Removable/disposable apparatus for MEMS particle sorting device
    1.
    发明申请
    Removable/disposable apparatus for MEMS particle sorting device 审中-公开
    MEMS粒子分选装置的可移动/一次性装置

    公开(公告)号:US20120164718A1

    公开(公告)日:2012-06-28

    申请号:US12149637

    申请日:2008-05-06

    IPC分类号: C12M1/34 B23P11/00 H05K13/00

    摘要: A micromechanical particle sorting system uses a removable/disposable apparatus which may include a compressible device, a filter apparatus and a cell sorter chip assembly. The chip assembly may include a tubing strain relief manifold and a microfabricated cell sorting chip. The chip assembly may be detachable from the filter apparatus in order to mount the MEMS particle sorting chip adjacent to a force-generating apparatus which resides with the particle sorting system. A disturbance device installed in the particle sorting system may interact with a transducer on the removable/disposable apparatus to reduce clogging of the flow through the system. Using this removable/disposable apparatus, when the sample is changed, the entire apparatus can be thrown away with minimal expense and system down time.

    摘要翻译: 微机械粒子分选系统使用可移动/一次性装置,其可以包括可压缩装置,过滤装置和细胞分选机芯片组件。 芯片组件可以包括管应变消除歧管和微细胞分选芯片。 芯片组件可以与过滤装置分离,以便将MEMS颗粒分选芯片与位于颗粒分选系统的力产生装置相邻。 安装在颗粒分选系统中的干扰装置可以与可移动/一次性装置上的换能器相互作用,以减少通过系统的流动的堵塞。 使用这种可移动/一次性装置,当样品改变时,整个设备可以以最小的费用和系统停机时间被丢弃。

    Plating process and apparatus for through wafer features
    5.
    发明授权
    Plating process and apparatus for through wafer features 有权
    用于通过晶片特征的电镀工艺和设备

    公开(公告)号:US08343791B2

    公开(公告)日:2013-01-01

    申请号:US12923693

    申请日:2010-10-05

    IPC分类号: H01L21/00

    摘要: A method for forming through features in a substrate uses a seed layer deposited over a first substrate, and a second substrate bonded to the seed layer. The features may be formed in the first substrate, by plating a conductive filler material onto the seed layer. The first substrate and the second substrate may then be bonded to a third substrate, and the second substrate is removed, leaving through features and first substrate adhered to the third substrate. The through features may provide at least one of electrical access and motion to a plurality of devices formed on the third substrate, or may impart movement to a moveable feature on the first substrate, wherein the third substrate supports the first substrate after removal of the second substrate.

    摘要翻译: 用于在衬底中形成穿透特征的方法使用沉积在第一衬底上的种子层和与种子层结合的第二衬底。 特征可以在第一基板中形成,通过将导电填料材料镀在种子层上。 然后可以将第一衬底和第二衬底接合到第三衬底,并且去除第二衬底,留下通过特征和粘附到第三衬底的第一衬底。 穿透特征可以向形成在第三基底上的多个装置提供电通路和运动中的至少一个,或者可以将运动赋予第一基板上的可移动特征,其中第三基板在移除第二基板之后支撑第一基板 基质。

    Plating process and apparatus for through wafer features
    9.
    发明申请
    Plating process and apparatus for through wafer features 有权
    用于通过晶片特征的电镀工艺和设备

    公开(公告)号:US20120080762A1

    公开(公告)日:2012-04-05

    申请号:US12923693

    申请日:2010-10-05

    IPC分类号: H01L29/84 B32B37/00 H01L21/18

    摘要: A method for forming through features in a substrate uses a seed layer deposited over a first substrate, and a second substrate bonded to the seed layer. The features may be formed in the first substrate, by plating a conductive filler material onto the seed layer. The first substrate and the second substrate may then be bonded to a third substrate, and the second substrate is removed, leaving through features and first substrate adhered to the third substrate. The through features may provide at least one of electrical access and motion to a plurality of devices formed on the third substrate, or may impart movement to a moveable feature on the first substrate, wherein the third substrate supports the first substrate after removal of the second substrate.

    摘要翻译: 用于在衬底中形成穿透特征的方法使用沉积在第一衬底上的种子层和与种子层结合的第二衬底。 特征可以在第一基板中形成,通过将导电填料材料镀在种子层上。 然后可以将第一衬底和第二衬底接合到第三衬底,并且去除第二衬底,留下通过特征和粘附到第三衬底的第一衬底。 穿透特征可以向形成在第三基底上的多个装置提供电通路和运动中的至少一个,或者可以将运动赋予第一基板上的可移动特征,其中第三基板在移除第二基板之后支撑第一基板 基质。