公开(公告)号：US5290392A

公开(公告)日：1994-03-01

申请号：US894685

申请日：1992-06-05

申请人： James C. Lau ,  Kenneth Lui ,  Richard P. Malmgren

发明人： James C. Lau ,  Kenneth Lui ,  Richard P. Malmgren

IPC分类号： C30B25/02 ,  C30B29/04

CPC分类号： C30B25/02 ,  C30B29/04 ,  Y10S117/915

摘要： This invention discloses a method of fabricating a plurality of diamond semiconductor wafers from a single crystal diamond semiconductor boule, where the diamond boule is grown by a chemical vapor deposition (CVD) process. Initially, a single crystal diamond seed is polished and an impurity layer is deposited on the polished seed crystal. The CVD growth process is then initiated to deposit a layer of single crystal diamond over the impurity layer to form the diamond boule. At desirable intervals, the CVD growth process is stopped and a surface of the diamond boule is polished in order to accept another impurity layer. Each impurity layer is photolithographically patterned in order to generate an alternating configuration of impurity regions and hole regions. The impurity regions and the hole regions enable the bond between the diamond layers to be weakened without causing the crystalline orientation to deviate. Once the diamond semiconductor boule is developed by this process, it can be easily sliced by a laser slicing process into a plurality of diamond semiconductor wafers along the impurity layers.

摘要翻译： 本发明公开了一种从单晶金刚石半导体晶锭制造多个金刚石半导体晶片的方法，其中通过化学气相沉积（CVD）工艺生长金刚石晶粒。 最初，抛光单晶金刚石晶种，杂质层沉积在抛光晶种上。 然后开始CVD生长过程，以在杂质层上沉积一层单晶金刚石以形成金刚石晶粒。 以期望的间隔，停止CVD生长过程并抛光金刚石晶粒的表面以接受另一个杂质层。 每个杂质层被光刻图案化以便产生杂质区域和孔区域的交替构型。 杂质区域和空穴区域能够使金刚石层之间的结合减弱而不会导致晶体取向偏离。 一旦通过该工艺开发了金刚石半导体晶锭，则可以通过激光切片工艺将其容易地沿着杂质层切割成多个金刚石半导体晶片。

公开(公告)号：US5311153A

公开(公告)日：1994-05-10

申请号：US917633

申请日：1992-07-17

申请人： James C. Lau ,  Richard P. Malmgren ,  Kenneth Lui

发明人： James C. Lau ,  Richard P. Malmgren ,  Kenneth Lui

IPC分类号： H01P5/107 ,  H03H5/00

CPC分类号： H01P5/107

摘要： An integrated waveguide/stripline signal transition structure and method for fabricating the same are provided for allowing high frequency signal transitions. The signal transition structure includes a waveguide which has a conductive cavity for guiding electromagnetic waves therethrough. A first conductive circuit layer is fabricated within the conductive cavity and is electrically connected thereto. A second conductive signal layer is fabricated within the conductive cavity and is isolated from the conductive cavity and the first conductive signal layer. A plurality of dielectric layers are provided which suspend the first and second conductive signal layers within the conductive cavity. The second conductive signal layer and the conductive cavity thereby allow for signal transitions therebetween. The first and second conductive signal layers and dielectric material are integrally fabricated on top of a removable material which is subsequently removed. In an alternate embodiment, a single dielectric layer is provided for suspending the first and second conductive signal layers. In addition, an array of signal transition structures may be integrally fabricated within a housing structure.

摘要翻译： 提供了一种集成的波导/带状线信号转换结构及其制造方法，用于允许高频信号转换。 信号转换结构包括具有导电电磁波的导电腔的波导。 第一导电电路层制造在导电腔内并与其电连接。 在导电腔内制造第二导电信号层，并与导电腔和第一导电信号层隔离。 提供了多个介电层，其将第一和第二导电信号层悬挂在导电腔内。 因此，第二导电信号层和导电腔允许它们之间的信号转换。 第一和第二导电信号层和电介质材料整体地制造在随后被去除的可去除材料的顶部上。 在替代实施例中，提供单个电介质层用于悬挂第一和第二导电信号层。 此外，信号转变结构的阵列可以一体地制造在壳体结构内。

公开(公告)号：US5336992A

公开(公告)日：1994-08-09

申请号：US892908

申请日：1992-06-03

申请人： Yoshio Saito ,  James C. Lau ,  Steven S. Chan ,  Richard P. Malmgren

发明人： Yoshio Saito ,  James C. Lau ,  Steven S. Chan ,  Richard P. Malmgren

IPC分类号： G01R1/073 ,  G01R1/06 ,  G01R31/02

CPC分类号： G01R1/07357

摘要： An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible, supportive dielectric material which allows vertical flexing of the contacts. Cross bar switches are further employed to switch among the plurality of contacts thereby enabling the testing of individual dies of the water to be tested. A microprocessor is further included for controlling the switching and the testing of each die. In an alternate embodiment, the plurality of contacts are mechanically moved relative to the wafer to allow testing of the dies without the need for the switches.

