摘要:
This storage system supplies, to a plurality of computers, a plurality of duplicate volumes (CVOLs) (corresponding to duplicates of a master volume (MVOL) upon which is stored an electronic object (EO) that is common to the plurality of computers). Both the MVOL and the CVOLS are virtual logical volumes that follow sync provisioning. In the plurality of CVOLs, a plurality of physical regions that are allocated to the MVOL (i.e. regions in which the electronic object is stored) (PAs) are allocated. A storage, when writing an electronic module (EM) to which the EO is applied to the first CVOL, copies data within a first PA that is allocated to the virtual region (VA) that is the write destination to a second PA, writes the EM to the second PA, and moreover allocates the second PA to a VA of the write destination, instead of the first PA. And the storage allocates the second PA to a VA within the second CVOL corresponding to the VA of the write destination, instead of the PA that is allocated to that VA.
摘要:
This storage system supplies, to a plurality of computers, a plurality of duplicate volumes (CVOLs) (corresponding to duplicates of a master volume (MVOL) upon which is stored an electronic object (EO) that is common to the plurality of computers). Both the MVOL and the CVOLS are virtual logical volumes that follow sync provisioning. In the plurality of CVOLs, a plurality of physical regions that are allocated to the MVOL (i.e. regions in which the electronic object is stored) (PAs) are allocated. A storage, when writing an electronic module (EM) to which the EO is applied to the first CVOL, copies data within a first PA that is allocated to the virtual region (VA) that is the write destination to a second PA, writes the EM to the second PA, and moreover allocates the second PA to a VA of the write destination, instead of the first PA. And the storage allocates the second PA to a VA within the second CVOL corresponding to the VA of the write destination, instead of the PA that is allocated to that VA.
摘要:
Disclosed are an exposure method and a method of manufacturing a mask and a semiconductor device using the same, which minimize time taken by mask data preparation (MDP) to optimize a total exposure process and enhance a quality of a pattern by using an inverse solution concept, based on a multi-beam mask writer. The exposure method includes receiving mask tape output (MTO) design data obtained through optical proximity correction (OPC), preparing mask data, including a job deck, for the MTO design data without a data format conversion, performing complex correction, including proximity effect correction (PEC) of an error caused by an e-beam proximity effect and mask process correction (MPC) of an error caused by an exposure process, on the mask data, generating pixel data, based on data for which the complex correction is performed, and performing e-beam writing on a substrate for a mask, based on the pixel data.
摘要:
An optical device for splitting a single beam to a plurality of beams and an exposure apparatus including the optical device are disclosed. The optical device includes a first DOE lens array including a plurality of first diffractive optical element (DOE) lenses that are two-dimensionally arranged on a first plane and a second lens array including a plurality of second DOE lenses arranged on a second plane parallel to the first plane so as to respectively correspond to the plurality of first DOE lenses. The first DOE lens array splits a first parallel beam into a plurality of second beams by condensing the first parallel beam and the second DOE lens array modifies the plurality of second beams into a plurality of third beams.
摘要:
The above objective are accomplished by providing a filter medium for use in manufacturing of hydraulic fluid and air filters comprising: an upstream layer comprised of nonwoven fiber having a denier between about 5.0 and 7.0 and a weight of between about 3.0 and 5.0 ounces a scrim and a cap layer comprising a fiber having a denier between about 0.1 and 5.0 denier and a weight between about 2.0 and 4.0 ounces carried by said upstream layer and disposed downstream from said upstream layer. The upstream layer, scrim and cap layer can have a weight of about 4.0 ounces, 2.0 ounces and 3.0 ounces respectively. A downstream layer can be disposed between said upstream layer and said cap layer.
摘要:
A method of manufacturing semiconductor devices is disclosed. The method includes determining fractured shots that do not overlap each other based on a final pattern; determining overlapping shots that are shots that overlap each other based on the final pattern; generating area difference data by comparing the areas of the overlapping shots and the fractured shots with each other; calculating a radiation influenced pattern based on the area difference data; and correcting the overlapping shots based on the radiation influenced pattern.
摘要:
A semiconductor device includes a plurality of lower electrodes on a substrate, with each of the lower electrodes extending in a height direction from the substrate and including sidewalls, the lower electrodes being spaced apart from each other in a first direction and in a second direction, a plurality of first supporting layer patterns contacting the sidewalls of the lower electrodes, the first supporting layer patterns extending in the first direction between ones of the lower electrodes adjacent in the second direction, a plurality of second supporting layer patterns contacting the sidewalls of the lower electrodes, the second supporting layer pattern extending in the second direction between ones of the lower electrodes adjacent in the first direction, the plurality of second supporting layer patterns being spaced apart from the plurality of first supporting layer patterns in the height direction.
摘要:
In a method of forming a reticle and electron beam exposure system, first electron beams are irradiated onto a first region of a blank reticle having a light shielding layer and a photosensitive layer, to form first shot patterns. Second electron beams having a cross-sectional area larger than the first electron beams are irradiated onto a second region of the blank reticle. The photosensitive layer is developed to form first and second mask patterns at the first and second regions, respectively. The light shielding layer is etched off using the first and second mask patterns as an etching mask, thereby forming the mother pattern including a first pattern in the first region and a second pattern in the second region. Accordingly, the enlargement of the second electron beams reduces the scan time for the blank reticle, thereby reducing the process time.
摘要:
A semiconductor device having sense amplifiers and an electronic system employing the same are provided. The semiconductor device includes first sense amplifier blocks arranged in a row direction on a substrate and spaced apart from each other by a first distance. A second sense amplifier block spaced apart from the first sense amplifier blocks by a second distance greater than the first distance is provided. A plurality of cell array blocks arranged in the row direction on the substrate is provided. Each of the first and second sense amplifier blocks is disposed between the cell array blocks, and each of the cell array blocks includes a plurality of memory cells.