公开(公告)号：US07425514B2

公开(公告)日：2008-09-16

申请号：US11430856

申请日：2006-05-10

申请人： Jae-Hyun Yeo ,  Young-Sun Kim ,  Sung-Tae Kim ,  In-Sung Park ,  Gi-Vin Im

发明人： Jae-Hyun Yeo ,  Young-Sun Kim ,  Sung-Tae Kim ,  In-Sung Park ,  Gi-Vin Im

IPC分类号： H01L21/31

CPC分类号： H01L21/0228 ,  C23C16/405 ,  C23C16/452 ,  C23C16/45553 ,  H01L21/02181 ,  H01L21/02274 ,  H01L21/3141 ,  H01L21/31604 ,  H01L21/31637 ,  H01L21/31641 ,  H01L21/31645 ,  H01L21/31683 ,  H01L21/31691 ,  H01L28/40

摘要： Disclosed are methods of forming dielectric materials using atomic layer deposition (ALD) and methods of forming dielectric layers from such materials on a semiconductor device. The ALD process utilizes a first reactant containing at least one alkoxide group that is chemisorbed onto a surface of a substrate and then reacted with an activated oxidant that contains no hydroxyl group to form a dielectric material exhibiting excellent step coverage and improved leakage current characteristics.

摘要翻译： 公开了使用原子层沉积（ALD）形成介电材料的方法以及在半导体器件上从这种材料形成电介质层的方法。 ALD方法利用含有至少一个醇化物基团的第一反应物，其被化学吸附在基材的表面上，然后与不含羟基的活化氧化剂反应，形成表现出优异的台阶覆盖率和改善的漏电流特性的电介质材料。

公开(公告)号：US20060234517A1

公开(公告)日：2006-10-19

申请号：US11430856

申请日：2006-05-10

申请人： Jae-Hyun Yeo ,  Young-Sun Kim ,  Sung-Tae Kim ,  In-Sung Park ,  Gi-Vin Im

发明人： Jae-Hyun Yeo ,  Young-Sun Kim ,  Sung-Tae Kim ,  In-Sung Park ,  Gi-Vin Im

IPC分类号： H01L21/473

CPC分类号： H01L21/0228 ,  C23C16/405 ,  C23C16/452 ,  C23C16/45553 ,  H01L21/02181 ,  H01L21/02274 ,  H01L21/3141 ,  H01L21/31604 ,  H01L21/31637 ,  H01L21/31641 ,  H01L21/31645 ,  H01L21/31683 ,  H01L21/31691 ,  H01L28/40

摘要： Disclosed are methods of forming dielectric materials using atomic layer deposition (ALD) and methods of forming dielectric layers from such materials on a semiconductor device. The ALD process utilizes a first reactant containing at least one alkoxide group that is chemisorbed onto a surface of a substrate and then reacted with an activated oxidant that contains no hydroxyl group to form a dielectric material exhibiting excellent step coverage and improved leakage current characteristics.

摘要翻译： 公开了使用原子层沉积（ALD）形成介电材料的方法以及在半导体器件上从这种材料形成电介质层的方法。 ALD方法利用含有至少一个醇化物基团的第一反应物，其被化学吸附在基材的表面上，然后与不含羟基的活化氧化剂反应，形成表现出优异的台阶覆盖率和改善的漏电流特性的电介质材料。

公开(公告)号：US07087482B2

公开(公告)日：2006-08-08

申请号：US10615881

申请日：2003-07-10

申请人： Jae-Hyun Yeo ,  Young-Sun Kim ,  Sung-Tae Kim ,  In-Sung Park ,  Gi-Vin Im

发明人： Jae-Hyun Yeo ,  Young-Sun Kim ,  Sung-Tae Kim ,  In-Sung Park ,  Gi-Vin Im

IPC分类号： H01L21/8242

CPC分类号： H01L21/0228 ,  C23C16/405 ,  C23C16/452 ,  C23C16/45553 ,  H01L21/02181 ,  H01L21/02274 ,  H01L21/3141 ,  H01L21/31604 ,  H01L21/31637 ,  H01L21/31641 ,  H01L21/31645 ,  H01L21/31683 ,  H01L21/31691 ,  H01L28/40

摘要： Disclosed are methods of forming dielectric materials using atomic layer deposition (ALD) and methods of forming dielectric layers from such materials on a semiconductor device. The ALD process utilizes a first reactant containing at least one alkoxide group that is chemisorbed onto a surface of a substrate and then reacted with an activated oxidant that contains no hydroxyl group to form a dielectric material exhibiting excellent step coverage and improved leakage current characteristics.

