Backing for adhesive tape with thermal resistance

    公开(公告)号:US12195652B2

    公开(公告)日:2025-01-14

    申请号:US17521324

    申请日:2021-11-08

    Abstract: Backing films for adhesive tapes are presented, as well as adhesive tapes comprising such backing films, which may include tapes used in construction such as seam sealing tapes, roofing tapes, and flashing tapes. The backing film comprises a core layer, a first skin layer, and optionally a second skin layer, where the backing film has a coefficient of thermal expansion of less than 90 ppm/° C. measured in at least one direction within the plane of the film, and, in some embodiments, a Young's modulus of less than 550 MPa as measured in at least one direction. In some embodiments, the backing film has a coefficient of thermal expansion of not more than 91.8 ppm/° C. and a Young's modulus of not more than 540 MPa as measured in any direction within the plane of the film. In some embodiments, the core layer comprises a polyolefin, and skin layers comprise a thermoplastic elastomer.

    MUSCLE OR JOINT SUPPORT ARTICLE WITH BUMP
    8.
    发明申请

    公开(公告)号:US20190314187A1

    公开(公告)日:2019-10-17

    申请号:US16465809

    申请日:2017-11-29

    Abstract: The present application generally relates to support articles and methods of making and using them. The support articles of the present disclosure provide compression and/or stabilization of sore joints, tendons, or muscles. In some embodiments, the support articles include a bump protruding from at least a portion of the backing of the article that can be placed directly adjacent to a sore or affected area to provide enhanced compression or relief.

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