摘要:
A semiconductor memory device having a partially controlled delay locked loop includes a delay locked loop and a control signal generator. The control signal generator generates a first control signal and a second control signal, which are responsive to first through fifth mode selection signals for selecting operation modes of the semiconductor memory, device to partially turn the delay locked loop on or off. If the first control signal or the second control signal is activated, a portion of the delay locked loop to which the first or second control signal is applied is turned off. If the first control signal or the second control signal is deactivated, a portion of the delay locked loop to which the first or second control signal is applied is turned on. If the first mode selection signal is activated, only the second control signal is activated. If the second mode selection signal is activated, the first and second control signals are deactivated. If at least one of the third through fifth mode selection signals is activated, the first and second control signals are activated. Since the semiconductor memory device includes a built-in delay locked loop which is partially turned on or off, current consumption of the semiconductor memory device can be reduced.
摘要:
Provided are an interface circuit and a signal clamping circuit using a level-down shifter. The interface circuit includes the level-down shifter between a first power circuit driven by a first power and a second power circuit driven by a second power. The level-down shifter converts an output of the first power circuit that has a voltage level of the first power into an output of a voltage level of the second power. The level-down shifter includes a first circuit unit, a second circuit unit, a third circuit unit, and a fourth circuit unit. The first circuit unit is driven by the first power and receives the output of the first power circuit. The second circuit unit is driven by the second power and receives the output of the first power circuit. The third circuit unit is driven by the second power and receives the output of the first power circuit. The fourth circuit unit is driven by the second power, receives an output of the third circuit unit, and is connected to an output of the second circuit unit.
摘要:
Provided are an interface circuit and a signal clamping circuit using a level-down shifter. The interface circuit includes the level-down shifter between a first power circuit driven by a first power and a second power circuit driven by a second power. The level-down shifter converts an output of the first power circuit that has a voltage level of the first power into an output of a voltage level of the second power. The level-down shifter includes a first circuit unit, a second circuit unit, a third circuit unit, and a fourth circuit unit. The first circuit unit is driven by the first power and receives the output of the first power circuit. The second circuit unit is driven by the second power and receives the output of the first power circuit. The third circuit unit is driven by the second power and receives the output of the first power circuit. The fourth circuit unit is driven by the second power, receives an output of the third circuit unit, and is connected to an output of the second circuit unit.
摘要:
Provided are an interface circuit and a signal clamping circuit using a level-down shifter. The interface circuit includes the level-down shifter between a first power circuit driven by a first power and a second power circuit driven by a second power. The level-down shifter converts an output of the first power circuit that has a voltage level of the first power into an output of a voltage level of the second power. The level-down shifter includes a first circuit unit, a second circuit unit, a third circuit unit, and a fourth circuit unit. The first circuit unit is driven by the first power and receives the output of the first power circuit. The second circuit unit is driven by the second power and receives the output of the first power circuit. The third circuit unit is driven by the second power and receives the output of the first power circuit. The fourth circuit unit is driven by the second power, receives an output of the third circuit unit, and is connected to an output of the second circuit unit.
摘要:
Provided are an interface circuit and a signal clamping circuit using a level-down shifter. The interface circuit includes the level-down shifter between a first power circuit driven by a first power and a second power circuit driven by a second power. The level-down shifter converts an output of the first power circuit that has a voltage level of the first power into an output of a voltage level of the second power. The level-down shifter includes a first circuit unit, a second circuit unit, a third circuit unit, and a fourth circuit unit. The first circuit unit is driven by the first power and receives the output of the first power circuit. The second circuit unit is driven by the second power and receives the output of the first power circuit. The third circuit unit is driven by the second power and receives the output of the first power circuit. The fourth circuit unit is driven by the second power, receives an output of the third circuit unit, and is connected to an output of the second circuit unit.
摘要:
An embodiment of the invention comprises a digital phase detector with substantially zero phase offset. The digital phase detector receives a clock signal and a reference clock signal and provides a phase indicator signal to identify whether the clock signal leads or lags the reference clock signal. An embodiment of the invention comprises a method that adds substantially zero phase offset in processing an input clock signal and a delayed clock signal to generate a control signal. The control signal is processed in a variable delay line to generate the delayed clock signal. In an embodiment, a first processor comprises a delay locked loop having a digital phase detector, the digital phase detector comprising a first differential sense amplifier cross-coupled to a second differential sense amplifier, the digital phase detector receiving a clock signal and generating one or more delayed clock signals, a control signal, and a gated data signal.
摘要:
A computer memory, having one or more of a semiconductor memory device having an internal memory array comprising a plurality of semiconductor dynamic random access memory (DRAM) cells arranged in a matrix of rows and columns, and provided as a memory module rank of such memory devices arranged in an array on a DIMM of one or more of said semiconductor memory device on a substrate which can be coupled via a memory device data interface to a memory system as a memory subsystem, each of said memory device having a low power shut-down state that can be activated using a common memory data interface. Control of power to a DRAM issues over the data interface two commands to a DRAM power control command decode, a power-state program signal and a power-state reset signal as a power-state control commands to control the power state of said DRAM, and to activate for READ/WRITE a memory cell as a normal active or spare device.
摘要:
A method and structures are provided for implementing decoupling capacitors within a DRAM TSV stack. A DRAM is formed with a plurality of TSVs extending completely through the substrate and filled with a conducting material. A layer of glass is grown on both the top and bottom of the DRAM providing an insulator. A layer of metal is grown on each glass layer providing a conductor. The metal and glass layers are etched through to TSVs with a gap provided around the perimeter of via pads. A respective solder ball is formed on the TSVs to connect to another DRAM chip in the DRAM TSV stack. The metal layers are connected to at least one TSV by one respective solder ball and are connected to a voltage source and a dielectric is inserted between the metal layers in the DRAM TSV stack to complete the decoupling capacitor.
摘要:
A method and structure are provided for implementing multiple different types of dies for memory stacking. A common wafer is provided with a predefined reticle type. The reticle type includes a plurality of arrays, and a plurality of periphery segments. A plurality of through-silicon-vias (TSVs) is placed at boundaries between array and periphery segments. Multiple different types of dies for memory stacking are obtained based upon selected scribing of the dies from the common wafer.
摘要:
A memory system with a programmable refresh cycle including a memory device that includes a memory array of memory cells and refresh circuitry that is in communication with the memory array and with a memory controller. The refresh circuitry is configured to receive a refresh command from the memory controller and for refreshing a number of the memory cells in the memory device in response to receiving the refresh command. The number of memory cells refreshed in response to receiving the refresh command is programmable.