公开(公告)号：US06946342B2

公开(公告)日：2005-09-20

申请号：US10452979

申请日：2003-06-02

申请人： Jae-Hyun Yeo ,  Sung-Tae Kim ,  Young-Sun Kim ,  In-Sung Park ,  Seok-Jun Won ,  Yun-Jung Lee ,  Ki-Vin Im ,  Ki-Yeon Park

发明人： Jae-Hyun Yeo ,  Sung-Tae Kim ,  Young-Sun Kim ,  In-Sung Park ,  Seok-Jun Won ,  Yun-Jung Lee ,  Ki-Vin Im ,  Ki-Yeon Park

IPC分类号： H01L27/04 ,  H01L21/02 ,  H01L21/31 ,  H01L21/314 ,  H01L21/316 ,  H01L21/469 ,  H01L21/8242 ,  H01L27/108 ,  H01L29/76 ,  H01L29/94 ,  H01L31/119

CPC分类号： H01L21/02271 ,  H01L21/02178 ,  H01L21/02181 ,  H01L21/022 ,  H01L21/0228 ,  H01L21/02318 ,  H01L21/0234 ,  H01L21/3141 ,  H01L21/31604 ,  H01L21/31616 ,  H01L21/31637 ,  H01L21/31641 ,  H01L21/31645 ,  H01L21/31691 ,  H01L28/40

摘要： A semiconductor device and a method for forming the same. A dielectric layer is formed on a semiconductor substrate or on a lower electrode of a capacitor. Vacuum annealing is performed on the dielectric layer. Thus, impurities remaining in the dielectric layer can be effectively removed, and the dielectric layer can be densified. As a result, the electrical characteristics of the semiconductor device are improved. For example, the leakage current characteristics of the dielectric layer are improved and capacitance is increased.

公开(公告)号：US07094712B2

公开(公告)日：2006-08-22

申请号：US10793818

申请日：2004-03-08

申请人： Ki-Vin Im ,  Ki-Yeon Park ,  Jae-Hyun Yeo ,  In-Sung Park ,  Seung-Hwan Lee ,  Young-Sun Kim ,  Sung-Tae Kim

发明人： Ki-Vin Im ,  Ki-Yeon Park ,  Jae-Hyun Yeo ,  In-Sung Park ,  Seung-Hwan Lee ,  Young-Sun Kim ,  Sung-Tae Kim

IPC分类号： H01L21/31

CPC分类号： H01L21/0228 ,  C23C16/405 ,  C23C16/45529 ,  C23C16/45531 ,  H01L21/02181 ,  H01L21/022 ,  H01L21/28088 ,  H01L21/28185 ,  H01L21/28194 ,  H01L21/3141 ,  H01L21/31645 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518

摘要： Disclosed is a method for forming metal oxide dielectric layers, more particularly HfO2 dielectric layers, using an atomic layer deposition (ALD) method in which a series of thin intermediate layers are formed and treated with one or more oxidizers and nitrogents before the next intermediate layer is formed on the substrate. The intermediate oxidation treatments reduce the number of organic contaminants incorporated into the metal oxide layer from the organometallic precursors to produce a dielectric layer having improved current leakage characteristics. The dielectric layers formed in this manner remain susceptible to crystallization if exposed to temperatures much above 550° C., so subsequent semiconductor manufacturing processes should be modified or eliminated to avoid such temperatures or limit the duration at such temperatures to maintain the performance of the dielectric materials.

摘要翻译： 公开了一种使用原子层沉积（ALD）方法形成金属氧化物电介质层，更具体地是HfO 2 电介质层的方法，其中形成一系列薄的中间层并用一个或多个 在下一个中间层之前形成氧化剂和氮。 中间氧化处理减少了从有机金属前体引入到金属氧化物层中的有机污染物的数量，以产生具有改善的电流泄漏特性的电介质层。 如果暴露在高于550℃的温度下，以这种方式形成的电介质层仍然易于结晶，因此随后的半导体制造工艺应当被修改或消除以避免这种温度或限制在这样的温度下的持续时间以保持电介质的性能 材料

公开(公告)号：US06897106B2

公开(公告)日：2005-05-24

申请号：US10713577

申请日：2003-11-12

申请人： Ki-Yeon Park ,  Sung-Tae Kim ,  Young-Sun Kim ,  In-Sung Park ,  Jae-Hyun Yeo ,  Ki-Vin Im

发明人： Ki-Yeon Park ,  Sung-Tae Kim ,  Young-Sun Kim ,  In-Sung Park ,  Jae-Hyun Yeo ,  Ki-Vin Im

IPC分类号： H01L21/02 ,  H01L21/314 ,  H01L21/316 ,  H01L21/8242 ,  H01L27/108

CPC分类号： H01L28/40 ,  H01L21/3141 ,  H01L21/3142 ,  H01L21/31616 ,  H01L21/31645 ,  H01L28/56 ,  H01L28/65 ,  H01L28/75

摘要： A semiconductor memory device that includes a composite Al2O3/HfO2 dielectric layer with a layer thickness ratio greater than or equal to 1, and a method of manufacturing the capacitor are provided. The capacitor includes a lower electrode, a composite dielectric layer including an Al2O3 dielectric layer and an HfO2 dielectric layer sequentially formed on the lower electrode, the Al2O3 dielectric layer having a thickness greater than or equal to the HfO2 dielectric layer, and an upper electrode formed on the composite dielectric layer. The Al2O3 dielectric layer has a thickness of 30-60 Å. The HfO2 dielectric layer has a thickness of 40 Å or less.

