公开(公告)号：US20100270065A1

公开(公告)日：2010-10-28

申请号：US12507627

申请日：2009-07-22

申请人： Jae Choon Cho ,  Jun Rok Oh ,  Moon Soo Park ,  Sung Taek Lim ,  Hwa Young Lee

发明人： Jae Choon Cho ,  Jun Rok Oh ,  Moon Soo Park ,  Sung Taek Lim ,  Hwa Young Lee

IPC分类号： H05K1/03 ,  C08L63/00

CPC分类号： H05K1/0373 ,  C08G59/304 ,  C08L63/00 ,  C08L83/04 ,  H05K2201/0133 ,  H05K2201/0212 ,  C08L2666/14

摘要： Disclosed is a resin composition for a printed circuit board, which includes a complex epoxy resin including a bisphenol A epoxy resin obtained by dispersing silicone elastomer particles having a core-shell structure in a diglycidyl ether of bisphenol A epoxy resin, a cresol novolac epoxy resin, and a phosphorus-based epoxy resin; a bisphenol A curing agent; a curing accelerator; and an inorganic filler. A printed circuit board using the resin composition is also provided.

摘要翻译： 公开了一种用于印刷电路板的树脂组合物，其包括复合环氧树脂，其包括通过将双酚A环氧树脂的二缩水甘油醚中分散有具有核 - 壳结构的有机硅弹性体颗粒，甲酚酚醛环氧树脂 和磷系环氧树脂; 双酚A固化剂; 固化促进剂; 和无机填料。 还提供了使用该树脂组合物的印刷电路板。

公开(公告)号：US20100270064A1

公开(公告)日：2010-10-28

申请号：US12501919

申请日：2009-07-13

申请人： Jae Choon Cho ,  Jun Rok Oh ,  Moon Soo Park ,  Sung Taek Lim ,  Hwa Young Lee

发明人： Jae Choon Cho ,  Jun Rok Oh ,  Moon Soo Park ,  Sung Taek Lim ,  Hwa Young Lee

IPC分类号： H05K1/03 ,  E04B1/80

CPC分类号： C08G59/304 ,  C08L63/00 ,  H05K3/4676 ,  H05K2201/0209 ,  C08L2666/22

摘要： Disclosed is a resin composition for a printed circuit board, composed of a complex epoxy resin including 41˜80 wt % of a naphthalene-modified epoxy resin having an average epoxy resin equivalent of 100˜200 and 20˜59 wt % of a phosphorus-based epoxy resin having an average epoxy resin equivalent of 400˜800, a bisphenol A curing agent used in an equivalent ratio of 0.3˜1.5 with respect to a total epoxy group equivalent of the complex epoxy resin, a curing accelerator used in an amount of 0.1˜1 part by weight based on 100 parts by weight of the complex epoxy resin and an inorganic filler used in an amount of 10˜40 parts by weight based on 100 parts by weight of the complex epoxy resin. A printed circuit board using the resin composition is also provided.

摘要翻译： 公开了一种用于印刷电路板的树脂组合物，其包含复合环氧树脂，其包含41〜80重量％的平均环氧树脂当量为100〜200的萘改性环氧树脂和20〜59重量％ 平均环氧树脂当量为400〜800的双酚A型环氧树脂，相对于复合环氧树脂的总环氧当量比为0.3〜1.5当量比的双酚A固化剂，使用量为 相对于100重量份的复合环氧树脂，相对于100重量份的复合环氧树脂为0.1〜1重量份，使用量为10〜40重量份的无机填料。 还提供了使用该树脂组合物的印刷电路板。

公开(公告)号：US07618553B2

公开(公告)日：2009-11-17

申请号：US11902487

申请日：2007-09-21

申请人： Jin Cheol Kim ,  Jun Rok Oh ,  Tae Kyoung Kim ,  Sang Jun Yoon ,  Hwa Young Lee

发明人： Jin Cheol Kim ,  Jun Rok Oh ,  Tae Kyoung Kim ,  Sang Jun Yoon ,  Hwa Young Lee

IPC分类号： B32B5/16 ,  B32B27/06 ,  B32B27/36 ,  C09K19/52

CPC分类号： H05K1/0373 ,  H05K2201/0141 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/31786

摘要： Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from −300 to +300 ppm/° C. in the temperature range of −55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.

