压板内。 电导体具有连接到电源的第一端。 工件载体构造成承载工件并将工件压靠在抛光垫上。 电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

公开(公告)号：US20110216451A1

公开(公告)日：2011-09-08

申请号：US12719397

申请日：2010-03-08

申请人： Joshua P. Haines ,  Kent R. Morgan ,  Brian Mueller

发明人： Joshua P. Haines ,  Kent R. Morgan ,  Brian Mueller

IPC分类号： H02H3/00 ,  H02H3/08

CPC分类号： B60L3/0069 ,  B60L11/1818 ,  H02H3/338 ,  Y02T10/7005 ,  Y02T10/7072 ,  Y02T90/14

摘要： The present invention is directed to a protective device configured to be disposed in an electrical distribution system between a source of electrical power and an electrical load. The electrical distribution system includes at least one line hot conductor, a line neutral conductor, and a line ground conductor. The line neutral conductor is connected to the line ground conductor at a termination point in the electrical distribution system. The electrical load includes at least one load hot conductor, a load neutral conductor, and a load ground conductor, the device comprises a conditioning circuit configured to monitor a differential current flowing through the plurality of line termination elements and configured to generate a conditioning signal in response thereto. The conditioning signal propagates in a path formed by the line neutral conductor and the line ground conductor to thereby reduce a differential current propagating in the at least one line hot conductor and the line neutral conductor. The conditioning circuit also is configured to neutralize a substantial portion of a current associated with a non-fault related electrical perturbation.

摘要翻译： 本发明涉及一种被配置为设置在电力源和电负载之间的配电系统中的保护装置。 配电系统包括至少一个线路热导体，线路中性导体和线路接地导体。 线路中性导体在配电系统的终端处连接到线路接地导体。 电负载包括至少一个负载热导体，负载中性导体和负载接地导体，该装置包括调节电路，其被配置为监测流过多个线路端接元件的差分电流，并且被配置为产生调节信号 回应。 调节信号在由线路中性导体和线路接地导体形成的路径中传播，从而减少在至少一条热导体和线中性导体中传播的差分电流。 调理电路还被配置为中和与非故障相关的电扰动相关联的电流的实质部分。

公开(公告)号：US20070281483A1

公开(公告)日：2007-12-06

申请号：US11446936

申请日：2006-06-05

申请人： Brian Mueller

发明人： Brian Mueller

IPC分类号： H01L21/461

CPC分类号： H01L21/31053 ,  C09G1/02

摘要： The present invention provides a method of manufacturing a composition for polishing silica and silicon nitride on a semiconductor substrate. The method comprises ion-exchanging carboxylic acid polymer to reduce ammonia and combining by weight percent 0.01 to 5 of the ion-exchanged carboxylic acid polymer with 0.001 to 1 quaternary ammonium compound, 0.001 to 1 phthalic acid and salts thereof, 0.01 to 5 abrasive, and balance water.

摘要翻译： 本发明提供一种在半导体衬底上制备用于研磨二氧化硅和氮化硅的组合物的方法。 该方法包括离子交换羧酸聚合物以还原氨，并将0.01至5重量百分数的离子交换的羧酸聚合物与0.001至1个季铵化合物，0.001至1邻苯二甲酸及其盐，0.01至5个研磨剂， 并平衡水分。

公开(公告)号：US20070045234A1

公开(公告)日：2007-03-01

申请号：US11591382

申请日：2006-11-01

申请人： Sarah Lane ,  Brian Mueller ,  Charles Yu

发明人： Sarah Lane ,  Brian Mueller ,  Charles Yu

IPC分类号： C03C15/00 ,  B44C1/22 ,  C23F1/00

CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/30625

摘要： The present invention provides an aqueous composition useful for polishing silica and silicon nitride on a semiconductor wafer comprising by weight percent 0.01 to 5 carboxylic acid polymer, 0.02 to 6 abrasive, 0.01 to 10 polyvinylpyrrolidone, 0 to 5 cationic compound, 0 to 5 zwitterionic compound and balance water, wherein the polyvinylpyrrolidone has a average molecular weight between 100 grams/mole to 1,000,000 grams/mole.