摘要翻译： 一种半导体存储器件，其包括层厚度比大于或等于1的复合Al 2 O 3 / HfO 2 电介质层， 并提供一种制造该电容器的方法。 电容器包括下电极，复合电介质层，其包括依次形成在其上的Al 2 O 3 3电介质层和HfO 2 N 2介电层 下电极，具有大于或等于HfO 2 2电介质层的厚度的Al 2 O 3 3 电介质层，以及形成的上电极 在复合介电层上。 Al 2 O 3介电层具有30-60埃的厚度。 HfO 2 2介电层的厚度为40以下。

公开(公告)号：US20050070063A1

公开(公告)日：2005-03-31

申请号：US10793818

申请日：2004-03-08

申请人： Ki-Vin Im ,  Ki-Yeon Park ,  Jae-Hyun Yeo ,  In-Sung Park ,  Seung-Hwan Lee ,  Young-Sun Kim ,  Sung-Tae Kim

发明人： Ki-Vin Im ,  Ki-Yeon Park ,  Jae-Hyun Yeo ,  In-Sung Park ,  Seung-Hwan Lee ,  Young-Sun Kim ,  Sung-Tae Kim

IPC分类号： C23C16/40 ,  C23C16/455 ,  H01L21/28 ,  H01L21/314 ,  H01L21/316 ,  H01L21/8242 ,  H01L29/49 ,  H01L29/51

CPC分类号： H01L21/0228 ,  C23C16/405 ,  C23C16/45529 ,  C23C16/45531 ,  H01L21/02181 ,  H01L21/022 ,  H01L21/28088 ,  H01L21/28185 ,  H01L21/28194 ,  H01L21/3141 ,  H01L21/31645 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518

摘要： Disclosed is a method for forming metal oxide dielectric layers, more particularly HfO2 dielectric layers, using an atomic layer deposition (ALD) method in which a series of thin intermediate layers are formed and treated with one or more oxidizers and nitrogents before the next intermediate layer is formed on the substrate. The intermediate oxidation treatments reduce the number of organic contaminants incorporated into the metal oxide layer from the organometallic precursors to produce a dielectric layer having improved current leakage characteristics. The dielectric layers formed in this manner remain susceptible to crystallization if exposed to temperatures much above 550° C., so subsequent semiconductor manufacturing processes should be modified or eliminated to avoid such temperatures or limit the duration at such temperatures to maintain the performance of the dielectric materials.

摘要翻译： 公开了一种使用原子层沉积（ALD）方法形成金属氧化物电介质层，更具体地HfO 2电介质层的方法，其中在下一个中间层之前形成一系列薄的中间层并用一种或多种氧化剂和氮化物进行处理 形成在基板上。 中间氧化处理减少了从有机金属前体引入到金属氧化物层中的有机污染物的数量，以产生具有改善的电流泄漏特性的电介质层。 如果暴露在高于550℃的温度下，以这种方式形成的电介质层仍然易于结晶，因此随后的半导体制造工艺应当被修改或消除以避免这种温度或限制在这样的温度下的持续时间以保持电介质的性能 材料

公开(公告)号：US20050272272A1

公开(公告)日：2005-12-08

申请号：US11198541

申请日：2005-08-05

申请人： Jae-Hyun Yeo ,  Sung-Tae Kim ,  Young-Sun Kim ,  In-Sung Park ,  Seok-Jun Won ,  Yun-Jung Lee ,  Ki-Vin Im ,  Ki-Yeon Park

发明人： Jae-Hyun Yeo ,  Sung-Tae Kim ,  Young-Sun Kim ,  In-Sung Park ,  Seok-Jun Won ,  Yun-Jung Lee ,  Ki-Vin Im ,  Ki-Yeon Park

IPC分类号： H01L27/04 ,  H01L21/02 ,  H01L21/31 ,  H01L21/314 ,  H01L21/316 ,  H01L21/469 ,  H01L21/8242 ,  H01L27/108 ,  H01L29/76 ,  H01L29/94 ,  H01L31/119