摘要翻译： 提供一种用于测试位于晶片上的集成电路的电测试装置。 测试装置采用具有多个触点的多层测试电路，用于接触晶片上的集成电路。 测试电路的层被嵌入柔性的支撑电介质材料中，允许触点的垂直弯曲。 进一步采用十字杆开关在多个触点之间切换，从而能够测试要测试的水的各个模具。 还包括微处理器，用于控制每个管芯的切换和测试。 在替代实施例中，多个触点相对于晶片机械地移动，以允许模具的测试而不需要开关。

公开(公告)号：US5266529A

公开(公告)日：1993-11-30

申请号：US780175

申请日：1991-10-21

申请人： James C. Lau ,  Maurice Lowery ,  Kenneth Lui

发明人： James C. Lau ,  Maurice Lowery ,  Kenneth Lui

IPC分类号： H01C17/24 ,  H01L21/02 ,  H01L21/321 ,  H01L21/465

CPC分类号： H01L28/20 ,  H01C17/2404 ,  H01L21/321

摘要： A method for trimming thin film resistors. A focused inert ion beam is employed to selectively remove portions of a resistive film deposited on a substrate.

摘要翻译： 一种修整薄膜电阻的方法。 使用聚焦的惰性离子束来选择性地去除沉积在基底上的电阻膜的部分。

公开(公告)号：US06492620B1

公开(公告)日：2002-12-10

申请号：US09860872

申请日：2001-05-18

申请人： James C. Lau

发明人： James C. Lau

IPC分类号： H05B300

CPC分类号： H05K7/20 ,  H01L23/345 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/0212 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/167 ,  H05K3/3494 ,  H05K3/368 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09263 ,  H05K2201/09681 ,  H05K2203/1115 ,  H05K2203/176 ,  H01L2924/00014

摘要： Fault tolerance is incorporated within the integral electric heaters of a reworkable electronic semiconductor component, such as a reworkable multi-chip module, to increase production yield and longevity of the rework feature. Components of the foregoing kind contain a multi-layer substrate to bond to a printed wiring board, and, for rework, the component includes a plurality of electric heaters arranged side by side on a bottom layer of the substrate. When energized with current, the heaters generate sufficient heat to weaken the adhesive or solder bond to the printed wiring board without delaminating the layers of the substrate, allowing the electronic semiconductor component to be pulled away from the printed wiring board for rework. Additional circuitry is included to automatically route heater current around, that is bypass, any current-interrupting break(s) as may form in any of the electric heaters giving the heaters a fault tolerance.

摘要翻译： 容错功能被集成在可再加工的电子半导体部件（例如可再加工的多芯片模块）的整体式电加热器内，以提高返工特征的生产成本和寿命。 上述种类的组件包含多层基板以与印刷电路板接合，并且为了返工，该部件包括并排布置在基板的底层上的多个电加热器。 当用电流通电时，加热器产生足够的热量以削弱与印刷线路板的粘合剂或焊料结合，而不会使基板的层分层，允许将电子半导体部件从印刷线路板拉出以进行返工。 包括额外的电路，用于自动路由加热器电流（旁路），任何电流中断中断可能会在任何电加热器中形成故障容限。

公开(公告)号：US5987732A

公开(公告)日：1999-11-23

申请号：US137288

申请日：1998-08-20

申请人： Alfred E. Lee ,  Roger A. Davidheiser ,  James C. Lau

发明人： Alfred E. Lee ,  Roger A. Davidheiser ,  James C. Lau

IPC分类号： H05K3/46 ,  H01L21/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/00 ,  H01L25/04 ,  H01L25/18 ,  H01P11/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00

CPC分类号： H01L23/552 ,  H01L21/50 ,  H01L23/66 ,  H05K1/0219 ,  H01L2924/0002 ,  H05K1/185 ,  H05K2201/09681 ,  H05K3/0023 ,  H05K3/4644 ,  Y10T29/49016 ,  Y10T29/49126 ,  Y10T29/49165

摘要： The invention relates to a method for producing low cost integrated microwave assemblies, where a photoresist layer is deposited onto a substrate, a portion of the photoresist is selectively removed, a first conductive layer is applied, and, a second portion of the photoresist is removed leaving isolation walls and cavities. Electrical components are placed in the cavities and a first dielectric layer fills the cavities. Vias are created in the first dielectric material exposing the electrical contacts, a second conductive layer is applied into the vias and over the first dielectric material. The second conductive layer is patterned by removing a portion of the second conductive layer creating a signal line pattern in the second conductive layer.