摘要翻译： 公开了一种用于印刷电路板的绝缘材料，其包括液晶聚酯树脂和陶瓷粉末，因此在-55〜125℃的温度范围内具有-300〜+ 300ppm /℃的电容温度系数 C.和介电常数范围为5至40.该绝缘材料具有优良的介电性能，并且根据温度变化的介电常数变化很小，因此在应用于高频电路时表现出高的可靠性。

公开(公告)号：US20080081177A1

公开(公告)日：2008-04-03

申请号：US11902487

申请日：2007-09-21

申请人： Jin Cheol Kim ,  Jun Rok Oh ,  Tae Kyoung Kim ,  Sang Jun Yoon ,  Hwa Young Lee

发明人： Jin Cheol Kim ,  Jun Rok Oh ,  Tae Kyoung Kim ,  Sang Jun Yoon ,  Hwa Young Lee

IPC分类号： B32B5/16 ,  B32B27/36

CPC分类号： H05K1/0373 ,  H05K2201/0141 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/31786

摘要： Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from −300 to +300 ppm/° C. in the temperature range of −55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.

摘要翻译： 公开了一种用于印刷电路板的绝缘材料，其包括液晶聚酯树脂和陶瓷粉末，因此在-55〜125℃的温度范围内具有-300〜+ 300ppm /℃的电容温度系数 C.和介电常数范围为5至40.该绝缘材料具有优良的介电性能，并且根据温度变化的介电常数变化很小，因此在应用于高频电路时表现出高的可靠性。

公开(公告)号：US08053673B2

公开(公告)日：2011-11-08

申请号：US12068790

申请日：2008-02-12

申请人： Jin Cheol Kim ,  Tae Kyoung Kim ,  Jun Rok Oh

发明人： Jin Cheol Kim ,  Tae Kyoung Kim ,  Jun Rok Oh

IPC分类号： H05K1/00

CPC分类号： H05K1/162 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4688 ,  H05K2201/09672 ,  H05K2203/061

摘要： A capacitor embedded printed circuit board (PCB) includes a multilayer polymer capacitor layer with a plurality of polymer sheets. One or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets, are alternately disposed to form a pair. A plurality of first extended electrodes and second extended electrodes protrude from the first inner electrodes and second inner electrodes, respectively. One or more insulating layers are laminated on one or both surfaces of the multilayer polymer capacitor. A plurality of first via holes for capacitor, and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer are connected to the first extended electrodes and the second extended electrodes, respectively. The plurality of the first and second extended electrodes are alternately disposed to be opposite to each other.

摘要翻译： 电容器嵌入式印刷电路板（PCB）包括具有多个聚合物片的多层聚合物电容层。 由多个聚合物片中的一个或多个隔开的一个或多个第一内部电极和第二内部电极交替地设置成一对。 多个第一延伸电极和第二延伸电极分别从第一内部电极和第二内部电极突出。 在多层聚合物电容器的一个或两个表面上层压一个或多个绝缘层。 多个用于电容器的第一通孔和多个穿过多层聚合物电容器层的电容器用第二通孔分别连接到第一延伸电极和第二延伸电极。 多个第一和第二延伸电极交替地设置成彼此相对。

公开(公告)号：US07913368B2

公开(公告)日：2011-03-29

申请号：US12421873

申请日：2009-04-10

申请人： Jin Cheol Kim ,  Jun Rok Oh

发明人： Jin Cheol Kim ,  Jun Rok Oh

IPC分类号： H01R43/00

CPC分类号： H01G2/065 ,  H01G13/00 ,  Y10T29/417 ,  Y10T29/435 ,  Y10T29/49165

摘要： A method of manufacturing a chip capacitor according to an aspect may include: preparing a capacitor lamination including a dielectric sheet formed of a composite having ceramic powder and a polymer mixed with each other, and first and second internal electrodes formed on both surfaces of the dielectric sheet at predetermined intervals; forming covering layers formed of an insulating material on both surfaces of the capacitor lamination; forming a first opening and a second opening in the capacitor lamination having the covering layers formed thereon to expose the first and second internal electrodes, respectively; forming plating layers in the first and second openings, the plating layers connected to the first and second internal electrodes; and dicing the capacitor lamination into chips on the basis of the first and second openings so that the plating layers formed in the first and second openings are provided as first and second external terminals.

摘要翻译： 根据一个方面的制造片状电容器的方法可以包括：制备包括由具有陶瓷粉末和彼此混合的聚合物的复合材料形成的电介质片的电容器层叠体，以及形成在电介质的两个表面上的第一和第二内部电极 片材以预定间隔; 在所述电容器层叠体的两个表面上形成由绝缘材料形成的覆盖层; 在其上形成有覆盖层的电容器层叠中分别形成第一开口和第二开口以暴露第一和第二内部电极; 在所述第一和第二开口中形成镀层，所述镀层连接到所述第一和第二内部电极; 并且基于第一和第二开口将电容器层压切割成芯片，使得形成在第一和第二开口中的镀层被设置为第一和第二外部端子。

公开(公告)号：US07281321B2

公开(公告)日：2007-10-16

申请号：US11361078

申请日：2006-02-22

申请人： Tae Kyoung Kim ,  Jun Rok Oh ,  Jin Cheol Kim

发明人： Tae Kyoung Kim ,  Jun Rok Oh ,  Jin Cheol Kim

IPC分类号： H05K3/30

CPC分类号： H05K1/162 ,  H05K3/4611 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09672 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913

摘要： The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.