摘要翻译： 本发明提供了一种用于在半导体晶片上研磨二氧化硅和氮化硅的水性组合物，其包含重量百分数为0.01至5的羧酸聚合物，0.02至6种研磨剂，0.01至10种聚乙烯吡咯烷酮，0至5种阳离子化合物，0至5种两性离子化合物 和平衡水，其中所述聚乙烯吡咯烷酮的平均分子量为100克/摩尔至1,000,000克/摩尔。

公开(公告)号：US20050189322A1

公开(公告)日：2005-09-01

申请号：US10788654

申请日：2004-02-27

申请人： Sarah Lane ,  Brian Mueller ,  Charles Yu

发明人： Sarah Lane ,  Brian Mueller ,  Charles Yu

IPC分类号： B24B37/00 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/762 ,  B24D3/02 ,  B44C1/22 ,  C09K13/00 ,  H01L21/76

CPC分类号： C09K3/1409 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053 ,  H01L21/76229

摘要： The present invention provides an aqueous composition useful for polishing silica and silicon nitride on a semiconductor wafer comprising by weight percent 0.01 to 5 zwitterionic compound, 0.01 to 5 carboxylic acid polymer, 0.02 to 6 abrasive, 0 to 5 cationic compound and balance water, wherein the zwitterionic compound has the following structure: in which n is an integer, Y comprises hydrogen or an alkyl group, Z comprises carboxyl, sulfate or oxygen, M comprises nitrogen, phosphorus or a sulfur atom, and X1, X2 and X3 independently comprise substituents selected from the group comprising, hydrogen, an alkyl group and an aryl group.

摘要翻译： 本发明提供了一种用于在半导体晶片上抛光二氧化硅和氮化硅的水性组合物，其包含重量百分比为0.01至5种两性离子化合物，0.01至5种羧酸聚合物，0.02至6种研磨剂，0至5种阳离子化合物和余量的水，其中 两性离子化合物具有以下结构：其中n为整数，Y为氢或烷基，Z为羧基，硫酸根或氧，M为氮，磷或硫原子，X为1 >，X 2和X 3独立地包含选自氢，烷基和芳基的取代基。

公开(公告)号：US06687889B1

公开(公告)日：2004-02-03

申请号：US10215125

申请日：2002-08-08

申请人： Stacey Secatch ,  James Hansen ,  Brian Mueller

发明人： Stacey Secatch ,  James Hansen ,  Brian Mueller

IPC分类号： G06F1750

CPC分类号： G06F17/5031

摘要： A method for accurately analyzing the timing of a clock network on a piecemeal basis in an integrated circuit clock tree is presented. In accordance with the invention, the time delay of each individual subcircuit between an identified clock network node and an identified receiving endpoint may be individually determined. Tags are associated with the connection points of a child block and its parent block. A connection tool uses the tags to match up the connection points of the parent block to the respective connection points in the child block to allow a simulation tool to include the clock signal timing data of the child block in simulating the clock performance of the parent block.

摘要翻译： 提出了一种在集成电路时钟树中准确分析时钟网络定时的方法。 根据本发明，可以单独地确定所识别的时钟网络节点和所识别的接收端点之间的每个单独子电路的时间延迟。 标签与子块及其父块的连接点相关联。 连接工具使用标签将父块的连接点与子块中的相应连接点相匹配，以允许仿真工具在模拟母块的时钟性能时包括子块的时钟信号定时数据 。

公开(公告)号：US08405939B2

公开(公告)日：2013-03-26

申请号：US12719416

申请日：2010-03-08

申请人： Joshua P. Haines ,  Kent R. Morgan ,  Brian Mueller

发明人： Joshua P. Haines ,  Kent R. Morgan ,  Brian Mueller

IPC分类号： H02H9/08

CPC分类号： H02H9/00 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549

摘要： The present invention is directed to an electrical device configured to be disposed in an electrical distribution system between a source of electrical power and an electrical load. The electrical distribution system includes at least one line hot conductor, a line neutral conductor, and a line ground conductor. The line neutral conductor is connected to the line ground conductor at a termination point in the electrical distribution system. The electrical load includes at least one load hot conductor, a load neutral conductor, and a load ground conductor. The device includes a grounding confirmation circuit that includes at least one signal generator that directs at least one test signal into a current path that includes at least the line ground conductor. The grounding confirmation circuit is configured to determine a ground continuity status of the current path based on at least one ground continuity measurement. The circuit interrupter is prevented from entering the reset state if the at least one ground continuity measurement does not meet a predefined quality threshold. The at least one ground continuity measurement being a function of the at least one electrical load parameter after the circuit interrupter is in the reset state.

