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1.发明授权Method and structure for multi-core chip product test and selective voltage binning disposition 有权多核芯片产品测试和选择性电压组合配置的方法和结构公开(公告)号：US09557378B2
公开(公告)日：2017-01-31
申请号：US13553986
申请日：2012-07-20
IPC分类号： H01L21/66 , G01R31/02 , G06F19/00 , G01R31/317 , G06F1/32
CPC分类号： G01R31/31718 , G01R31/31725 , G06F1/32
摘要： Operating speeds of integrated circuit devices are tested to establish maximum and minimum frequency at maximum and minimum voltage. The devices are sorted into relatively-slow and relatively-fast devices to classify the devices into different voltage bins. A bin-specific voltage limit is established for each of the voltage bins needed for core performance at system use conditions. The bin-specific voltage limit is compared to core minimum chip-level functionality voltage at system maximum and minimum frequency specifications. The method correlates system design evaluation of design maximum and minimum frequency at design maximum and minimum voltage conditions with evaluation of tested maximum and minimum frequency at tested maximum and minimum voltage conditions. A chip-specific functionality voltage limit is established for the device. Initial system voltage for all devices from a voltage bin is set at a greater of the bin-specific voltage limit and the chip-specific functionality voltage limit consistent with the evaluation conditions.
摘要翻译： 测试集成电路器件的工作速度，以在最大和最小电压下建立最大和最小频率。 将器件分类为相对较慢且相对较快的器件，以将器件分类到不同的电压仓。 对于在系统使用条件下核心性能所需的每个电压箱，建立了一个特定于特定电压限制。 特定于箱体的电压限制与系统最大和最小频率规格下的核心最小芯片级功能电压进行比较。 该方法在设计最大和最小电压条件下将设计最大和最小频率的系统设计评估与测试的最大和最小电压条件下的最大和最小频率进行了评估。 为器件建立芯片专用功能电压限制。 来自电压仓的所有器件的初始系统电压设置在特定于器件的电压限制和芯片专用功能电压限制的更大值与评估条件一致。
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2.发明授权Integrated circuit product yield optimization using the results of performance path testing 有权集成电路产品产量优化使用性能路径测试的结果公开(公告)号：US09058034B2
公开(公告)日：2015-06-16
申请号：US13570285
申请日：2012-08-09
IPC分类号： G06F17/50 , G05B19/418
CPC分类号： G05B19/41875 , G05B2219/32182 , G05B2219/32187 , G05B2219/32208 , G05B2219/37224 , Y02P80/30 , Y02P90/22
摘要： Disclosed are embodiments of a method, system and computer program product for optimizing integrated circuit product yield by re-centering the manufacturing line and, optionally, adjusting wafer-level chip dispositioning rules based on the results of post-manufacture (e.g., wafer-level or module-level) performance path testing. In the embodiments, a correlation is made between in-line parameter measurements and performance measurements acquired during the post-manufacture performance path testing. Then, based on this correlation, the manufacturing line can be re-centered. Optionally, an additional correlation is made between performance measurements acquired during wafer-level performance testing and performance measurements acquired particularly during module-level performance path testing and, based on this additional correlation, adjustments can be made to the wafer-level chip dispositioning rules to further minimize yield loss.
摘要翻译： 公开了用于通过使生产线重新对中来优化集成电路产品产量的方法，系统和计算机程序产品的实施例，并且可选地，基于后期制造的结果调整晶片级芯片布置规则（例如，晶片级 或模块级）性能路径测试。 在实施例中，在后续制造性能路径测试期间获得的在线参数测量和性能测量之间进行相关。 然后，基于这种相关性，生产线可以重新居中。 可选地，在晶片级性能测试期间获得的性能测量和特别在模块级性能路径测试期间获得的性能测量之间进行附加的相关性，并且基于该附加相关性，可以对晶片级芯片布置规则进行调整 进一步降低产量损失。
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3.发明申请DISPOSITION OF INTEGRATED CIRCUITS USING PERFORMANCE SORT RING OSCILLATOR AND PERFORMANCE PATH TESTING 有权使用性能排序振荡器和性能路径测试处理集成电路公开(公告)号：US20130125076A1
公开(公告)日：2013-05-16
申请号：US13294220
申请日：2011-11-11
IPC分类号： G06F17/50
CPC分类号： G01R31/3016 , G01R31/31725
摘要： A method and system for dispositioning integrated circuit chips. The method includes performing a performance path test on an integrated circuit chip having one or more clock domains, the performance path test based on applying test patterns to selected sensitizable data paths of the integrated circuit chip at different clock frequencies; and dispositioning the integrated circuit chip based on results of the performance path test.
