-
公开(公告)号：US5914864A
公开(公告)日：1999-06-22
申请号：US995388
申请日：1997-12-22
CPC分类号： H05K3/284 , F16F15/08 , H05K1/0271 , H05K1/0272 , H05K2201/0133 , H05K2201/10674 , H05K2201/2045
摘要： A shock and vibration attenuating structure and method is provided for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. The shock and vibration attenuating structure includes a layer of elastomer material adapted to overlay the distribution circuit and substantially conform to the at least one electronic component. The layer includes a negative image of at least part of the at least one electronic component to allow the elastomer material to envelope the at least part of the at least one electronic component, and at least one relief formed in the elastomer material. The at least one relief is spaced from the negative image of the at least one electronic component and has a predetermined size, shape, and location in the elastomer material selected to protect the electronic component from shock and vibration induced loads and deflections with the layer overlaying the electronic assembly.
摘要翻译： 提供了一种用于电子组件的冲击和振动衰减结构和方法，该电子组件包括分配电路和安装在分配电路的表面上的至少一个电子部件。 冲击和振动衰减结构包括适于覆盖分配电路并且基本上符合至少一个电子部件的弹性体材料层。 所述层包括所述至少一个电子部件的至少一部分的负像，以允许所述弹性体材料包围所述至少一个电子部件的所述至少一部分，以及形成在所述弹性体材料中的至少一个凸版。 所述至少一个浮雕与所述至少一个电子部件的负像片间隔开并且具有预定的尺寸，形状和位置，所述弹性体材料被选择以保护电子部件免受震动和振动引起的载荷和偏转，并且覆盖层 电子组件。
-
2.发明授权Method and apparatus for packaging a microelectronic device with an elastomer gel 失效用弹性体凝胶包装微电子器件的方法和装置
公开(公告)号：US5905638A
公开(公告)日：1999-05-18
申请号：US993815
申请日：1997-12-18
CPC分类号： H01R13/2414 , H05K7/1061 , H01R12/714 , H05K3/325
摘要： An apparatus and method for packaging a microelectronic device to be connectable to a distribution circuit. The apparatus is in the form of a microelectronic package including a microelectronic device having first and second oppositely facing surfaces and a plurality of Input/Output pads on the first surface capable of being electrically interconnected to a distribution circuit, a base adapted to support the microelectronic device in a predetermined operative relationship to a distribution circuit, and a first layer of elastomer gel sandwiched between the first surface and the base. The first surface of the microelectronic device overlays the base so as to allow an electrical interconnection through the base between the microelectronic device and a distribution circuit.
摘要翻译： 一种用于封装可连接到配电电路的微电子器件的装置和方法。 该装置是微电子封装的形式，其包括具有第一和第二相对面的表面的微电子器件，以及第一表面上的能够电连接到分配电路的多个输入/输出焊盘，适于支撑微电子 装置与分配电路预定的操作关系，以及夹在第一表面和基底之间的第一弹性体凝胶层。 微电子器件的第一表面覆盖基底，以便允许通过微电子器件和分配电路之间的基极的电互连。
-
公开(公告)号：US6061036A
公开(公告)日：2000-05-09
申请号：US17660
申请日：1998-02-03
IPC分类号： H01Q1/24 , H01Q1/36 , H01Q1/38 , H01Q1/40 , H01Q1/42 , H01Q5/00 , H01Q5/378 , H01Q5/385 , H01Q9/30
CPC分类号： H01Q9/30 , H01Q1/243 , H01Q1/244 , H01Q1/36 , H01Q1/38 , H01Q1/40 , H01Q1/405 , H01Q5/378 , H01Q5/385
摘要： A thin flexible antenna has radiating elements made of thin nickel-titanium, a highly flexible and rigid alloy. The radiating elements are covered with silicone elastomer dielectric layers that have suitable elongation properties to withstand extreme bending stresses outer jackets cover the antenna. The outer jackets have a textured exterior surface that evenly distributes the bending stresses across the antenna.
摘要翻译： 薄的柔性天线具有由薄镍钛制成的辐射元件，高度柔性和刚性的合金。 辐射元件被有机硅弹性体介电层覆盖，其具有适合的伸长性能以承受极端弯曲应力外护套覆盖天线。 外套具有纹理的外表面，其均匀分布穿过天线的弯曲应力。
-
4.发明授权
公开(公告)号：US6046708A
公开(公告)日：2000-04-04
申请号：US17658
申请日：1998-02-03
摘要： A termination contact for an antenna that has a Ni--Ti radiating element is formed by a layer of electrically conductive carbon filler disposed on the Ni--Ti radiating element. A conductive element is positioned on the layer of conductive carbon filler to provide electrical interface between the Ni--Ti radiating element and external RF circuitry. In to prevent contamination, a protective layer of silicon elastomer covers the conductive layer and the Ni--Ti radiating element such that a portion of the conductive element is exposed to provide a RF feed point.