CPC分类号： H01L21/02271 ,  H01L21/02178 ,  H01L21/02181 ,  H01L21/022 ,  H01L21/0228 ,  H01L21/02318 ,  H01L21/0234 ,  H01L21/3141 ,  H01L21/31604 ,  H01L21/31616 ,  H01L21/31637 ,  H01L21/31641 ,  H01L21/31645 ,  H01L21/31691 ,  H01L28/40

摘要： A semiconductor device and a method for forming the same. A dielectric layer is formed on a semiconductor substrate or on a lower electrode of a capacitor. Vacuum annealing is performed on the dielectric layer. Thus, impurities remaining in the dielectric layer can be effectively removed, and the dielectric layer can be densified. As a result, the electrical characteristics of the semiconductor device are improved. For example, the leakage current characteristics of the dielectric layer are improved and capacitance is increased.

摘要翻译： 一种半导体器件及其形成方法。 电介质层形成在半导体衬底上或电容器的下电极上。 在电介质层上进行真空退火。 因此，可以有效地除去残留在电介质层中的杂质，并且可以使电介质层致密化。 结果，提高了半导体器件的电特性。 例如，介电层的漏电流特性得到改善，电容增大。

公开(公告)号：US20050000426A1

公开(公告)日：2005-01-06

申请号：US10747803

申请日：2003-12-29

申请人： Ki-Vin Im ,  In-Sung Park ,  Sung-Tae Kim ,  Young-Sun Kim ,  Jae-Hyun Yeo ,  Yun-Jung Lee ,  Ki-Yeon Park

发明人： Ki-Vin Im ,  In-Sung Park ,  Sung-Tae Kim ,  Young-Sun Kim ,  Jae-Hyun Yeo ,  Yun-Jung Lee ,  Ki-Yeon Park

IPC分类号： H01L21/02 ,  C23C16/00 ,  C23C16/40 ,  C23C16/44 ,  C23C16/448 ,  C23C16/455

CPC分类号： C23C16/45544 ,  C23C16/40 ,  C23C16/4481

摘要： An apparatus for depositing a thin film includes a reaction chamber, a reaction gas provider to supply a reaction gas and/or inert gas to the reaction chamber, an oxidant provider to supply a first oxidant and a second oxidant to the reaction chamber, and an air drain to exhaust gas from the apparatus. The oxidant provider is operable to supply the second oxidant to the reaction chamber using the first oxidant as a transfer gas.

摘要翻译： 用于沉积薄膜的装置包括反应室，向反应室供应反应气体和/或惰性气体的反应气体提供者，向反应室供应第一氧化剂和第二氧化剂的氧化剂供体，以及 从设备排出废气。 氧化剂供应商可操作以使用第一氧化剂作为转移气体将第二氧化剂供应到反应室。

公开(公告)号：US20050087791A1

公开(公告)日：2005-04-28

申请号：US11009198

申请日：2004-12-08

申请人： Ki-Yeon Park ,  Sung-Tao Kim ,  Young-Sun Kim ,  In-Sung Park ,  Jae-Hyun Yeo ,  Ki-Vin Im

发明人： Ki-Yeon Park ,  Sung-Tao Kim ,  Young-Sun Kim ,  In-Sung Park ,  Jae-Hyun Yeo ,  Ki-Vin Im

IPC分类号： H01L21/02 ,  H01L21/314 ,  H01L21/316 ,  H01L21/8242 ,  H01L27/108

CPC分类号： H01L28/40 ,  H01L21/3141 ,  H01L21/3142 ,  H01L21/31616 ,  H01L21/31645 ,  H01L28/56 ,  H01L28/65 ,  H01L28/75

摘要： A semiconductor memory device that includes a composite Al2O3HfO2 dielectric layer with a layer thickness ratio greater than or equal to 1, and a method of manufacturing the capacitor are provided. The capacitor includes a lower electrode, a composite dielectric layer including an Al2O3 dielectric layer and an HfO2 dielectric layer sequentially formed on the lower electrode, the Al2O3 dielectric layer having a thickness greater than or equal to the HfO2 dielectric layer, and an upper electrode formed on the composite dielectric layer. The Al2O3 dielectric layer has a thickness of 30-60 Å. The HfO2 dielectric layer has a thickness of 40 Å or less.

摘要翻译： 一种半导体存储器件，其包括层厚度比大于或等于1的复合Al 2 O 3 HfO 2 电介质层，以及 提供了制造电容器的方法。 电容器包括下电极，复合电介质层，其包括依次形成在其上的Al 2 O 3 3介电层和HfO 2 O 3介电层 下电极，具有大于或等于HfO 2 2电介质层的厚度的Al 2 O 3 3 电介质层，以及形成的上电极 在复合介电层上。 Al 2 O 3介电层具有30-60埃的厚度。 HfO 2 2介电层的厚度为40以下。