摘要翻译： 一种配置集成电路芯片的方法和系统。 该方法包括对具有一个或多个时钟域的集成电路芯片执行性能路径测试，该性能路径测试基于将测试图案应用于集成电路芯片的不同时钟频率的选择的可敏化数据路径; 并且基于性能路径测试的结果来布置集成电路芯片。
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4.发明申请INTEGRATED CIRCUIT PRODUCT YIELD OPTIMIZATION USING THE RESULTS OF PERFORMANCE PATH TESTING 有权使用性能路径测试结果的集成电路产品线优化公开(公告)号：US20140046466A1
公开(公告)日：2014-02-13
申请号：US13570285
申请日：2012-08-09
IPC分类号： G05B19/18
CPC分类号： G05B19/41875 , G05B2219/32182 , G05B2219/32187 , G05B2219/32208 , G05B2219/37224 , Y02P80/30 , Y02P90/22
摘要： Disclosed are embodiments of a method, system and computer program product for optimizing integrated circuit product yield by re-centering the manufacturing line and, optionally, adjusting wafer-level chip dispositioning rules based on the results of post-manufacture (e.g., wafer-level or module-level) performance path testing. In the embodiments, a correlation is made between in-line parameter measurements and performance measurements acquired during the post-manufacture performance path testing. Then, based on this correlation, the manufacturing line can be re-centered. Optionally, an additional correlation is made between performance measurements acquired during wafer-level performance testing and performance measurements acquired particularly during module-level performance path testing and, based on this additional correlation, adjustments can be made to the wafer-level chip dispositioning rules to further minimize yield loss.
摘要翻译： 公开了用于通过使生产线重新对中来优化集成电路产品产量的方法，系统和计算机程序产品的实施例，并且可选地，基于后期制造的结果调整晶片级芯片布置规则（例如，晶片级 或模块级）性能路径测试。 在实施例中，在后续制造性能路径测试期间获得的在线参数测量和性能测量之间进行相关。 然后，基于这种相关性，生产线可以重新居中。 可选地，在晶片级性能测试期间获得的性能测量和特别在模块级性能路径测试期间获得的性能测量之间进行附加的相关性，并且基于该附加相关性，可以对晶片级芯片布置规则进行调整 进一步降低产量损失。
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5.发明授权System yield optimization using the results of integrated circuit chip performance path testing 有权系统产量优化采用集成电路芯片性能路径测试的结果公开(公告)号：US08539429B1
公开(公告)日：2013-09-17
申请号：US13572954
申请日：2012-08-13
IPC分类号： G06F17/50
CPC分类号： G01R31/31718 , G01R31/31725
摘要： Disclosed are embodiments of a method, system and computer program for optimizing system yield based on the results of post-manufacture integrated circuit (IC) chip performance path testing. In these embodiments, a correlation is made between IC chip performance measurements, which were acquired from IC chips specifically during post-manufacture (i.e., wafer-level or module-level) performance path testing, and system performance measurements, which were acquired from systems that incorporate those IC chips previously subjected to performance path testing. Based on this correlation and a target system performance value, a post-manufacture (i.e., wafer-level or module-level) chip dispositioning rule can be adjusted to optimize system yield (i.e., to ensure that subsequently manufactured systems which incorporate the IC chip meet the target system performance value). Optionally, simulation of such processing can be performed during design of the IC chip for incorporation into the system in order establish the initial chip dispositioning rule in the first place.
