Abstract:
A photoacoustic medical imaging device may include a substrate, an array of ultrasonic transducers on the substrate, at least one groove etched on the substrate, at least one optical fiber, and at least one facet. Each optical fiber is disposed in one of the grooves. Each facet is etched in one of the grooves and coated with a layer of metal having high infrared reflectivity. Each optical fiber is configured to guide infrared light from a light source through the fiber and toward the respective facet. The facet is configured to reflect the infrared light toward a target.
Abstract:
A memory cell uses a pair of cantilevers to store a bit of information. Changing the relative position of the cantilevers determines whether they are electrically conducting or not. The on and off state of this mechanical latch is switched by using, for example, electrostatic, electromagnetic or thermal forces applied sequentially on the two cantilevers to change their relative position. The amount of power required to change the state of the cell is reduced by supporting at least one of the cantilevers with at least one lateral projection that is placed in torsion during cantilever displacement. After a bit of data is written, the cantilevers are locked by mechanical forces inherent in the cantilevers and will not change state unless a sequential electrical writing signal is applied. The sequential nature of the required writing signal makes inadvertent, radiation or noise related data corruption unlikely.
Abstract:
Fluid ejection devices include a substrate having a cavity, a counter electrode formed on the substrate, a actuator membrane formed on the substrate, a roof layer formed on the substrate and a nozzle formed in the roof layer. Methods for forming fluid ejection devices include forming a cavity in a substrate, forming a counter electrode on the substrate, forming a actuator membrane on the substrate, forming a roof layer on the substrate and forming a nozzle in the roof layer.
Abstract:
A device structure is defined in a single-crystal silicon (SCS) layer separated by an insulator layer, such as an oxide layer, from a handle wafer. The SCS can be attached to the insulator by wafer bonding, and is selectively etched, as by photolithographic patterning and dry etching. A sacrificial oxide layer can be deposited on the etched SCS, on which polysilicon can be deposited. A protective oxide layer is deposited, and CMOS circuitry and sensors are integrated. Silicon microstructures with sensors connected to CMOS circuitry are released. In addition, holes can be etched through the sacrificial oxide layer, sacrificial oxide can be deposited on the etched SCS, polysilicon can be deposited on the sacrificial oxide, PSG can be deposited on the polysilicon layer, which both can then be patterned.
Abstract:
A micro spectrophotometer is monolithically constructed on a silicon substrate. The spectrophotometer includes a concave grating, which is used for dispersing optical waves as well as focusing reflected light onto a photodiode array sited on a silicon bridge. The silicon bridge is bent 90° from the surface of the silicon substrate in order to orthogonally intersect the output light from the grating. A precision notch is defined in the silicon substrate for coupling to an optical input fiber. Signal processing circuitry is etched on the substrate using conventional CMOS processes for initial processing of information received from the photodiode array.
Abstract:
Method and device for forming a membrane includes providing a glass substrate, and depositing a thin layer of chromium on the glass substrate. The thin layer of chromium is patterned to form a deflection electrode and interconnect leads. A sacrificial layer of aluminum is deposited on top of the patterned chromium layer, then the sacrificial layer is patterned to define anchor regions. On top of the sacrificial layer, a thick layer of chromium is deposited, and the thick layer of chromium is patterned to form a membrane. The sacrificial layer is then etched to release the membrane.
Abstract:
Fluid ejection devices include a substrate having a cavity, a counter electrode formed on the substrate, a actuator membrane formed on the substrate, a roof layer formed on the substrate and a nozzle formed in the roof layer. Methods for forming fluid ejection devices include forming a cavity in a substrate, forming a counter electrode on the substrate, forming a actuator membrane on the substrate, forming a roof layer on the substrate and forming a nozzle in the roof layer.
Abstract:
A medical device may include a micro-machined substrate, at least one thermo-electric assembly associated with the substrate, and a cooling system configured to configured to remove heat from the a region of the substrate proximal the substrate. According to various aspects, a method of clearing plaque from a blood vessel may include implanting a micro-device in the blood vessel, wherein the micro-device may include at least one ultrasonic transducer, and operably controlling the micro-device to emit high frequency ultrasonic waves for breaking up said plaque.
Abstract:
A heterogeneous device comprises a substrate and a plurality of heterogeneous circuit devices defined in the substrate. In embodiments, a plurality of heterogeneous circuit devices are integrated by successively masking and ion implanting the substrate. The heterogeneous device may further comprise at least one microelectromechanical system-based element and/or at least one photodiode. In embodiments, the heterogeneous circuit devices comprise at least one CMOS transistor and at least one DMOS transistor. In embodiments, the substrate comprises a layer of silicon or a layer of p-type silicon. In other embodiments, the substrate comprises a silicon-on-insulator wafer comprising a single-crystal-silicon layer or a single-crystal-P-silicon layer, a substrate and an insulator layer therebetween.
Abstract:
A silicon demultiplexer, a plurality of silicon switches and a silicon multiplexer are monolithically integrated on a single silicon chip. In embodiments, the silicon demultiplexer and the silicon multiplexer each comprise a diffraction grating. In other embodiments, the silicon demultiplexer and the silicon multiplexer each comprise an arrayed waveguide grating. In various exemplary embodiments, the silicon optical switches comprise optical switches, micromachined torsion mirrors, electrostatic micromirrors, and/or tilting micromirrors. In use, an optical signal comprising a multiplexed data stream is input into the monolithic reconfigurable optical multiplexer. An optical signal that comprises a modified multiplexed data stream may be output. In an optical communications system, the silicon demultiplexer communicates with an input optical fiber, the plurality of silicon optical switches communicate between the silicon demultiplexer and the silicon multiplexer, and the silicon multiplexer communicates with an output optical fiber. In various embodiments, the optical switches are fabricated to be self-aligned.