摘要翻译： 具有Ni-Ti辐射元件的天线的终端接触件由设置在Ni-Ti辐射元件上的导电碳填料层形成。 导电元件位于导电碳填料层上，以提供Ni-Ti辐射元件与外部RF电路之间的电接口。 为了防止污染，硅弹性体的保护层覆盖导电层和Ni-Ti辐射元件，使得暴露导电元件的一部分以提供RF馈电点。
-
公开(公告)号：US06570776B2
公开(公告)日：2003-05-27
申请号：US09884110
申请日：2001-06-20
IPC分类号： H05K900
CPC分类号： H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12044 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/0218 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A circuit shielding structure includes a circuitry package and a layer of conductive polymer material coating at least a portion of the circuitry package. The layer of conductive polymer material may include a metal filled polymer such as a silver particle filled fluoroelastomer.
-
6.发明授权Gel structure for combined EMI shielding and thermal control of microelectronic assemblies 有权用于组合EMI屏蔽和微电子组件的热控制的凝胶结构公开(公告)号：US06195267B1
公开(公告)日：2001-02-27
申请号：US09338818
申请日：1999-06-23
IPC分类号： H05K720
CPC分类号： H05K9/0024 , H01L23/42 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2924/00014 , H01L2224/0401
摘要： A shielding and thermal dissipation structure for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. A plastic housing overlays the at least one electronic component, and includes an outer periphery defining a housing interior and substantially surrounding the outer periphery of the at least one electronic component. A closed end on one side of the housing outer periphery has an interior surface facing the at least one electronic component with a metal coating about 5 microns thick on the interior surface. The metal coating is chosen from the group of nickel and gold. An electrically conductive gel in the housing interior about the plastic housing outer periphery (and preferably including carbon particles or carbon fibers) is in intimate contact with the distribution circuit and the metal coating. And a thermally conductive gel is disposed between the at least one electronic component and the housing closed end interior surface, and preferable includes particles of at least one of the group of aluminum oxide, aluminum nitride, and boron nitride.
摘要翻译： 一种用于电子组件的屏蔽和散热结构，包括分配电路和安装在分配电路的表面上的至少一个电子部件。 塑料壳体覆盖至少一个电子部件，并且包括限定壳体内部并且基本上围绕至少一个电子部件的外周边的外周边。 壳体外周的一侧上的封闭端具有面向至少一个电子部件的内表面，在内表面上具有约5微米厚的金属涂层。 金属涂层选自镍和金。 壳体内部围绕塑料壳体外周（并且优选地包括碳颗粒或碳纤维）的导电凝胶与分配回路和金属涂层紧密接触。 并且导热性凝胶被设置在所述至少一个电子部件和所述壳体封闭端内表面之间，并且优选包括所述一组氧化铝，氮化铝和氮化硼中的至少一种的颗粒。
-
公开(公告)号：US5885710A
公开(公告)日：1999-03-23
申请号：US824472
申请日：1997-03-26
CPC分类号： H01P3/085 , H01B7/0861 , H05K1/0218 , H05K1/0313 , H05K1/0393 , Y10T428/2933
摘要： A flexible strip transmission line is disclosed. The flexible strip transmission lines consists of a plurality of flexible layers enabling the transmission line to be folded or repeatably bent. The central layer consists of a flexible dielectric material. On opposing side of the dielectric layer are first and second flexible ground planes formed of a metalized fabric. The flexible ground plane layers are bonded to the dielectric material using a bonding agent such as silicone adhesive. An abrasion resistant material is connected to the outer surface of the flexible ground plane layers to provide a protective exterior shell.
摘要翻译： 公开了一种柔性条传输线。 柔性带传输线由多个柔性层组成，使得传输线能够被折叠或可重复地弯曲。 中心层由柔性电介质材料组成。 在电介质层的相对侧是由金属化织物形成的第一和第二柔性接地层。 使用诸如硅酮粘合剂的粘结剂将柔性接地层与接合材料接合。 耐磨材料连接到柔性接地平面层的外表面以提供保护外壳。
-
8.发明授权公开(公告)号：US06184570B2
公开(公告)日：2001-02-06
申请号：US09428861
申请日：1999-10-28
IPC分类号： H01L2906
CPC分类号： H01L23/562 , H01L29/0657 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16 , H01L2924/01067 , H01L2924/09701 , H01L2924/10158 , H01L2924/10253 , H01L2924/00 , H01L2224/05541 , H01L2224/05005
摘要： An integrated circuit includes an integrated circuit die having first and second opposing faces, a plurality of spaced apart bonding regions on the first face, and at least one groove in the second face. The at least one groove allows the die to flex upon application of stress to the bonding regions due to thermal cycling of the integrated circuit die, compared to absence of the at least one groove. Preferably, multiple grooves are provided, a respective one of which extends between a respective pair of adjacent spaced apart bonding regions. The grooves may be fabricated by sawing and/or etching the grooves in the second face. The sawing and/or etching may be performed at the wafer stage, before the integrated circuit dies are singulated. Alternatively, the sawing and/or etching may take place after the integrated circuit dies are singulated from the wafer.