摘要翻译： 公开了一种基于后制造集成电路（IC）芯片性能路径测试的结果来优化系统产量的方法，系统和计算机程序的实施例。 在这些实施例中，在IC芯片特性在后期制造（即晶片级或模块级）性能路径测试中获得的IC芯片性能测量和从系统获取的系统性能测量之间进行相关 其中包含先前经过性能路径测试的那些IC芯片。 基于这种相关性和目标系统性能值，可以调整后制造（即晶片级或模块级）芯片布置规则以优化系统产量（即，确保随后制造的并入IC芯片的系统 满足目标系统的性能价值）。 可选地，可以在用于结合到系统中的IC芯片的设计期间执行这种处理的模拟，以便首先建立初始的芯片布置规则。
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6.发明授权Test path selection and test program generation for performance testing integrated circuit chips 有权测试路径选择和测试程序生成用于性能测试集成电路芯片公开(公告)号：US08543966B2
公开(公告)日：2013-09-24
申请号：US13294210
申请日：2011-11-11
CPC分类号： G01R31/31726 , G01R31/318541
摘要： A method of test path selection and test program generation for performance testing integrated circuits. The method includes identifying clock domains having multiple data paths of an integrated circuit design having multiple clock domains; selecting, from the data paths, critical paths for each clock domain of the multiple clock domains; using a computer, for each clock domain of the multiple clock domain, selecting the sensitizable paths of the critical paths; for each clock domain of the multiple clock domain, selecting test paths from the sensitizable critical paths; and using a computer, creating a test program to performance test the test paths.
摘要翻译： 一种用于性能测试集成电路的测试路径选择和测试程序生成的方法。 该方法包括识别具有具有多个时钟域的集成电路设计的多个数据路径的时钟域; 从数据路径中选择多个时钟域的每个时钟域的关键路径; 使用计算机，对于多个时钟域的每个时钟域，选择关键路径的可敏化路径; 对于多个时钟域的每个时钟域，从敏感关键路径中选择测试路径; 并使用计算机，创建测试程序来测试测试路径。
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7.发明授权Disposition of integrated circuits using performance sort ring oscillator and performance path testing 有权使用性能分类环形振荡器和性能路径测试对集成电路进行处理公开(公告)号：US08490040B2
公开(公告)日：2013-07-16
申请号：US13294220
申请日：2011-11-11
CPC分类号： G01R31/3016 , G01R31/31725
摘要： A method and system for dispositioning integrated circuit chips. The method includes performing a performance path test on an integrated circuit chip having one or more clock domains, the performance path test based on applying test patterns to selected sensitizable data paths of the integrated circuit chip at different clock frequencies; and dispositioning the integrated circuit chip based on results of the performance path test.
摘要翻译： 一种配置集成电路芯片的方法和系统。 该方法包括对具有一个或多个时钟域的集成电路芯片执行性能路径测试，该性能路径测试基于将测试图案应用于集成电路芯片的不同时钟频率的选择的可敏化数据路径; 并且基于性能路径测试的结果来布置集成电路芯片。
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8.发明申请TEST PATH SELECTION AND TEST PROGRAM GENERATION FOR PERFORMANCE TESTING INTEGRATED CIRCUIT CHIPS 有权性能测试集成电路卡的测试路径选择和测试程序生成公开(公告)号：US20130125073A1
公开(公告)日：2013-05-16
申请号：US13294210
申请日：2011-11-11
IPC分类号： G06F17/50
CPC分类号： G01R31/31726 , G01R31/318541
摘要： A method of test path selection and test program generation for performance testing integrated circuits. The method includes identifying clock domains having multiple data paths of an integrated circuit design having multiple clock domains; selecting, from the data paths, critical paths for each clock domain of the multiple clock domains; using a computer, for each clock domain of the multiple clock domain, selecting the sensitizable paths of the critical paths; for each clock domain of the multiple clock domain, selecting test paths from the sensitizable critical paths; and using a computer, creating a test program to performance test the test paths