摘要翻译： 本发明涉及具有使用混合材料的嵌入式电容器的印刷电路板及其制造方法。 本发明提供了一种具有嵌入式电容器的印刷电路板，以及使用包括液晶聚合物和陶瓷粉末的混合电介质层的材料，以及制造这种印刷电路板的方法。

公开(公告)号：US20110121233A1

公开(公告)日：2011-05-26

申请号：US12692439

申请日：2010-01-22

申请人： Geum Hee Yun ,  Jun Rok Oh ,  Keun Yong Lee

发明人： Geum Hee Yun ,  Jun Rok Oh ,  Keun Yong Lee

IPC分类号： C09K19/34 ,  C08G69/26 ,  C08G73/10

CPC分类号： C08G69/44 ,  C08J5/24 ,  C08J2377/12 ,  C08L77/12 ,  H05K1/034 ,  Y10S428/901 ,  Y10T428/1086

摘要： Disclosed herein is a composition for forming a substrate, including: a compound prepared by polymerizing a liquid crystal thermosetting oligomer having one or more soluble structural units in a main chain thereof and having a thermosetting group at one or more of two ends of the main chain thereof with a fluorine compound having a functional group which can react with the main chain of the liquid crystal thermosetting oligomer.

摘要翻译： 本文公开了一种用于形成基材的组合物，其包括：通过在主链中的一个或多个的两个末端的主链中聚合具有一个或多个可溶性结构单元并具有热固性基团的液晶热固性低聚物制备的化合物 具有可与液晶热固性低聚物的主链反应的官能团的氟化合物。

公开(公告)号：US07676921B2

公开(公告)日：2010-03-16

申请号：US11670463

申请日：2007-02-02

申请人： Jin Cheol Kim ,  Min Soo Kim ,  Jun Rok Oh ,  Tae Kyoung Kim

发明人： Jin Cheol Kim ,  Min Soo Kim ,  Jun Rok Oh ,  Tae Kyoung Kim

IPC分类号： H01K3/10

CPC分类号： H05K1/162 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2201/09672 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of manufacturing a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board manufactured by the method of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon.

摘要翻译： 一种制造包括嵌入式电容器的印刷电路板的方法，该电容器由包括多个聚合物聚合物层的聚合物冷凝层压板组成，每个聚合物层压板具有形成在聚合物片上的聚合物片和导体图案，以及用于层间连接的通孔 以及形成在聚合物冷凝层叠体的任一表面或两个表面上并具有电路图案和用于通过其进行层间连接的通孔的电路层。 通过本发明的方法制造的印刷电路板比传统的嵌入式电容器印刷电路板具有更高的每单位面积的电容密度，由此具有各种电容值的电容器，例如具有高电容的多层陶瓷电容器可以嵌入印刷电路 而不是安装在其上。

公开(公告)号：US07186919B2

公开(公告)日：2007-03-06

申请号：US11031508

申请日：2005-01-06

申请人： Jin Cheol Kim ,  Min Soo Kim ,  Jun Rok Oh ,  Tae Kyoung Kim

发明人： Jin Cheol Kim ,  Min Soo Kim ,  Jun Rok Oh ,  Tae Kyoung Kim

IPC分类号： H05K1/00

CPC分类号： H05K1/162 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2201/09672 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.

摘要翻译： 本发明公开了一种印刷电路板，其包括嵌入式电容器，其由聚合物冷凝器层压体构成，聚合物冷凝层压板包括多个聚合物聚合物层，每个聚合物聚合物层具有形成在聚合物片上的聚合物片和导体图案，以及用于层间连接的通孔 以及形成在聚合物冷凝层叠体的任一表面或两个表面上的电路层，并且具有电路图案和用于通过其进行层间连接的通孔。 本发明的印刷电路板比传统的嵌入式电容器印刷电路板具有更高的每单位面积的电容密度，由此具有各种电容值的电容器，例如具有高电容的多层陶瓷电容器可以嵌入印刷电路板中，而不是 安装在其上。 此外，提供了一种制造包括嵌入式电容器的印刷电路板的方法。