摘要翻译： 本发明涉及一种生产低成本集成微波组件的方法，其中将光致抗蚀剂层沉积在衬底上，选择性地去除一部分光致抗蚀剂，施加第一导电层，并且去除光致抗蚀剂的第二部分 留下隔离墙和空腔。 电气部件被放置在空腔中，并且第一介电层填充空腔。 在暴露电触点的第一电介质材料中产生通孔，第二导电层被施加到通孔中并在第一介电材料上方。 通过去除第二导电层的一部分在第二导电层中产生信号线图案来对第二导电层进行图案化。

公开(公告)号：US4883998A

公开(公告)日：1989-11-28

申请号：US045561

申请日：1987-05-04

申请人： James C. Lau

发明人： James C. Lau

IPC分类号： H01R39/39 ,  H02K5/14 ,  H02K13/00

CPC分类号： H01R39/39 ,  H02K5/145 ,  H02K2205/06

摘要： An electric motor has a can-like casing and an end cap. Brushgear is mounted on a frame prior to insertion into the motor. The frame holds the brushes of the brush gear away from a commutator of the motor by means of resilient arms which engage the brush gear. As the frame is inserted into the motor the arms come against a post which bends the arms to disengage them from the brush arms so that the brushes settle onto the commutator.

摘要翻译： 电动机具有罐状壳体和端盖。 在插入电机之前，将刷子安装在框架上。 框架通过与刷齿轮接合的弹性臂将刷子的刷子保持在离开马达的换向器的位置。 当框架被插入到电动机中时，臂抵靠一个柱，该柱弯曲臂以使其与刷臂脱离，使得电刷沉降到换向器上。

公开(公告)号：US5448014A

公开(公告)日：1995-09-05

申请号：US9530

申请日：1993-01-27

申请人： Alvin M. Kong ,  James C. Lau ,  Steven S. Chan

发明人： Alvin M. Kong ,  James C. Lau ,  Steven S. Chan

IPC分类号： H01L21/66 ,  H01L23/02 ,  H03H3/08 ,  H03H9/10 ,  H05K5/06

CPC分类号： H03H9/059 ,  H03H9/1071 ,  H01L2224/16225 ,  Y10T29/4913

摘要： The present invention provides a new and effective method for the sealing and electrical testing of electronic devices; and particularly for surface acoustic wave devices. In accordance with the present invention, the cost and size of making hermetically sealed packages for electronic devices and of electrically testing each device is significantly reduced over the prior art by making use of mass simultaneous sealing and electrical connection at the wafer level, and by using substrates with hermetically sealed and electrically conductive via holes. Further, cost reduction is effected by making use of final electrical testing with wafer probe test techniques before dicing.

摘要翻译： 本发明提供了一种新的有效的电子设备密封和电气测试方法; 特别是表面声波装置。 根据本发明，通过利用在晶片级的大量同时密封和电连接，并且通过使用在电子设备上的密封封装和电测试每个器件的成本和尺寸比现有技术大大降低 具有气密密封和导电通孔的基板。 此外，通过在切割之前利用晶片探针测试技术进行最终电气测试来实现成本降低。

公开(公告)号：US5373724A

公开(公告)日：1994-12-20

申请号：US155403

申请日：1993-11-19

申请人： James C. Lau ,  Charles C. Ruth

发明人： James C. Lau ,  Charles C. Ruth

IPC分类号： G01N1/22 ,  G01N33/00 ,  G01N11/04

CPC分类号： G01N33/0009 ,  G01N33/0011 ,  G01N1/22

摘要： A resealable gas concentration sensor for determining the concentration of a particular gas within a gaseous environment. The sensor is constructed of a housing and a cap. The cap is adapted to be temporarily coupled with the housing while in the environment to define a sealed sample chamber, thereby capturing a sample of the environment. A venturi tube having a narrow passage is affixed to the housing which is adapted to allow fluid flow through venturi tube into test equipment for determining the concentration of the gas in the sample. The housing and cap may be repeatedly uncoupled and resealed to capture additional samples and measure other concentrations.

摘要翻译： 一种可重新密封的气体浓度传感器，用于确定气体环境中特定气体的浓度。 传感器由外壳和盖构成。 帽子适于在环境中暂时与壳体联接以限定密封的样品室，从而捕获环境样本。 具有窄通道的文丘里管被固定到壳体上，该壳体适于允许流体通过文丘里管流入测试设备中以确定样品中气体的浓度。 外壳和盖子可以重复地分离并重新密封以捕获额外的样品并测量其它浓度。