摘要翻译： 本发明涉及一种电气设备，其被配置为设置在电力源和电负载之间的配电系统中。 配电系统包括至少一个线路热导体，线路中性导体和线路接地导体。 线路中性导体在配电系统的终端处连接到线路接地导体。 电负载包括至少一个负载热导体，负载中性导体和负载接地导体。 该装置包括接地确认电路，其包括至少一个信号发生器，其将至少一个测试信号引导到包括至少线路接地导体的电流路径。 接地确认电路被配置为基于至少一个接地连续性测量来确定当前路径的接地连续性状态。 如果至少一个接地连续性测量不满足预定义的质量阈值，则电路断路器被阻止进入复位状态。 在电路断续器处于复位状态之后，至少一个接地连续性测量是至少一个电气负载参数的函数。

公开(公告)号：US20110216453A1

公开(公告)日：2011-09-08

申请号：US12719416

申请日：2010-03-08

申请人： Joshua P. Haines ,  Kent R. Morgan ,  Brian Mueller

发明人： Joshua P. Haines ,  Kent R. Morgan ,  Brian Mueller

IPC分类号： H02H9/00

CPC分类号： H02H9/00 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549

摘要： The present invention is directed to an electrical device configured to be disposed in an electrical distribution system between a source of electrical power and an electrical load. The electrical distribution system includes at least one line hot conductor, a line neutral conductor, and a line ground conductor. The line neutral conductor is connected to the line ground conductor at a termination point in the electrical distribution system. The electrical load includes at least one load hot conductor, a load neutral conductor, and a load ground conductor. The device includes a grounding confirmation circuit that includes at least one signal generator that directs at least one test signal into a current path that includes at least the line ground conductor. The grounding confirmation circuit is configured to determine a ground continuity status of the current path based on at least one ground continuity measurement. The circuit interrupter is prevented from entering the reset state if the at least one ground continuity measurement does not meet a predefined quality threshold. The at least one ground continuity measurement being a function of the at least one electrical load parameter after the circuit interrupter is in the reset state.

摘要翻译： 本发明涉及一种电气设备，其被配置为设置在电力源和电负载之间的配电系统中。 配电系统包括至少一个线路热导体，线路中性导体和线路接地导体。 线路中性导体在配电系统的终端处连接到线路接地导体。 电负载包括至少一个负载热导体，负载中性导体和负载接地导体。 该装置包括接地确认电路，其包括至少一个信号发生器，其将至少一个测试信号引导到包括至少线路接地导体的电流路径。 接地确认电路被配置为基于至少一个接地连续性测量来确定当前路径的接地连续性状态。 如果至少一个接地连续性测量不满足预定义的质量阈值，则电路断路器被阻止进入复位状态。 在电路断续器处于复位状态之后，至少一个接地连续性测量是至少一个电气负载参数的函数。

公开(公告)号：US20050211952A1

公开(公告)日：2005-09-29

申请号：US10811622

申请日：2004-03-29

申请人： Timothy Mace ,  Brian Mueller ,  Charles Yu

发明人： Timothy Mace ,  Brian Mueller ,  Charles Yu

IPC分类号： B24B37/00 ,  B44C1/22 ,  C09G1/02 ,  C09K13/00 ,  C23F1/00 ,  C23F3/06 ,  H01L21/304 ,  H01L21/321

CPC分类号： C09G1/02 ,  C23F3/06 ,  H01L21/3212

摘要： The present invention provides an acidic aqueous composition useful for polishing tungsten and titanium on a semiconductor wafer comprising by weight percent 0.5 to 10 abrasive, 0.5 to 9 oxidizer, 0.1 to 5 complexing agent, 0.1 to 5 chelating agent and balance water, wherein the abrasive is fumed silica that has a surface area of greater than 90 m2/g and has only been exposed to an acidic pH.

摘要翻译： 本发明提供了一种用于在半导体晶片上抛光钨和钛的酸性水性组合物，其包含重量百分比为0.5至10份磨料，0.5至9种氧化剂，0.1至5种络合剂，0.1至5种螯合剂和余量的水， 是具有大于90m 2 / g的表面积且仅暴露于酸性pH的气相二氧化硅。