摘要翻译： 一种用于性能测试集成电路的测试路径选择和测试程序生成的方法。 该方法包括识别具有具有多个时钟域的集成电路设计的多个数据路径的时钟域; 从数据路径中选择多个时钟域的每个时钟域的关键路径; 使用计算机，对于多个时钟域的每个时钟域，选择关键路径的可敏化路径; 对于多个时钟域的每个时钟域，从敏感关键路径中选择测试路径; 并使用计算机，创建测试程序来测试测试路径
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公开(公告)号：US09429619B2
公开(公告)日：2016-08-30
申请号：US13564337
申请日：2012-08-01
IPC分类号： G06F19/00 , G01R31/28 , G05B19/418 , G01R31/317
CPC分类号： G01R31/2894 , G01R31/2855 , G01R31/2868 , G01R31/287 , G01R31/2879 , G01R31/31718 , G05B19/41875 , Y02P90/14 , Y02P90/265
摘要： Methods and systems optimize power usage in an integrated circuit design by sorting the integrated circuit devices after manufacture into relatively slow integrated circuit devices and relatively fast integrated circuit devices to classify the integrated circuit devices into different voltage bins. The methods and systems establish a bin-specific reliability testing processes for each of the voltage bins and test the integrated circuit devices using a tester. This allows the methods and systems to identify as defective ones of the integrated circuit devices that fail the bin-specific integrated circuit reliability testing processes of a corresponding voltage bin. The methods and systems remove the defective ones of the integrated circuit devices to allow only non-defective integrated circuit devices to remain and supply the non-defective integrated circuit devices to a customer.
摘要翻译： 方法和系统通过将制造后的集成电路器件分类为相对较慢的集成电路器件和相对较快的集成电路器件来将集成电路器件分类到不同的电压仓中来优化集成电路设计中的功率利用。 方法和系统为每个电压仓建立一个二进制特定的可靠性测试过程，并使用测试仪测试集成电路器件。 这允许方法和系统将不合格的集成电路设备中的缺陷识别为相应电压箱的专用集成电路可靠性测试过程。 所述方法和系统移除集成电路器件中的有缺陷的集成电路器件，以便只允许无故障的集成电路器件保持并向客户提供无缺陷的集成电路器件。
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10.发明授权公开(公告)号：US08234594B2
公开(公告)日：2012-07-31
申请号：US11552225
申请日：2006-10-24
申请人： Brent A. Anderson , Jeanne P. Bickford , Markus Buehler , Jason D. Hibbeler , Juergen Koehl , Edward J. Nowak
发明人： Brent A. Anderson , Jeanne P. Bickford , Markus Buehler , Jason D. Hibbeler , Juergen Koehl , Edward J. Nowak
CPC分类号： H01L23/528 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit including a first wire of a first level of wiring tracks, a second wire of a second level of wiring tracks, a third wire of a third level of wiring tracks, and a fourth wire located at a first distance from the second wire in the second level of wiring tracks. A first via connects the first and second wires at a first location of the second wire. A second via connects the second and third wires at the first location, the second via is approximately axially aligned with the first via. A third via connecting the third and fourth wires at a second location of the fourth wire. A fourth via connecting the first and fourth wires at the second location, the fourth via is approximately axially aligned with the third via. The second, third, and fourth vias, and the third and fourth wires form a path between the first and second wires redundant to the first via.
摘要翻译： 一种集成电路，包括第一级布线轨道的第一线，第二级布线轨道的第二线，第三级布线轨道的第三线和位于距离第二线的第一距离的第四线 在第二级线路上。 第一通孔在第二导线的第一位置连接第一和第二导线。 第二通孔在第一位置处连接第二和第三导线，第二通孔大致轴向对准第一通孔。 第三通过在第四线的第二位置连接第三和第四导线。 在第二位置连接第一和第四导线的第四通孔，第四通孔与第三通孔大致轴向对齐。 第二，第三和第四通孔以及第三和第四导线形成第一和第二导线之间的路径，该路径对于第一通孔是冗余的。
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