摘要翻译： 集成电路包括具有第一和第二相对面的集成电路管芯，在第一面上的多个间隔开的接合区域和第二面中的至少一个凹槽。 与没有至少一个凹槽相比，至少一个凹槽允许模具由于集成电路模具的热循环而在施加作用于结合区域时弯曲。 优选地，设置多个凹槽，各个凹槽在相应的一对相邻间隔开的结合区域之间延伸。 可以通过锯切和/或蚀刻第二面中的凹槽来制造凹槽。 在集成电路管芯被切割之前，可以在晶片台执行锯切和/或蚀刻。 或者，锯切和/或蚀刻可以在从晶片分离集成电路管芯之后进行。
-
公开(公告)号：US06232924B1
公开(公告)日：2001-05-15
申请号：US09217048
申请日：1998-12-21
IPC分类号： H01Q124
CPC分类号： H04M1/0216 , H01Q1/084 , H01Q1/242 , H01Q1/245 , H04M1/0247
摘要： Flat blade antenna and flip mounting structures and associated methods include biasing the flat blade antenna to travel beyond a predetermined angle of rotation to separate from the flip in the open position. The flat blade antenna and flip are mounted to the radiotelephone via dual hinges and have low turning force components which provide a predetermined force vector to facilitate the blade antenna opening to a desired operative position. The flat blade antenna rotates separate from the flip. The flat blade antenna can open to an angular position greater than the adjacently mounted flip. The biasing mounting configuration provides turning forces which facilitates both the opening and closing of the antenna.
摘要翻译： 扁平叶片天线和翻转安装结构以及相关的方法包括偏置扁平叶片天线以超出预定旋转角度以在打开位置与翻盖分离。 扁平叶片天线和翻盖通过双铰链安装到无线电话机，并且具有低转向力分量，其提供预定的力矢量以便于将叶片天线打开到期望的操作位置。 扁平刀片天线与翻盖分开旋转。 扁平刀片天线可以打开到大于相邻安装的翻盖的角位置。 偏置安装配置提供有助于天线的打开和关闭的转动力。
-
公开(公告)号：US06490435B1
公开(公告)日：2002-12-03
申请号：US08586432
申请日：1996-01-16
IPC分类号： H04B138
CPC分类号： H04B1/3833 , H01Q1/243 , H01Q1/244
摘要： A flip cover and antenna assembly for a portable phone is disclosed as being rotatably coupled to a main housing thereof. The flip cover and antenna assembly includes a first flip cover housing, a second flip cover housing matable with the first flip cover housing, and an antenna element positioned between the first and second flip cover housings. The antenna element further includes a ground plane bonded to the ground plane first surface. A dielectric foam is positioned over any remaining area of the ground plane first surface. The first and second flip cover housings have flanges which extend from at least a portion thereof to wrap around corresponding edges of the main housing, which enables extensions of the ground plane to be provided conforming to the flanges. The ground plane may also be patterned in order to control the radiation pattern thereof and limit any interference from other components of the portable phone. The flip cover and antenna assembly may also include a second antenna in the form of a printed circuit antenna or a monopole antenna.
摘要翻译： 公开了一种用于便携式电话的翻盖和天线组件，其可旋转地联接到其主壳体。 翻盖和天线组件包括第一翻盖壳体，可与第一翻盖壳体配合的第二翻盖壳体和位于第一和第二翻盖壳体之间的天线元件。 天线元件还包括结合到接地平面第一表面的接地平面。 电介质泡沫被定位在接地平面第一表面的任何剩余区域上方。 第一和第二翻盖壳体具有从其至少一部分延伸以覆盖主壳体的相应边缘的凸缘，这使得能够使接地平面的延伸部与凸缘相符合。 接地平面也可以被图案化以便控制其辐射图案，并且限制来自便携式电话的其它部件的任何干扰。 翻盖和天线组件还可以包括印刷电路天线或单极天线形式的第二天线。
-
-
-
-
-
-
-
-
-
搜索结果
21 条记录 (耗时 0.028 秒)
